公开(公告)号：EP1517599A1

公开(公告)日：2005-03-23

申请号：EP04106328.0

申请日：2001-02-26

Applicant: Sts Atl Corporation

Inventor： The designation of the inventor has not yet been filed

IPC: H05K3/40

CPC classification number: H01L21/481 ,  H05K3/0032 ,  H05K3/4084 ,  H05K2201/0397 ,  H05K2201/09063

Abstract: A printed circuit board or the like, is provided with a hole (31) for the purpose of interconnecting conductive layers on opposite sides of the board. When removing material to form the hole (31), part of one conductive layer is preserved to form a tab (30). This tab (30) is pushed through the hole to form the desired electrical connection between opposite sides.

Abstract translation: 的印刷电路板或类似物，设置有用于在电路板的相对侧上的互连导电层的目的，一个孔（31）。 当移除材料以形成所述孔（31），一个导电层的一部分被保留以形成一个标签（30）。 此选项卡（30）穿过孔推，以形成相对的两侧之间的期望的电连接。

公开(公告)号：EP1433368B1

公开(公告)日：2004-12-22

申请号：EP02800216.0

申请日：2002-10-01

Applicant: NagraID S.A.

Inventor： DROZ, François

IPC: H05K3/40 ,  G06K19/077 ,  H01L23/498

CPC classification number: G06K19/07752 ,  G06K19/07749 ,  H01L21/4846 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/49855 ,  H01L23/5389 ,  H01L2224/16 ,  H05K3/4084 ,  H05K3/4092 ,  H05K3/4685 ,  H05K2201/0397 ,  H05K2201/09081

Abstract: The invention aims at obtaining a very cheap electronic circuit used for example in a card or label while maintaining high reliability. In particular, the invention concerns connecting one or more electronic components on the strip conductors by means of conductor bridges which cross the substrate. The inventive electronic circuit comprises at least an electronic component (6), a substrate (5), on one first face of said substrate is applied an adhesive layer and a conductive layer consisting of a plurality of tracks (4). The electronic component (6) comprises at least two bond pads (7). One of said pads (7) is electrically connected to the conductive layer by a conductor bridge formed by a conductive segment (1) delimited solely in the conductive layer. Said segment (1), free of adhesive substance, crosses the substrate (5) through a passageway (2, 3) and connects the bond pad (7).

公开(公告)号：EP1481576A1

公开(公告)日：2004-12-01

申请号：EP03711368.5

申请日：2003-03-04

Applicant: 3M Innovative Properties Company

Inventor： YANG, Rui

IPC: H05K3/38 ,  C08J7/02

CPC classification number: B32B15/08 ,  B32B2305/55 ,  B32B2429/02 ,  C08J7/12 ,  C09K13/02 ,  G11B5/4853 ,  H05K3/002 ,  H05K3/381 ,  H05K3/383 ,  H05K2201/0141 ,  H05K2201/0397 ,  H05K2203/0786 ,  Y10T428/12569 ,  Y10T428/24917 ,  Y10T428/264 ,  Y10T428/265 ,  Y10T428/266 ,  Y10T428/31681

Abstract: A process for providing a metal-seeded liquid crystal polymer comprising the steps of providing a liquid crystal polymer substrate to be treated by applying an aqueous solution comprising an alkali metal hydroxide and a solubilizer at a temperature from 50°C to 120°C to etch the liquid crystal polymer substrate. An adherent metal layer may be deposited on the etched liquid crystal polymer substrate using either electroless metal plating or vacuum deposition of metal. When using electroless metal plating, a tin(II) solution applied to the liquid crystal polymer, followed by application of a palladium(II) solution, provides the metal-seeded liquid crystal polymer. Etchant solutions may be used to form flexible circuits comprising a liquid crystal polymer film, having through-holes and related shaped voids, and for surface preparation of liquid crystal polymer substrates applied to flexures for hard disk drives.

公开(公告)号：EP1463391A1

公开(公告)日：2004-09-29

申请号：EP04290721.2

申请日：2004-03-16

Applicant: VALEO VISION

Inventor： Gasquet, Jean-Claude ,  Tanghe, Alcina

IPC: H05K3/34 ,  H05K1/02 ,  F21V19/00 ,  F21S8/10 ,  H01L33/00 ,  B60Q1/26

CPC classification number: F21V29/713 ,  F21S43/14 ,  F21S43/19 ,  F21S45/47 ,  H01L33/64 ,  H05K1/0203 ,  H05K3/301 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3494 ,  H05K2201/0397 ,  H05K2201/10106 ,  H05K2201/10553 ,  H05K2201/10969 ,  H05K2203/107 ,  Y02P70/613 ,  Y10S362/80

Abstract: Procédé de fixation d'une diode électroluminescente de puissance (1) ayant une embase (2) métallique, sur un élément radiateur de chaleur (3) métallique, selon lequel l'embase (2) de la diode électroluminescente est fixée sur l'élément radiateur (3) par soudure laser par points (11).

Abstract translation: 该方法包括固定的电致发光二极管功率E.G.的金属底座（2） LED（1），在金属散热器（3）通过激光焊接点（11）。 所述金属基体由铜制成，并且所述散热器单元由镍构成的金属层衬里吸收激光。 的焊接点的中心有规则地分布在轮廓在基部的外周边平行。 因此独立claimsoft被包括用于在汽车中的信令或照明装置。

公开(公告)号：EP1448037A2

公开(公告)日：2004-08-18

申请号：EP03026187.9

申请日：2003-11-17

Applicant: Sumitomo Wiring Systems, Ltd.

Inventor： Yamaguchi, Jun

IPC: H05K5/00 ,  H05K7/02 ,  B60R16/02

CPC classification number: B60R16/0238 ,  H05K3/202 ,  H05K3/284 ,  H05K7/026 ,  H05K2201/0397 ,  H05K2203/1147 ,  Y10T29/4935

Abstract: A power circuit section (1) including a plurality of bus bars (10) is disposed through an insulation layer (5) on a circuit arrangement surface of a heat radiation member (2). An end of each of the bus bars is folded up from the circuit arrangement surface to form an external connection terminal (14). An enclosure wall member (30) that surrounds the power circuit section including the external connection terminal is disposed on the heat radiation member. A connector housing (36) contains an external connection connector that comprises a bottom portion provided with terminal, a through-hole (37) into which the external connection terminal is inserted, and a hood (38) that surrounds the external connection terminal. The external connection connector can be coupled to another connector together with the external connection terminal. A waterproof layer (6) is formed within the enclosure wall member so that at least a part of the power circuit section is sealed and the terminal through-hole is sealed.

Abstract translation: 包括多个母线（10）的电源电路部分（1）通过隔热层（5）设置在散热构件（2）的电路布置表面上。 每个母线的端部从电路布置表面折叠以形成外部连接端子（14）。 围绕包括外部连接端子的电源电路部分的外壳壁构件（30）设置在散热构件上。 连接器壳体（36）包含外部连接连接器，其包括设置有端子的底部，插入外部连接端子的通孔（37）和围绕外部连接端子的罩（38）。 外部连接连接器可以与外部连接端子一起耦合到另一个连接器。 防水层（6）形成在外壳壁构件内，使得电源电路部分的至少一部分被密封，并且端子通孔被密封。

公开(公告)号：EP1433368A1

公开(公告)日：2004-06-30

申请号：EP02800216.0

申请日：2002-10-01

Applicant: Nagra ID SA

Inventor： DROZ, François

IPC: H05K3/40 ,  G06K19/077 ,  H01L23/498

CPC classification number: G06K19/07752 ,  G06K19/07749 ,  H01L21/4846 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/49855 ,  H01L23/5389 ,  H01L2224/16 ,  H05K3/4084 ,  H05K3/4092 ,  H05K3/4685 ,  H05K2201/0397 ,  H05K2201/09081

Abstract: The invention aims at obtaining a very cheap electronic circuit used for example in a card or label while maintaining high reliability. In particular, the invention concerns connecting one or more electronic components on the strip conductors by means of conductor bridges which cross the substrate. The inventive electronic circuit comprises at least an electronic component (6), a substrate (5), on one first face of said substrate is applied an adhesive layer and a conductive layer consisting of a plurality of tracks (4). The electronic component (6) comprises at least two bond pads (7). One of said pads (7) is electrically connected to the conductive layer by a conductor bridge formed by a conductive segment (1) delimited solely in the conductive layer. Said segment (1), free of adhesive substance, crosses the substrate (5) through a passageway (2, 3) and connects the bond pad (7).

Abstract translation: 本发明旨在获得例如在卡或标签中使用的非常便宜的电子电路，同时保持高可靠性。 具体地说，本发明涉及借助于与基板交叉的导体桥连接带状导体上的一个或多个电子部件。 本发明的电子电路至少包括电子元件（6），衬底（5），在所述衬底的一个第一面上施加粘合剂层和由多个轨道（4）组成的导电层。 电子部件（6）包括至少两个接合垫（7）。 所述焊盘（7）中的一个通过由仅在导电层中界定的导电段（1）形成的导体桥电连接到导电层。 所述不含粘合剂物质的区段（1）通过通道（2,3）穿过基板（5）并连接接合垫（7）。

公开(公告)号：EP1429589A2

公开(公告)日：2004-06-16

申请号：EP03028364.2

申请日：2003-12-10

Applicant: Marquardt GmbH

Inventor： Neitzel, Roland ,  Stegerwald, Gerhard

IPC: H05K3/32 ,  H05K1/11 ,  H01R12/38

CPC classification number: H01R12/585 ,  H05K1/118 ,  H05K3/0064 ,  H05K3/301 ,  H05K3/306 ,  H05K3/308 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2201/10856 ,  H05K2201/2009 ,  H05K2203/1327

Abstract: Die Erfindung betrifft einen Schaltungsträger (3) für eine elektrische Schaltung, insbesondere in der Art einer wenigstens teilweise flexiblen Leiterplatte. Der Schaltungsträger (3) weist elektrische, elektronische o. dgl. Bauteile (2), wie einen Elektromotor (2a), Schalter (2b), Widerstand, Kondensator, Spule, IC, Steckanschluß o. dgl. auf. Weiter besitzt der Schaltungsträger (3) Leiterbahnen zur elektrischen Verbindung der Bauteile (2) sowie Kontaktflächen (5) zur elektrischen Kontaktierung der Bauteile (2). Die Kontaktfläche (5) ist wenigstens teilweise in der Ebene des Schaltungsträgers (3) freigeschnitten, derart daß die Kontaktfläche (5) eine Flexibilität in eine außerhalb der Ebene (6) des Schaltungsträgers (3) verlaufende Richtung aufweist, insbesondere in der Art einer Kontaktzunge. Ein Kontaktelement (8) zur elektrischen Kontaktierung des Bauteils (2) liegt mit einem Anpreßdruck derart an der Kontaktfläche (5) an, daß die Kontaktfläche (5) aus der Ebene (6) des Schaltungsträgers (3) ausgelenkt ist.

Abstract translation: 电路载体的接触表面（5）在电路载体（3）的平面中至少部分地被切割，使得接触表面在延伸到电路载体的平面外的方向上具有柔性，形式为 接触舌头 接触构件（8）使用导致接触表面偏离电路载体的平面的压力抵靠接触表面以接触部件（2）。 包括用于制造电路载体的方法的独立权利要求。

公开(公告)号：EP1329144B1

公开(公告)日：2004-06-02

申请号：EP01988009.5

申请日：2001-10-16

Applicant: ROBERT BOSCH GMBH

Inventor： SCHMID, Roland ,  UHLAND, Thomas ,  BECKBISSINGER, Kai ,  SCHINZEL, Ralf ,  HENNEL, Udo

IPC: H05K3/34 ,  H05K1/11 ,  H05K7/08

CPC classification number: H05K1/116 ,  H05K1/0201 ,  H05K3/202 ,  H05K3/3447 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/062 ,  H05K2201/0969

Abstract: The invention relates to a module support (1), for electrical/electronic components (7), comprising a conductor arrangement with several metallic conductors (2), formed from a stamped grid and an insulating material shell (3) in which the metallic conductors (2) are at least partly embedded. At least one contact section (10) of a metallic conductor (2), for contacting a connector element (8) on an electrical/electronic component (7), is arranged in a through recess (6) in the insulating material shell (3). According to the invention, damage to the insulating material shell (3), on soldering the contact section (10), may be avoided, whereby the at least one contact section (10) of the metallic conductor (2) is completely removed from the shell of insulating material and is only electrically connected to a section (12) of the conductor (2), arranged on the inner wall of the recess (6), by means of at least one connector bridge (11), arranged in said recess (6). The heat-conducting cross-sectional area of the at least one connector bridge (11) is small, in such a way that, on a strong heating of the contact section (10), the connector bridge (11) causes a reduction in the flow of heat to the section (12) of the conductor (2) arranged on the inner wall of the recess (6), which has a larger heat-conducting cross-sectional area.

公开(公告)号：EP1408337A2

公开(公告)日：2004-04-14

申请号：EP03027450.0

申请日：1995-11-13

Applicant: FORMFACTOR, INC.

Inventor： Khandros, Igor Y. ,  Mathieu, Gaetan L. ,  Eldridge, Benjamin N. ,  Grube, Gary W.

IPC: G01R1/073

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: A probe card assembly comprising: a probe card comprising a plurality of electrical contacts; a probe substrate having a plurality of elongate, resilient probe elements; a second substrate disposed between and spaced from said probe card and said probe; and a plurality of elongate interconnection elements providing compliant electrical connections through said second substrate between said probe card and said probe substrate and thereby electrically connecting ones of said electrical contacts with ones of said probe elements.

Abstract translation: 一种探针卡组件，包括：包括多个电触点的探针卡; 具有多个细长弹性探针元件的探针基底; 设置在所述探针卡与所述探针之间并与之间隔开的第二衬底; 以及多个细长的互连元件，所述多个细长的互连元件在所述探针卡和所述探针基底之间提供穿过所述第二基底的柔性电连接，并由此将所述电接触件中的一些与所述探针元件中的一些电连接。

公开(公告)号：EP0903969B1

公开(公告)日：2004-03-10

申请号：EP98116589.7

申请日：1998-09-02

Applicant: Conti Temic microelectronic GmbH ,  Marquardt GmbH

Inventor： Seitz, Georg ,  Wolfschläger, Roland ,  Lach, Joachim ,  Sachs, Ekkehard ,  Klein, Ernst-Ludwig

IPC: H05K3/36 ,  H05K1/11 ,  H05K1/00

CPC classification number: H05K1/028 ,  H05K1/118 ,  H05K1/148 ,  H05K3/202 ,  H05K3/281 ,  H05K3/361 ,  H05K3/4084 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/09145 ,  H05K2201/09736 ,  Y10T29/49124 ,  Y10T29/49126