公开(公告)号：EP1272550A1

公开(公告)日：2003-01-08

申请号：EP01918815.0

申请日：2001-03-16

Applicant: PPG Industries Ohio, Inc.

Inventor： LAWTON, Ernest, L. ,  VELPARI, Vedagiri ,  RICE, William, B. ,  ROBERTSON, Walter, J. ,  NOVICH, Bruce, E. ,  WU, Xiang ,  LAMMON-HILINSKI, Kami

IPC: C08J5/08 ,  H05K1/03 ,  C03C25/10

CPC classification number: C03C25/26 ,  C03C25/00 ,  C03C25/10 ,  C03C25/28 ,  C03C25/32 ,  C03C25/42 ,  C03C25/47 ,  C03C25/48 ,  C08J5/08 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127 ,  Y10T428/2927 ,  Y10T428/2933 ,  Y10T428/2938 ,  Y10T428/2964 ,  Y10T442/20 ,  Y10T442/3049

Abstract: The present invention provides a fabric comprising at least one fiber strand comprising a plurality of fibers and having a resin compatible coating composition on at least a surface of the at least one fiber strand, wherein the at least one fiber strand has an Air Jet Transport Drag Force value of greater than 100,000 gram force per gram mass of strand as determined by a needle air jet nozzle unit having an internal air jet chamber having a diameter of 2 millimeters and a nozzle exit tube having a length of 20 centimeters at a strand feed rate of 274 meters per minute and an air pressure of 310 kiloPascals. The present invetion also provides a reinforced laminate comprising: (a) at least one matrix material; and (b) at least one fabric comprising at least one fiber strand comprising a plurality of fibers and having a resin compatible coating composition on at least a surface of the at least one fiber strand, wherein the at least one fiber strand has an Air Jet Transport Drag Force value of greater than 100,000 gram force per gram mass of strand as determined by a needle air jet nozzle unit having an internal air jet chamber having a diameter of 2 millimeters and a nozzle exit tube having a length of 20 centimeters at a strand feed rate of 274 meters per minute and an air pressure of 310 kiloPascals.

公开(公告)号：EP1231637A2

公开(公告)日：2002-08-14

申请号：EP02002566.4

申请日：2002-02-04

Applicant: Hitachi, Ltd.

Inventor： Satsu, Yuichi, Hitachi, Ltd., Intel Prop. Group ,  Takahashi, Akio, Hitachi, Ltd., Intel Prop. Group ,  Fujieda, Tadashi, Hitachi, Ltd., Intel Prop. Group ,  Ueno, Takumi, Hitachi, Ltd., Intel Prop. Group ,  Akahoshi, Haruo, c/o Int. Prop. Group

IPC: H01L23/498

CPC classification number: H05K1/162 ,  H01L23/145 ,  H01L23/49894 ,  H01L23/642 ,  H01L23/66 ,  H01L2924/0002 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/0218 ,  Y10T428/249921 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/256 ,  Y10T428/26 ,  Y10T428/269 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2998 ,  Y10T428/31 ,  H01L2924/00

Abstract: A high dielectric constant composite material obtained by subjecting submicron particles of an inorganic filler containing a metal as its essential component to an insulating treatment such as a chemical treatment, further subjecting to a surface treatment for improving their compatibility with organic resins, and then dispersing in an organic resin, has a dielectric constant of 15 or above, with its dielectric loss tangent in the frequency region of from 100 MHz to 80 GHz being 0.1 or less, and can therefore be used effectively for multilayer wiring boards and module substrates.

Abstract translation: 如化学处理，进一步进行表面处理以改进其与有机树脂的相容性，然后分散在：通过对在绝缘处理含有金属作为其基本组分的无机填料的亚微米颗粒而获得的高介电常数的复合材料 有机树脂的，具有15或更高的介电常数，并在从100MHz到80GHz的是0.1或更小的频率区域的介质损耗角正切，并且可以THEREFORE有效地用于多层布线板和模块基板。

公开(公告)号：EP1194025A1

公开(公告)日：2002-04-03

申请号：EP99921226.9

申请日：1999-05-21

Applicant: IBIDEN CO., LTD.

Inventor： ASAI, Motoo, Ibiden Co., Ltd ,  KARIYA, Takashi, Ibiden Co., Ltd ,  SHIMADA, Kenichi, Ibiden Co., Ltd ,  SEGAWA, Hiroshi, Ibiden Co., Ltd

IPC: H05K3/46

CPC classification number: H05K3/4602 ,  H05K3/382 ,  H05K2201/0215 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096

Abstract: In a multilayer printed wiring board comprising a multilayer core board having conductor layers in its innerlayer, and interlaminar resin insulating layers and conductor layers alternately laminated on a substrate to form buildup wiring layer connecting the conductor layers through via-hole, the multilayer core board has a resin insulating layer covering the innerlayer conductor circuits formed on the core material, and a via-hole is formed in the resin insulating layer so as to arrive at the innerlayer conductor circuit through the layer, and a through-hole is formed in the resin insulating layer and a filler is filled in the through-hole. A part of the via-hole in the buildup wiring layer is located just above the through-hole and connected to the through-hole. Even if the core board is multilayered, there can be provided a multilayer printed wiring board suitable for the high densification of through-holes which can sufficiently ensure the electrical connection to the innerlayer circuits in the core board through the through-holes.

Abstract translation: 在包括其内层具有导体层的多层芯板和层间树脂绝缘层和导体层交替层叠在基板上以形成通过通孔连接导体层的叠层布线层的多层印刷布线板中，多层芯板具有 覆盖形成在芯材上的内层导体电路的树脂绝缘层和通孔形成在树脂绝缘层中，以便通过该层到达内层导体电路，并且在树脂中形成通孔 绝缘层和填料填充在通孔中。 积层布线层中的通孔的一部分位于通孔正上方并连接到通孔。 即使芯板是多层的，也可以提供适合高密度化的通孔的多层印刷电路板，该多孔印刷线路板可以充分确保通过通孔与芯板中的内层电路的电连接。

公开(公告)号：EP1060142A1

公开(公告)日：2000-12-20

申请号：EP99908439.5

申请日：1999-02-25

Applicant: PPG Industries Ohio, Inc.

Inventor： NOVICH, Bruce ,  LAMMON-HILINSKI, Kami ,  ROBERTSON, Walter, J. ,  WU, Xiang

IPC: C03C25/02 ,  C08J5/08 ,  H05K1/03

CPC classification number: C08J5/08 ,  C03C25/26 ,  C03C25/42 ,  H05K1/0366 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/0245 ,  H05K2203/127

Abstract: The present invention provides fiber strands including glass fibers coated with thermally conductive, inorganic solid particles useful for reinforcing composites such as laminated printed circuit boards.

公开(公告)号：EP1008414A3

公开(公告)日：2000-08-23

申请号：EP99125772.6

申请日：1994-09-16

Applicant: International Business Machines Corporation

Inventor： Acocella, John ,  Banks, Donald Ray ,  Benenati, Joseph Angelo ,  Caulfield, Thomas ,  Corbin, John Saunders, Jr. ,  Hoebener, Karl Grant ,  Watson, David P.

IPC: B23K1/00

CPC classification number: B23K1/0008 ,  B23K1/0016 ,  B23K2201/36 ,  B23K2201/40 ,  B23K2201/42 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/81191 ,  H01L2224/814 ,  H01L2924/00013 ,  H01L2924/09701 ,  H05K1/114 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3478 ,  H05K3/42 ,  H05K3/429 ,  H05K2201/0215 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0455 ,  H05K2203/082 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144 ,  H01L2224/29099 ,  H01L2924/014

Abstract: High melting temperature Pb/Sn 95/5 solder balls (18) are connected to copper pads on the bottom of a ceramic chip carrier substrate (10) by low melting temperature eutectic Pb/Sn solder. The connection is made by quick reflow to prevent dissolving Pb into the eutectic solder and raising its melting temperature. Then the module is placed on a fiberglass-epoxy circuit board with the solder balls on eutectic Pb/Sn solder bumps on copper pads of the board. The structure is reflowed to simultaneously melt the solder on both sides of the balls to allow each ball to center between the carrier pad and circuit board pad to form a more symmetric joint. This process results in structure that are more reliable under high temperature cycling. Also, to further improve reliability, the balls are made as large as the I/O spacing allows without bridging beam on balls; the two pads are about the same size with more solder on the smaller pad; the pads are at least 75% of the ball diameter; and the eutectic joints are made as large as possible without bridging between pads. For reliability at even higher temperature cycles or larger substrate sizes columns are used instead of balls.

Abstract translation: 通过低熔点共晶Pb / Sn焊料将高熔点Pb / Sn 95/5焊球（18）连接到陶瓷芯片载体衬底（10）底部上的铜焊盘。 通过快速回流实现连接，防止Pb溶入共晶焊料并提高其熔化温度。 然后将模块放置在玻璃纤维环氧树脂电路板上，使焊球位于电路板的铜焊盘上的共晶Pb / Sn焊料凸块上。 该结构被回流以同时熔化球的两侧上的焊料，以允许每个球在载体焊盘和电路板焊盘之间居中以形成更对称的接头。 该过程导致在高温循环下更可靠的结构。 此外，为了进一步提高可靠性，球的制作尺寸与I / O间距一样大，而不需要在球上桥接梁; 两个焊盘大小相同，较小的焊盘上有更多的焊料; 垫至少是球直径的75％; 并且共晶接头尽可能大地制造而不跨接在衬垫之间。 为了在甚至更高的温度循环或更大的基板尺寸下使用柱子来代替球。

公开(公告)号：EP1002610A1

公开(公告)日：2000-05-24

申请号：EP99125769.2

申请日：1994-09-16

Applicant: International Business Machines Corporation

Inventor： Acocella, John ,  Banks, Donald Ray ,  Benenati, Joseph Angelo ,  Caulfield, Thomas ,  Corbin, John Saunders, Jr. ,  Hoebener, Karl Grant ,  Watson, David P.

IPC: B23K1/00

CPC classification number: B23K1/0008 ,  B23K1/0016 ,  B23K2201/36 ,  B23K2201/40 ,  B23K2201/42 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/81191 ,  H01L2224/814 ,  H01L2924/00013 ,  H01L2924/09701 ,  H05K1/114 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3478 ,  H05K3/42 ,  H05K3/429 ,  H05K2201/0215 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0455 ,  H05K2203/082 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144 ,  H01L2224/29099 ,  H01L2924/014

Abstract: High melting temperature Pb/Sn 95/5 solder balls (18) are connected to copper pads on the bottom of a ceramic chip carrier substrate (10) by low melting temperature eutectic Pb/Sn solder. The connection is made by quick reflow to prevent dissolving Pb into the eutectic solder and raising its melting temperature. Then the module is placed on a fiberglass-epoxy circuit board with the solder balls on eutectic Pb/Sn solder bumps on copper pads of the board. The structure is reflowed to simultaneously melt the solder on both sides of the balls to allow each ball to center between the carrier pad and circuit board pad to form a more symmetric joint. This process results in structure that are more reliable under high temperature cycling. Also, to further improve reliability, the balls are made as large as the I/O spacing allows without bridging beam on balls; the two pads are about the same size with more solder on the smaller pad; the pads are at least 75% of the ball diameter; and the eutectic joints are made as large as possible without bridging between pads. For reliability at even higher temperature cycles or larger substrate sizes columns are used instead of balls.

Abstract translation: 高熔点温度Pb / Sn 95/5焊球（18）通过低熔点共晶Pb / Sn焊料连接到陶瓷芯片载体衬底（10）底部的铜焊盘。 通过快速回流进行连接，以防止将Pb溶解到共晶焊料中并提高其熔融温度。 然后将模块放置在玻璃纤维 - 环氧树脂电路板上，焊料球焊接在电路板铜焊盘上的共晶Pb / Sn焊料凸块上。 该结构被回流以同时熔化球的两侧上的焊料，以允许每个球在载体垫和电路板垫之间居中以形成更对称的接头。 该过程导致在高温循环下更可靠的结构。 此外，为了进一步提高可靠性，将球制成与I / O间隔一样大，而不会在球上桥接梁; 两个焊盘的尺寸大致相同，较小的焊盘上焊料更多; 垫片至少为球直径的75％; 并且使共晶接头制成尽可能大，而不会在焊盘之间桥接。 为了在更高的温度循环或更大的基板尺寸下的可靠性，使用色谱柱代替球。

公开(公告)号：EP0907893A1

公开(公告)日：1999-04-14

申请号：EP97930946.0

申请日：1997-06-23

Applicant: IMC Industriellt Mikroelektronikcentrum AB

Inventor： GONG, Shaofang ,  BODÖ, Peter ,  HENTZELL, Hans

IPC: G01R31 ,  G01R1 ,  G09F9 ,  H05K3

CPC classification number: H05K3/3436 ,  G01R1/06755 ,  G01R1/07307 ,  G01R31/2886 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/035 ,  H05K2201/10992 ,  H05K2203/0338 ,  H05K2203/162 ,  H05K2203/176 ,  Y02P70/613

Abstract: A method of testing and mounting electronic components that are to be surface-mounted. The components include on one side a plurality of contact pads that shall be connected electrically to contact pads on one side of a test board, particularly BGA components and corresponding components. The invention is characterized by applying to the component contact pads (2) a metal (5) which is liquid at room temperature or at an elevated room temperature, in a first method step; lifting the component (1) away from the surface of the metal (5) in a second method step, wherewith part (7) of the liquid metal remains on the component contact pads (2); and bringing the component contact pads (2) provided with the liquid metal into abutment with corresponding contact pads (3) on the test board (4), in a third method step.

公开(公告)号：EP0607534B1

公开(公告)日：1997-07-02

申请号：EP93118943.5

申请日：1989-12-28

Applicant: JAPAN RADIO CO., LTD

Inventor： Yamashita, Kazuo, c/o Japan Radio Co., Ltd. ,  Takahashi, Eiki, c/o Japan Radio Co., Ltd. ,  Teshigawara, Osamu, c/o Japan Radio Co., Ltd. ,  Kinoshita, Masaki, c/o Japan Radio Co., Ltd. ,  Eimura, Takeshi, c/o Japan Radio Co., Ltd. ,  Ohiwa, Takao, c/o Japan Radio Co., Ltd.

IPC: H05K3/46 ,  H05K3/36

CPC classification number: H05K3/462 ,  H05K1/182 ,  H05K1/185 ,  H05K3/28 ,  H05K3/3484 ,  H05K3/4038 ,  H05K3/4623 ,  H05K2201/0215 ,  H05K2201/0305 ,  H05K2201/09536 ,  H05K2201/10666 ,  H05K2201/2036 ,  H05K2203/1189 ,  H05K2203/1572 ,  Y10T29/49126 ,  Y10T29/49144

公开(公告)号：EP0650795A2

公开(公告)日：1995-05-03

申请号：EP94114605.2

申请日：1994-09-16

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Acocella, John ,  Banks, Donald Ray ,  Benenati, Joseph Angelo ,  Caulfield, Thomas ,  Corbin Jr.,John Saunders ,  Hoebener, Karl Grant ,  Watson, David P.

IPC: B23K1/00 ,  H05K3/34

CPC classification number: B23K1/0008 ,  B23K1/0016 ,  B23K2201/36 ,  B23K2201/40 ,  B23K2201/42 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/81191 ,  H01L2224/814 ,  H01L2924/00013 ,  H01L2924/09701 ,  H05K1/114 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3478 ,  H05K3/42 ,  H05K3/429 ,  H05K2201/0215 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0455 ,  H05K2203/082 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144 ,  H01L2224/29099 ,  H01L2924/014

Abstract: High melting temperature Pb/Sn 95/5 solder balls (18) are connected to copper pads on the bottom of a ceramic chip carrier substrate (10) by low melting temperature eutectic Pb/Sn solder. The connection is made by quick reflow to prevent dissolving Pb into the eutectic solder and raising its melting temperature. Then the module is placed on a fiberglass-epoxy circuit board with the solder balls on eutectic Pb/Sn solder bumps on copper pads of the board. The structure is reflowed to simultaneously melt the solder on both sides of the balls to allow each ball to center between the carrier pad and circuit board pad to form a more symmetric joint. This process results in structure that are more reliable under high temperature cycling. Also, to further improve reliability, the balls are made as large as the I/O spacing allows without bridging beam on balls; the two pads are about the same size with more solder on the smaller pad; the pads are at least 75% of the ball diameter; and the eutectic joints are made as large as possible without bridging between pads. For reliability at even higher temperature cycles or larger substrate sizes columns are used instead of balls.

Abstract translation: 高熔点温度Pb / Sn 95/5焊球（18）通过低熔点共晶Pb / Sn焊料连接到陶瓷芯片载体衬底（10）底部的铜焊盘。 通过快速回流进行连接，以防止将Pb溶解到共晶焊料中并提高其熔融温度。 然后将模块放置在玻璃纤维 - 环氧树脂电路板上，焊料球焊接在电路板铜焊盘上的共晶Pb / Sn焊料凸块上。 该结构被回流以同时熔化球的两侧上的焊料，以允许每个球在载体垫和电路板垫之间居中以形成更对称的接头。 该过程导致在高温循环下更可靠的结构。 此外，为了进一步提高可靠性，将球制成与I / O间隔一样大，而不会在球上桥接梁; 两个焊盘的尺寸大致相同，较小的焊盘上焊料更多; 垫片至少为球直径的75％; 并且使共晶接头制成尽可能大，而不会在焊盘之间桥接。 为了在更高的温度循环或更大的基板尺寸下的可靠性，使用色谱柱代替球。

公开(公告)号：EP0422919A3

公开(公告)日：1992-05-27

申请号：EP90311106.0

申请日：1990-10-10

Applicant: WATERFORD RESEARCH & DEVELOPMENT LIMITED

Inventor： Weinhold, Lutz R. ,  McDonough, John D.

IPC: C09J7/02

CPC classification number: H05K3/0076 ,  C09J7/29 ,  C09J2201/162 ,  C09J2203/31 ,  H05K3/3452 ,  H05K3/3468 ,  H05K2201/0215 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2203/0191 ,  H05K2203/068

Abstract: An antistatic pressure-sensitive adhesive tape, particularly for use in masking printed circuit boards during wave soldering, comprises
1. a polymeric film support (4) e.g. of polyimide film; 2. an intermediate electrically conductive layer (5, 12) e.g. of polymeric binder (7) containing relatively small electrically conductive filler particles (6), or a metal foil (12); and 3. a layer of pressure-sensitive adhesive (8, 15), the adhesive either containing relatively large electrically-conductive particles (9) which provide conductive pathways from one main face (3) of the adhesive layer to the other (11), or being penetrated by protrusions (14) from the intermediate layer (12) which provide such pathways, the polymeric film support, intermediate layer and adhesive layer all being resistant to temperatures up to 250 o C for up to 5 seconds.