公开(公告)号：EP1659837B1

公开(公告)日：2007-11-28

申请号：EP05023091.1

申请日：2005-10-22

Applicant: Hirschmann Automotive GmbH

Inventor： Kreuter, Markus ,  Schmid, Martin

IPC: H05K1/00 ,  H05K3/32 ,  H01R9/22 ,  H01R9/24

CPC classification number: H01R9/2458 ,  H01R9/226 ,  H05K3/202 ,  H05K3/326 ,  H05K2201/0397

公开(公告)号：EP1601821A4

公开(公告)日：2007-03-14

申请号：EP04718225

申请日：2004-03-08

Applicant: MICRO RELAY HOLDINGS PTY LTD

Inventor： SEXTON BRETT ,  DAVIS THIMOTHY J

IPC: B81B3/00 ,  B81C1/00 ,  C25D5/12 ,  H05K3/40

CPC classification number: B81C1/00666 ,  B81B2201/018 ,  B81B2203/0118 ,  B81C2201/0167 ,  C25D5/12 ,  H01H2059/0081 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0338 ,  H05K2201/0397 ,  H05K2203/0726

Abstract: Curved out of plane metal components are formed on PCB substrates (11) by electroplating two layers (13, 14) of the same metal such that each layer has a different internal stress. This produces as curvature of the layer (13, 14) which enables coils, curved cantilever beams and springs to be fabricated. The amplitude and direction of curvature can be controlled by controlling the stress and thickness of each layer. The stress is controlled by controlling the composition of the electroplating bath.

公开(公告)号：EP1096843B1

公开(公告)日：2006-05-24

申请号：EP00402899.9

申请日：2000-10-19

Applicant: DAV

Inventor： Deviller, Cécile, c/o Sylea ,  Bitauld, Lionel, c/o Sylea ,  Razurel, Guy, c/o Sylea

IPC: H05K7/04 ,  H05K7/20 ,  B60R16/02

CPC classification number: H05K3/202 ,  H05K1/0203 ,  H05K1/144 ,  H05K7/20854 ,  H05K7/209 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/10166 ,  H05K2201/10969

公开(公告)号：EP1647051A2

公开(公告)日：2006-04-19

申请号：EP04734225.8

申请日：2004-05-21

Applicant: eupec Europäische Gesellschaft für Leistungshalbleiter mbH

Inventor： PASSE, Thomas ,  FERBER, Gottfried ,  SPECHT, Benedikt

IPC: H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H05K1/11

CPC classification number: H01L23/49861 ,  H01L24/49 ,  H01L25/16 ,  H01L2224/0603 ,  H01L2224/4903 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K3/4092 ,  H05K2201/0397 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A semiconductor power module has a support ( 1 ), whereon are formed conductor strips ( 5, 6, 7, 8 ) by applying a structure on an electrically conductive layer ( 3 ) applied on one side ( 2 ) of the support. A semiconductor power module can be manufactured easily and economically enabling several mounting technologies by using a homogeneous base support. Therefore, the conductor strips ( 5, 6, 7, 8 ), as integral elements of the conductor circuit have loose ends ( 6 a, 7 a, 8 a) detached from the side ( 2 ) of the support, the ends of the conductor strips extending outside the support ( 1 ) and forming external connections.

公开(公告)号：EP1601821A1

公开(公告)日：2005-12-07

申请号：EP04718225.8

申请日：2004-03-08

Applicant: Micro Relay Holdings Pty Ltd

Inventor： SEXTON, Brett,CSIRO ,  DAVIS, Thimothy J.,CSIRO

IPC: C25D5/12

CPC classification number: B81C1/00666 ,  B81B2201/018 ,  B81B2203/0118 ,  B81C2201/0167 ,  C25D5/12 ,  H01H2059/0081 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0338 ,  H05K2201/0397 ,  H05K2203/0726

Abstract: Curved out of plane metal components are formed on PCB substrates (11) by electroplating two layers (13, 14) of the same metal such that each layer has a different internal stress. This produces as curvature of the layer (13, 14) which enables coils, curved cantilever beams and springs to be fabricated. The amplitude and direction of curvature can be controlled by controlling the stress and thickness of each layer. The stress is controlled by controlling the composition of the electroplating bath.

公开(公告)号：EP1303575B1

公开(公告)日：2005-05-25

申请号：EP00990184.4

申请日：2000-11-16

Applicant: 3M Innovative Properties Company

Inventor： YANG, Rui ,  MAO, Guoping

IPC: C09K13/02 ,  H05K1/00 ,  H05K3/00

CPC classification number: C09K13/02 ,  C08J7/12 ,  H05K3/002 ,  H05K2201/0141 ,  H05K2201/0397 ,  H05K2203/0786 ,  Y10T428/249953 ,  Y10T428/249958 ,  Y10T428/249975 ,  Y10T428/249979

Abstract: A flexible circuit comprising a liquid crystal polymer film having through-holes and related shaped voids formed therein using an etchant composition comprising a solution in water of from 35 wt. % to 55 wt. % of an alkali metal salt; and from 10 wt. % to 35 wt. % of a solubilizer dissolved in the solution to provide the etchant composition suitable for etching the liquid crystal polymer at a temperature from 50 °C to 120 °C.

公开(公告)号：EP1524893A1

公开(公告)日：2005-04-20

申请号：EP04023145.8

申请日：2004-09-29

Applicant: C.R.F. Società Consortile per Azioni

Inventor： Faggioli, Eugenio ,  Groppo, Riccardo

IPC: H05K7/20 ,  H05K3/36 ,  H01L25/16

CPC classification number: H05K7/20472 ,  H01L23/5385 ,  H01L25/162 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0306 ,  H05K1/141 ,  H05K3/325 ,  H05K3/3421 ,  H05K3/368 ,  H05K2201/0397 ,  H05K2201/10393 ,  H01L2924/00014

Abstract: The unit (1) comprises:

a metal container (2), with a base plate or wall (2a) able to act as a heat dissipator;
a printed-circuit motherboard (3), facing the base plate or wall (2a) and housing a plurality of electric/electronic components or devices (4a);
an intermediate structure (5) including a support plate (6) arranged between the motherboard (3) and the base plate or wall (2a) and housing one or more electronic power components or devices (6a); and
mechanical and electrical coupling means (10; 110) arranged between the support plate (6) of the intermediate structure (5) and the motherboard (3) and comprising electrically conducting and mechanically resilient members (10; 110), able to act as elements providing an electric connection between devices (4a) of the motherboard (3) and devices (6a) of the intermediate structure (5), and as spring-loaded elements tending to push the intermediate structure (5) towards the base plate or wall (2a).

Abstract translation: 单元（1）包括：金属容器（2），具有能够用作散热器的基板或壁（2a）; 印刷电路母板（3），面向基板或壁（2a）并容纳多个电/电子部件或装置（4a）; 中间结构（5），包括布置在母板（3）和基板或壁（2a）之间的支撑板（6），并容纳一个或多个电子部件或装置（6a）; 以及布置在所述中间结构（5）的所述支撑板（6）和所述母板（3）之间并包括导电和机械弹性构件（10; 110）的机电耦合装置（10; 110） 在主板（3）的设备（4a）和中间结构（5）的设备（6a）之间提供电连接的元件以及倾向于将中间结构（5）推向基板或壁的弹簧加载元件 （2a）中。

公开(公告)号：EP1186478A3

公开(公告)日：2004-09-08

申请号：EP01307584.1

申请日：2001-09-06

Applicant: Sumitomo Wiring Systems, Ltd.

Inventor： Kasai, Koji, c/o Sumitomo Wiring Systems, Ltd.

IPC: B60R16/02 ,  H05K7/02 ,  B23K11/20

CPC classification number: H05K3/328 ,  H05K3/244 ,  H05K7/026 ,  H05K2201/0397 ,  H05K2201/10272 ,  Y10S439/949

Abstract: An electrical circuit for use in an electrical junction box of a vehicle, has two bus bars (15, 20) welded to each other at a weld. A first one of the bus bars is formed of a material having an electrical conductivity selected from (a) in the range 10 to 60% and (b) not less than 60%, and the second of the two bus bars is formed of a material having an electrical conductivity of not less than 60%. At least one of the bus bars is tin-plated and at the weld the bus bars are joined through a tin-plating layer. Appropriate selection of the bus bar material in view of current loads is achieved, and good welding.

公开(公告)号：EP1447846A2

公开(公告)日：2004-08-18

申请号：EP04010749.2

申请日：1995-11-13

Applicant: FormFactor, Inc.

Inventor： Khandros, Igor Y. ,  Mathieu, Gaetan L. ,  Eldridge, Benjamin, N. ,  Grube, Gary, W. ,  Dozier, Thomas, H.

IPC: H01L23/48 ,  H05K7/10 ,  H01R43/00

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: According to the invention a socket is provided for removably connecting a first electronic component (304) to a second electronic component (302). The socket comprises a plurality of elongate, resilient contact structures (320) extending away from a first surface (310a) of a support substrate (310), contact regions (320b) of said elongate, resilient contact structures (320) deflecting to form pressure connections with terminals (308) of the first electronic component (304); and a plurality of contact structures (314) disposed on the opposing surface (310b) of the support substrate (310), the plurality of contact structures permanently connected to terminals of the second electronic component (302), selected ones of the contact structures (314) are connected through the support substrate (310) to selected ones of the elongate, resilient contact structures (320). Each of the plurality of elongate contact structures of the socket comprises an elongate element (122) of a first material; and a second material (124) deposited on the first material, wherein the second material has a yield strength that is greater than a yield strength of the first material. Further a method for removably connecting a first electronic component (304) to a second electronic component (302) is provided.

Abstract translation: 根据本发明，提供了用于将第一电子部件（304）可拆卸地连接到第二电子部件（302）的插座。 插座包括从支撑衬底（310）的第一表面（310a）延伸的多个细长的弹性接触结构（320），所述细长弹性接触结构（320）的接触区域（320b）偏转以形成压力 与第一电子部件（304）的端子（308）的连接; 以及设置在所述支撑基板（310）的相对表面（310b）上的多个接触结构（314），所述多个接触结构永久地连接到所述第二电子部件（302）的端子，所述接触结构 314）通过支撑衬底（310）连接到细长的弹性接触结构（320）中的选定的一个。 插座的多个细长接触结构中的每一个包括第一材料的细长元件（122） 和沉积在第一材料上的第二材料（124），其中第二材料的屈服强度大于第一材料的屈服强度。 此外，提供了一种用于可拆卸地将第一电子部件（304）连接到第二电子部件（302）的方法。

公开(公告)号：EP1424748A2

公开(公告)日：2004-06-02

申请号：EP04002310.3

申请日：1995-06-07

Applicant: TESSERA, INC.

Inventor： Fjelstad, Joseph ,  Smith, John W. ,  Distefano, Thomas, H. ,  Zaccardi, James ,  Walton, Christian, A.

IPC: H01R12/12 ,  G01R1/04

CPC classification number: H05K7/1084 ,  G01R1/0466 ,  G01R1/06711 ,  G01R1/06733 ,  G01R1/06738 ,  G01R1/06744 ,  G01R1/07357 ,  G01R3/00 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/13109 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/8114 ,  H01L2224/81899 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/351 ,  H01R4/028 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/7076 ,  H01R12/714 ,  H01R13/2407 ,  H01R13/2464 ,  H01R13/2485 ,  H05K1/118 ,  H05K3/326 ,  H05K3/3431 ,  H05K3/3436 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

Abstract: A connector for microelectronic elements includes a sheet-like body (3) having a plurality of holes (36), desirably arranged in a regular grid pattern. Each hole is provided with a resilient laminar contact (38) having a plurality of projections (42) extending inwardly over the hole in the body. Microelectronic elements (68) having bump leads (70) such as solder balls thereon may be engaged with the connector by advancing the bump leads into the holes of the connector to engage the bump leads with the contacts. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.

Abstract translation: 用于微电子元件的连接器包括具有多个孔（36）的片状体（3），期望地布置成规则的格子图案。 每个孔设置有弹性层状接触件（38），其具有向内延伸到主体中的孔的多个突起（42）。 具有诸如其上的焊球的凸起引线（70）的微电子元件（68）可以通过使凸块引线进入连接器的孔而与连接器接合，以使触点与触点接合。 可以测试组件，如果发现可接受，则凸块引线可以永久地粘合到触点上。