公开(公告)号：EP3209099A1

公开(公告)日：2017-08-23

申请号：EP17157338.9

申请日：2017-02-22

Applicant: ITZ Innovations- und Technologiezentrum GmbH

Inventor： MARQUAS, Karsten ,  DREES, Frank

IPC: H05K3/02 ,  H01L25/13 ,  F21S4/24 ,  H05K3/00

CPC classification number: H05K3/027 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K3/0014 ,  H05K3/022 ,  H05K3/4084 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2203/107

Abstract: Die Erfindung betrifft ein Verfahren zur Herstellung einer Leuchtenkomponente ausgebildet zur Aufnahme einer einen Lichtstrom ausstrahlenden LED 10. Die LED 10 ist auf einem flächigen, teilweise leitfähigen Leiterelement angeordnet.
Um die Durchlaufzeiten der Herstellung einer Leuchtenkomponente zur reduzieren wird erfindungsgemäß ein Herstellungsverfahren vorgeschlagen, welches die Verfahrensschritte aufweist : Anordnen und Vorfixieren eines Leiterstreifens 2 in einer Sollposition in einem Spritzgusswerkzeug, Hinterspritzen des Leiterstreifens mit Kunststoff zur Erzeugung der mit dem Leiterstreifen verbundenen Leuchtenkomponente, Laserschneiden einer benötigten Leitungsgeometrie in den Leiterstreifen 2 zum Erstellen eines strukturierten Leiterstreifens 2 sowie Aufbringen von elektrischen und/oder elektronischen Komponenten auf dem strukturierten Leiterstreifen.

Abstract translation: 本发明涉及一种制造适用于接收的光通量的灯组件的方法发射LED 10的发光二极管10被布置在平的，部分导电导体元件上。 为了减少制造灯组件的循环时间，本发明提出一种制造方法，包括以下步骤：将与一个导体带2的预固定在注塑模具中的期望的位置上，插入塑料导体条的成型制造连接到所述导体带的灯组件，激光切割所需 导体带2中的线几何结构用于形成结构化导体带2并且将电气和/或电子部件施加在结构化导体带上。

公开(公告)号：EP2916353B1

公开(公告)日：2017-07-26

申请号：EP13850020.2

申请日：2013-10-25

Applicant: NSK Ltd.

Inventor： SUNAGA, Takashi ,  KANEKO, Noboru ,  MIYOSHI, Osamu

IPC: H01L23/48 ,  H01L21/60 ,  H01L25/07 ,  H01L25/18

CPC classification number: H05K1/09 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49582 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/291 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32227 ,  H01L2224/32238 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/35847 ,  H01L2224/3701 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/40227 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/4103 ,  H01L2224/4112 ,  H01L2224/48 ,  H01L2224/73263 ,  H01L2224/77272 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/85 ,  H01L2224/9221 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/05 ,  H05K1/181 ,  H05K3/3431 ,  H05K2201/10166 ,  H05K2201/1028 ,  H05K2201/1031 ,  H05K2201/10409 ,  H05K2201/10946 ,  H05K2201/10962 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/33 ,  H01L2924/00012 ,  H01L2924/00

公开(公告)号：EP3171681A1

公开(公告)日：2017-05-24

申请号：EP16199159.1

申请日：2016-11-16

Applicant: KOITO MANUFACTURING CO., LTD.

Inventor： ITO, Noriaki

IPC: H05K3/00 ,  H05K3/10 ,  H05K1/02

CPC classification number: F21V29/80 ,  F21V23/06 ,  F21Y2115/10 ,  F21Y2115/30 ,  H01L33/52 ,  H01L33/62 ,  H01L2933/005 ,  H01L2933/0066 ,  H05K1/0207 ,  H05K1/021 ,  H05K1/0278 ,  H05K3/0014 ,  H05K3/202 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/1028 ,  H05K2203/1327

Abstract: A lamp having a conductive lead frame integrally molded in a plate shaped resin body and a light emitting element mounted on the lead frame. A pad is provided in the lead frame and is exposed within a concave portion provided on a surface of the body. The light emitting element is mounted on the pad within the corresponding concave portion.

Abstract translation: 一种具有整体模制在板状树脂体中的导电引线框架和安装在该引线框架上的发光元件的灯。 衬垫设置在引线框架中并且暴露在设置在主体表面上的凹入部分内。 发光元件安装在相应凹部内的衬垫上。

公开(公告)号：EP2959754A4

公开(公告)日：2016-11-09

申请号：EP14754166

申请日：2014-02-24

Applicant: MC10 INC

Inventor： HSU YUNG-YU

IPC: H05K1/02

CPC classification number: H05K1/185 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/118 ,  H05K1/147 ,  H05K1/148 ,  H05K1/189 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/09245 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/2009

Abstract: Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.

公开(公告)号：EP3066899A1

公开(公告)日：2016-09-14

申请号：EP14802554.7

申请日：2014-11-05

Applicant: Osram Sylvania Inc.

Inventor： SPEER, Richard ,  HAMBY, David ,  SELVERIAN, John

IPC: H05K3/10 ,  H05K1/18 ,  H01L33/48 ,  F21S4/00 ,  H05K1/02 ,  H01L25/13

CPC classification number: H01L25/0753 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2933/0066 ,  H05K1/0274 ,  H05K1/0287 ,  H05K1/181 ,  H05K1/189 ,  H05K3/103 ,  H05K2201/10106 ,  H05K2201/1028 ,  H05K2201/2054 ,  H05K2203/063 ,  H01L2924/00

Abstract: Techniques are disclosed for making a flexible laminated circuit board using a metal conductor onto which a SMD may be attached. Conductive metal strips may be laminated to form a flexible substrate and the metal strips may then be perforated for the placement of LED package leads. The LED packages may be attached to the conductive strips using solder or a conductive epoxy and the upper laminate layer may include perforations exposing portions of the metal strips for the attachment of the LED packages. Alternatively, strings of LED packages may be fabricated by attaching LED packages to conductive strips and these strings may be laminated between flexible sheets to form a laminated LED circuit. Plastic housings may aid in attaching the LED packages to the conductive strips. The plastic housings and/or the laminate sheets may be made of a reflective material.

公开(公告)号：EP1985163B1

公开(公告)日：2016-04-27

申请号：EP07702782.9

申请日：2007-01-16

Applicant: Häusermann GmbH

Inventor： JANESCH, Rudolf ,  STRUMMER, Erich ,  HACKL, Johann

IPC: H05K3/00 ,  H05K1/00

CPC classification number: H05K1/0281 ,  H05K1/0203 ,  H05K1/0263 ,  H05K1/0278 ,  H05K3/0017 ,  H05K3/0044 ,  H05K3/0058 ,  H05K3/328 ,  H05K3/4691 ,  H05K2201/0191 ,  H05K2201/09036 ,  H05K2201/1028 ,  H05K2201/2009 ,  H05K2203/302

公开(公告)号：EP2740139B1

公开(公告)日：2015-07-29

申请号：EP12753413.9

申请日：2012-08-03

Applicant: Phoenix Contact GmbH & Co. KG

Inventor： DURTH, Rainer ,  MEYER, Thomas

IPC: H01H37/76 ,  H01T1/14 ,  H05K1/02

CPC classification number: H01H37/764 ,  H01H37/761 ,  H01T1/14 ,  H05K1/0201 ,  H05K2201/0311 ,  H05K2201/10181 ,  H05K2201/1028 ,  H05K2203/047 ,  H05K2203/176

公开(公告)号：EP2891390A1

公开(公告)日：2015-07-08

申请号：EP13832479.3

申请日：2013-08-10

Applicant: Inco Innovation

Inventor： BERGLUND, Jan

IPC: H05K1/02 ,  H01B5/02 ,  H02G5/00

CPC classification number: H05K1/181 ,  H05K1/0209 ,  H05K1/0263 ,  H05K2201/0379 ,  H05K2201/10189 ,  H05K2201/10272 ,  H05K2201/1028

Abstract: A power chain consisting of a chain comprising links that are electrically conductive elements mounted on a circuit board in at least two layers and in such a way that the elements included in the power chain are assembled shifted and overlapping and in electrical contact with each other.

公开(公告)号：EP2779806A3

公开(公告)日：2014-10-01

申请号：EP14159197.4

申请日：2014-03-12

Applicant: Grote Industries, LLC

Inventor： Brooks, Timothy Webster ,  Jones, Scott J. ,  Marx, Martin J. ,  Perez-Bolivar, Cesar ,  Roberts, James E. ,  Richardson II, George M.

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/28 ,  F21V29/00

CPC classification number: H01L33/644 ,  F21S4/22 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K1/0207 ,  H05K1/0209 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/284 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/1028 ,  H05K2201/10977 ,  H01L2924/00

Abstract: A flexible lighting element, comprising:
a first flexible substrate (510, 1110); first conductive element (130) and second conductive element (140) located on the first flexible substrate (510, 1110); a light-emitting element (210) having first and second contacts (230, 240) that are both on a first surface of the light-emitting element (210), the first contact (230) being electrically connected to the first conductive element (130), the second contact (240) being electrically connected to the second conductive element (140), and the light-emitting element (210) emitting light from a second surface opposite the first surface; a flexible top layer located adjacent to the second surface; an affixing layer (540) located between the first flexible substrate (510, 1110) and the flexible top layer, the affixing layer (540) affixing the flexible top layer to the first flexible substrate (510, 1110); and a heat spreading layer (1370, 1470) having a third surface and a fourth surface opposite the third surface, the heat spreading layer (1370, 1470) being affixed beneath the first flexible substrate (510, 1110) at the third surface, wherein the flexible top layer is substantially transparent to the selected wavelength of light.

Abstract translation: 一种柔性照明元件，包括：第一柔性基底（510,1110）; 第一导电元件（130）和位于第一柔性基板（510,1110）上的第二导电元件（140）; 具有在所述发光元件（210）的第一表面上的第一和第二触点（230,240）的发光元件（210），所述第一触点（230）电连接到所述第一导电元件 130），所述第二触点（240）电连接到所述第二导电元件（140），并且所述发光元件（210）从与所述第一表面相对的第二表面发射光; 位于第二表面附近的柔性顶层; 位于所述第一柔性基板（510,1110）和所述柔性顶层之间的固定层（540），所述固定层（540）将所述柔性顶层固定到所述第一柔性基板（510,1110）上; 和具有与所述第三表面相对的第三表面和第四表面的散热层（1370,1470），所述热扩散层（1370,1470）在所述第三表面处固定在所述第一柔性基底（510,1110）下方，其中 柔性顶层对于所选择的波长的光线基本上是透明的。

公开(公告)号：EP2306512B1

公开(公告)日：2014-09-03

申请号：EP11150797.6

申请日：2006-07-05

Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI ,  SHOWA DENKO KABUSHIKI KAISHA

Inventor： Otoshi, Kota ,  Kono, Eiji ,  Toh, Keiji ,  Tanaka, Katsufumi ,  Furukawa, Yuichi ,  Yamauchi, Shinobu ,  Hoshino, Ryoichi ,  Wakabayashi, Nobuhiro ,  Nakagawa, Shintaro

IPC: H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L23/473 ,  H05K1/02 ,  H05K3/34 ,  H05K3/00 ,  H05K1/03

CPC classification number: H05K3/0061 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/473 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/1028 ,  H05K2203/0405 ,  Y02P70/613 ,  H01L2924/00