公开(公告)号：EP2501742B1

公开(公告)日：2016-03-16

申请号：EP10784628.9

申请日：2010-11-19

Applicant: E. I. du Pont de Nemours and Company

Inventor： AUMAN, Brian, C. ,  DUNBAR, Meredith, L. ,  HE, Tao ,  KOURTAKIS, Kostantinos

IPC: C08G73/10 ,  C09D179/08 ,  H01L21/77 ,  H01L23/14 ,  H01L23/29 ,  H05K1/03

CPC classification number: H01L23/482 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C08J5/18 ,  C08J2379/08 ,  C08K7/00 ,  C08K7/02 ,  C08K7/04 ,  C08K7/08 ,  C08K2201/016 ,  C08L79/08 ,  H01L23/293 ,  H01L23/295 ,  H01L24/12 ,  H01L2224/0231 ,  H01L2224/02319 ,  H01L2224/0233 ,  H01L2224/02335 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12032 ,  H01L2924/14 ,  H05K1/0346 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/259 ,  H01L2924/00

公开(公告)号：EP2501740B1

公开(公告)日：2016-03-16

申请号：EP10781796.7

申请日：2010-11-19

Applicant: E. I. du Pont de Nemours and Company

Inventor： AUMAN, Brian, C. ,  DUNBAR, Meredith, L. ,  HE, Tao ,  KOURTAKIS, Kostantinos

IPC: C08G73/10 ,  C09D179/08 ,  H01L21/77

CPC classification number: H01L23/482 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C08J5/18 ,  C08J2379/08 ,  C08K7/00 ,  C08K7/02 ,  C08K7/04 ,  C08K7/08 ,  C08K2201/016 ,  C08L79/08 ,  H01L23/293 ,  H01L23/295 ,  H01L24/12 ,  H01L2224/0231 ,  H01L2224/02319 ,  H01L2224/0233 ,  H01L2224/02335 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12032 ,  H01L2924/14 ,  H05K1/0346 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/259 ,  H01L2924/00

公开(公告)号：EP2636706A4

公开(公告)日：2016-01-20

申请号：EP11837972

申请日：2011-10-31

Applicant: DAICEL CORP

Inventor： INOUE KEIZO ,  KAMURO SHIGEAKI

IPC: C08L83/07 ,  C08L83/05 ,  C09K3/10

CPC classification number: C08G77/04 ,  C08G77/045 ,  C08G77/12 ,  C08G77/20 ,  C08L83/04 ,  C09K3/1018 ,  H01L23/295 ,  H01L2924/0002 ,  C08L83/00 ,  H01L2924/00

公开(公告)号：EP2966106A1

公开(公告)日：2016-01-13

申请号：EP14760547.1

申请日：2014-03-04

Applicant: DIC Corporation

Inventor： YOSHIMOTO Yasuyo ,  OSHIO Atsushi ,  MORINAGA Kunihiro ,  KINOSHITA Hiroshi ,  ITO Daisuke

IPC: C08G59/32 ,  C08L63/00 ,  C09J11/04 ,  C09J163/00 ,  H01L23/29 ,  H01L23/31

CPC classification number: C09J163/00 ,  C08G59/32 ,  C08G59/3218 ,  C08K3/36 ,  C08K7/18 ,  C08K9/06 ,  C08L63/00 ,  C09J9/00 ,  C09J11/04 ,  C09K5/14 ,  H01L23/293 ,  H01L23/295 ,  H01L2924/0002 ,  H05K1/0373 ,  H01L2924/00 ,  C08K7/02 ,  C08K3/10

Abstract: The present invention provides an epoxy resin composition including 2,2',7,7'-tetraglycidyloxy-1,1'-binaphthalene as an epoxy resin (A), and a filler (B). Further, the present invention provides an epoxy resin composition in which the filler (B) in the epoxy resin composition is a thermally conductive filler and an epoxy resin composition in which the filler (B) is silica. Further, the present invention provides a cured product produced by curing the epoxy resin composition of the present invention and a heat dissipation material and an electronic material each including the cured product.

Abstract translation: 本发明提供了作为环氧树脂（A）的2,2'，7,7'-四缩水甘油氧基-1,1'-联萘和填料（B）的环氧树脂组合物。 此外，本发明提供一种环氧树脂组合物中的填料（B）为导热性填料的环氧树脂组合物和填料（B）为二氧化硅的环氧树脂组合物。 此外，本发明提供通过固化本发明的环氧树脂组合物和散热材料和各自包含固化产物的电子材料而制备的固化产物。

公开(公告)号：EP2937900A3

公开(公告)日：2016-01-06

申请号：EP15001129.4

申请日：2015-04-17

Applicant: Broadcom Corporation

Inventor： Law, Edward ,  Khan, Rezaur ,  Hu, Kunzhong

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/498 ,  H01L25/10 ,  H01L25/03 ,  H01L25/065 ,  H01L23/552 ,  H01L23/29 ,  H01L21/98

CPC classification number: H01L25/0655 ,  H01L21/56 ,  H01L21/561 ,  H01L21/566 ,  H01L21/568 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/552 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06537 ,  H01L2225/06558 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Reconstitution techniques for semiconductor packages are provided. One reconstitution technique is used to encapsulate (348) a plurality of semiconductor packages (336,354,356) into a single multi-chip module (fig. 3e). Solder balls (326) coupled to each package may be partially exposed after reconstitution, which enables the packages to be coupled to another device. Another reconstitution technique is used to couple a plurality of semiconductor packages into a package-on-package module using self-alignment feature(s) (fig. 6k). The self-alignment feature(s) are exposed solder ball(s) (626) that are included in the bottom package of the package-on-package module. The exposed solder ball(s) serve as a frame of reference to other solder balls (624) that are encapsulated by an encapsulation material (634). After the location of these other solders balls are determined, through-mold vias (636a,636b) may be formed in the encapsulation material at locations corresponding to the other solder balls. The top package of the package-on-package module may then be coupled to the bottom package using these solder balls.

公开(公告)号：EP2839507A4

公开(公告)日：2015-12-02

申请号：EP13777901

申请日：2013-04-17

Applicant: MOMENTIVE PERFORMANCE MAT INC

Inventor： RAMAN CHANDRASHEKAR ,  EARLEY WAYNE A

IPC: H01L23/36 ,  C09K5/14

CPC classification number: C09K5/14 ,  B29C45/0013 ,  B29K2101/10 ,  B29K2101/12 ,  B29K2105/16 ,  B29K2509/04 ,  B29K2995/0013 ,  C08J5/00 ,  C08J2300/24 ,  H01L23/295 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP2931803A1

公开(公告)日：2015-10-21

申请号：EP13827037.6

申请日：2013-11-27

Applicant: SABIC Global Technologies B.V.

Inventor： GUO, Mingcheng ,  ZHANG, Yaqin ,  AN, Yuxian

IPC: C08K5/5419 ,  C08K3/22 ,  C08L83/04

CPC classification number: C08K5/5419 ,  C08G77/04 ,  C08K3/22 ,  C08K7/14 ,  C08K2201/001 ,  C08L77/00 ,  C08L77/02 ,  C08L77/06 ,  C08L83/04 ,  H01L23/295 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Disclosed herein is a thermally conductive composition, comprising 20 to 80 wt % of a thermoplastic or thermosetting polymer; 10 to 70 wt % of a metal hydroxide; and a polymeric char forming agent, where the polymeric char forming agent provides the thermally conductive composition with a flame retardancy of V-0 at a thickness of 1.5 millimeters or less when tested as per a UL-94 testing protocol; where the weight percents are based on a total weight of the thermally conductive composition.

公开(公告)号：EP2930742A2

公开(公告)日：2015-10-14

申请号：EP15155779.0

申请日：2015-02-19

Applicant: Kabushiki Kaisha Toshiba

Inventor： Yamada, Hiroshi

IPC: H01L21/60 ,  H01L23/34 ,  H01L23/538 ,  H01L23/433

CPC classification number: H01L23/5386 ,  H01L21/568 ,  H01L23/295 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05568 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/12105 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13166 ,  H01L2224/13184 ,  H01L2224/1403 ,  H01L2224/14135 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/94 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/1424 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/0105 ,  H01L2924/00 ,  H01L2224/11

Abstract: A semiconductor device according to an embodiment includes a first semiconductor unit including a plurality of first semiconductor chips (12a,12b), an organic resin (16) provided between the first semiconductor chips, a wiring layer (18) provided above the first semiconductor chips to electrically connect the first semiconductor chips to each other, and a plurality of connecting terminals (24) provided on an upper portion of the wiring layer and a second semiconductor unit (22) fixed to a wiring layer side of the first semiconductor unit, the second semiconductor unit fixed to a region sandwiched between the connecting terminals, the second semiconductor unit having a second semiconductor chip, the second semiconductor unit electrically connected to the first semiconductor unit.

Abstract translation: 根据实施例的半导体器件包括：第一半导体单元，包括多个第一半导体芯片（12a，12b）;设置在第一半导体芯片之间的有机树脂（16），设置在第一半导体芯片 将第一半导体芯片彼此电连接，以及设置在布线层的上部的多个连接端子（24）和固定到第一半导体单元的布线层侧的第二半导体单元（22）， 第二半导体单元固定到夹在所述连接端子之间的区域，所述第二半导体单元具有第二半导体芯片，所述第二半导体单元电连接到所述第一半导体单元。

公开(公告)号：EP2755234A4

公开(公告)日：2015-05-27

申请号：EP12830834

申请日：2012-09-07

Applicant: HENKEL AG & CO KGAA

Inventor： HORIGUCHI YUSUKE ,  SANO MIEKO ,  SATO KENICHIRO

IPC: H01L21/60 ,  C08K7/16 ,  C08K9/04 ,  C08L25/18 ,  C08L33/04 ,  C09D4/00 ,  C09D133/14 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L23/293 ,  C08K5/3415 ,  C08K9/04 ,  C08L2205/22 ,  C08L2312/00 ,  C09D4/00 ,  C09D133/14 ,  H01L21/563 ,  H01L23/295 ,  H01L24/29 ,  H01L2224/2929 ,  H01L2924/01029

Abstract: The present invention provides a composition of which viscosity does not cause the problem of use at high temperature in the mounting process of electronic device. The present invention relates to a composition for electronic device comprising (a) a (meth)acrylic compound and (c) a particle having a functional group having metal scavenging functionality.

公开(公告)号：EP2141201B1

公开(公告)日：2015-01-21

申请号：EP09008627.3

申请日：2009-07-01

Applicant: Shin-Etsu Chemical Co., Ltd.

Inventor： Yusuke, Taguchi ,  Toshio, Shiobara

IPC: C08L63/06 ,  C08L63/00 ,  C08L83/04 ,  C08K3/00 ,  H01L23/29

CPC classification number: H01L23/49861 ,  C08G77/16 ,  C08G77/18 ,  C08L63/00 ,  C08L63/06 ,  C08L83/04 ,  C08L83/06 ,  H01L23/295 ,  H01L23/296 ,  H01L33/56 ,  H01L2924/0002 ,  C08L83/00 ,  C08L2666/14 ,  C08L2666/22 ,  H01L2924/00