公开(公告)号：EP1753276B1

公开(公告)日：2010-04-21

申请号：EP06254143.8

申请日：2006-08-08

Applicant: Mitsubishi Electric Corporation

Inventor： Miura, Tsuyoshi c/o Mitsubishi Elec. Corporation

IPC: H05K3/34

CPC classification number: H05K3/3421 ,  H05K3/3468 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10689 ,  H05K2203/046 ,  Y02P70/613

公开(公告)号：EP2152050A1

公开(公告)日：2010-02-10

申请号：EP09167291.5

申请日：2009-08-05

Applicant: CANON KABUSHIKI KAISHA

Inventor： Hayashi, Seiji

IPC: H05K1/11 ,  H05K1/02 ,  H01L23/498

CPC classification number: H05K1/116 ,  H01L23/49827 ,  H01L23/50 ,  H01L2924/0002 ,  H05K1/0265 ,  H05K2201/0969 ,  H05K2201/09727 ,  H05K2201/09745 ,  H05K2201/0979 ,  H05K2201/10734 ,  H01L2924/00

Abstract: Provided is a multilayer printed wiring board (1) in which multiple via holes (4 to 7) that connect a first power supply wiring (2) with a second power supply wiring (3) are aligned in a line in parallel to a direction along which current flows. In order to prevent current from being concentrated on the via hole (4) connected to a farthest end of the power supply wiring (2) among the via holes (4 to 7), a narrow portion (8) between the via hole (4) and the via hole (5) is narrowed to increase a resistance. A narrow portion (9) that is narrowed is disposed similarly at a farthest end of the power supply wiring (3) of the second conductor layer.

Abstract translation: 提供了一种多层印刷布线板（1），其中连接第一电源布线（2）和第二电源布线（3）的多个通孔（4至7）沿着与沿着 哪个电流流过。 为了防止电流集中在与通孔（4〜7）中的电源配线（2）的最远端连接的通孔（4）上，通孔（4）之间的狭窄部分（8） ）并且通孔（5）变窄以增加电阻。 狭缝部分（9）类似地设置在第二导体层的电源配线（3）的最远端。

公开(公告)号：EP1824911B1

公开(公告)日：2008-08-13

申请号：EP05854264.8

申请日：2005-12-14

Applicant: EASTMAN CHEMICAL COMPANY

Inventor： PECORINI, Thomas, Joseph ,  MCWILLIAMS, Douglas, Stephens ,  GILLIAM, Spencer, Allen ,  TINCHER, Mark, Elliott ,  TANNER, Candace, Michele

IPC: C08J5/18

CPC classification number: H05K1/0326 ,  C08J5/18 ,  C08J2367/02 ,  H05K1/0393 ,  H05K1/116 ,  H05K3/281 ,  H05K3/386 ,  H05K3/429 ,  H05K2201/0145 ,  H05K2201/0969 ,  H05K2201/099 ,  Y10T428/1086 ,  Y10T428/2852 ,  Y10T428/31504 ,  Y10T428/31507 ,  Y10T428/31786

Abstract: Disclosed is a biaxially-oriented polyester film produced from a polyester comprising: (1) diacid residues comprising between about 95 and about 100 mole percent of terephthalic acid residues; (2) diol residues comprising between about 95 and about 100 mole percent of 1,4-­cyclohexanedimethanol residues; and (3) about 0.5 to about 5 mole percent of another dicarboxylic acid or diol residue, wherein the polyester comprises a total of 100 mole percent diacid residues and a total of 100 mole percent diol residues. In one embodiment, the biaxially-oriented film has a thickness of 70 to 150 microns (3-5 mils). In another embodiment, the biaxially-oriented film undergoes not more than 3% shrinkage when immersed for 10 seconds in a solder bath preheated to 260°C. The film can be made by stretching an essentially amorphous cast-film of thickness between about 450-1800 micron (18-70 mil) at a ratio from about 2.5x2.5 to 3.5x3.5 while being held at a temperature between 90°C and 130°C, and heat-setting the stretched film at an actual film temperature of from 260°C to Tm, where Tm is the melting point of the polyester as measured by differential scanning calorimetry (DSC), while maintaining the dimensions of the stretched film.

公开(公告)号：EP1938674A2

公开(公告)日：2008-07-02

申请号：EP06826319.3

申请日：2006-10-20

Applicant: McKinzie, William E. III.

Inventor： McKinzie, William E. III.

IPC: H05K1/02

CPC classification number: H01P1/20 ,  H01P1/2005 ,  H05K1/0218 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0236 ,  H05K1/0239 ,  H05K1/162 ,  H05K1/165 ,  H05K1/181 ,  H05K2201/093 ,  H05K2201/09318 ,  H05K2201/09609 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/0969 ,  H05K2201/09718 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: A hybrid electromagnetic bandgap (EBG) structure for broadband suppression of noise on printed wiring boards includes an array of coplanar patches interconnected into a grid by series inductances, and a corresponding array of shunt LC networks connecting the coplanar patches to a second conductive plane. This combination of series inductances and shunt resonant vias lowers the cutoff frequency for the fundamental stopband. The series inductances and shunt capacitances may be implemented using surface mount component technology, or printed traces. Patches may also be interconnected by coplanar coupled transmission lines. The even and odd mode impedances of the coupled lines may be increased by forming slots in the second conductive plane disposed opposite to the transmission line, lowering the cutoff frequency and increasing the bandwidth of the fundamental stopband. Coplanar EBG structures may be integrated into power distribution networks of printed wiring boards for broadband suppression of electromagnetic noise.

公开(公告)号：EP1891843A1

公开(公告)日：2008-02-27

申请号：EP06764434.4

申请日：2006-06-15

Applicant: Imbera Electronics Oy

Inventor： TUOMINEN, Risto ,  IIHOLA, Antti ,  PALM, Petteri

IPC: H05K1/00 ,  H05K1/11 ,  H05K3/42 ,  H05K3/46

CPC classification number: H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H05K1/183 ,  H05K1/186 ,  H05K1/187 ,  H05K3/0017 ,  H05K3/20 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/423 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2201/10674 ,  H05K2203/0554 ,  H05K2203/0733 ,  H05K2203/1438 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49158 ,  H01L2924/00

Abstract: This publication discloses a method for manufacturing a circuit-board structure. According to the method, a conductor pattern (13) is made, and contact openings are made in it for a component's (16) electrical contacts. After this, the component (16) is attached relative to the conductor pattern (13), in such a way that the contact areas or contact bumps of the component lie next to the contact openings. After this, an electrically conductive material is introduced to the contact openings, in order to form electrical contacts between the conductor pattern (13) and the component (16).

公开(公告)号：EP1827068A3

公开(公告)日：2007-10-03

申请号：EP07075317.3

申请日：1998-01-23

Applicant: IBIDEN CO., LTD.

Inventor： Takada, Masaru c/o Ibiden Co., Ltd. ,  Tsukada, Kiyotaka c/o Ibiden Co., Ltd. ,  Kobayashi, Hiroyuki c/o Ibiden Co., Ltd. ,  Minoura, Hisashi c/o Ibiden Co., Ltd. ,  Ukai, Yoshikazu c/o Ibiden Co., Ltd. ,  Kondo, Mitsuhiro c/o Ibiden Co., Ltd.

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4652 ,  H01L21/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/0271 ,  H05K1/0366 ,  H05K1/112 ,  H05K1/116 ,  H05K1/182 ,  H05K3/0035 ,  H05K3/0061 ,  H05K3/3468 ,  H05K3/3484 ,  H05K3/385 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/428 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2203/0315 ,  H05K2203/041 ,  H05K2203/0554 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: A printed wiring board (802) comprising an insulating substrate (806), a conductor pattern formed on a surface of the insulating substrate (806), a solder filling hole (801) passing through the insulating substrate (806) and arriving at an upper surface of the conductor pattern (851) and a solder (807) filled in the solder filling hole (801), characterized in that the insulating substrate (806) includes fibers (861) therein, and end portions (863) of the fibers (861) protrude from a wall face (810) of the solder filling hole (801) and encroach into the solder (807).

Abstract translation: 一种印刷线路板（802），包括：绝缘基板（806）;在绝缘基板（806）的表面上形成的导体图案;贯通绝缘基板（806）并到达上部 （801）和填充在所述焊料填充孔（801）中的焊料（807），其特征在于，所述绝缘基底（806）中包括纤维（861），所述纤维（861）的端部（863） 861）从焊料填充孔（801）的壁面（810）突出并侵入到焊料（807）中。

公开(公告)号：EP1445999B1

公开(公告)日：2007-10-03

申请号：EP03388025.3

申请日：2003-04-25

Applicant: Sony Ericsson Mobile Communications AB

Inventor： Fagrenius, Gustav ,  Bengtsson, Henrik ,  Sandevi, Tommy ,  Hermann, Fredrik ,  Andersson, Niklas ,  Meynert, Hans

IPC: H05K9/00

CPC classification number: H05K9/0028 ,  H05K3/341 ,  H05K3/3484 ,  H05K2201/09036 ,  H05K2201/0969 ,  H05K2201/10371 ,  Y02P70/613

公开(公告)号：EP1827069A2

公开(公告)日：2007-08-29

申请号：EP07075315.7

申请日：1998-01-23

Applicant: IBIDEN CO., LTD.

Inventor： Takada, Masaru, c/o Ibiden Co., Ltd. ,  Tsukada, Kiyotaka, c/o Ibiden Co., Ltd. ,  Kobayashi, Hiroyuki, c/o Ibiden Co., Ltd. ,  Minoura, Hisashi, c/o Ibiden Co., Ltd. ,  Ukai, Yoshikazu, c/o Ibiden Co., Ltd. ,  Kondo, Mitsuhiro, c/o Ibiden Co., Ltd.

IPC: H05K3/46

CPC classification number: H05K3/4652 ,  H01L21/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/0271 ,  H05K1/0366 ,  H05K1/112 ,  H05K1/116 ,  H05K1/182 ,  H05K3/0035 ,  H05K3/0061 ,  H05K3/3468 ,  H05K3/3484 ,  H05K3/385 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/428 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2203/0315 ,  H05K2203/041 ,  H05K2203/0554 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: In the production of a printed wiring board comprising innerlayer conductor circuits 161, 131 arranged among insulating layers 101~103 and blind via-holes 141, 142 formed from an outermost surface of the insulating layer toward the innerlayer conductor circuit, an opening hole 160 is previously formed in a central portion of the innerlayer conductor circuit 161 located at the bottom of the blind via-hole 141, and laser beams are irradiated from the outermost surface of the insulating layer to form the blind via-holes 141, 142. Thereafter, a metal plated film is formed on surfaces of the innerlayer conductor circuits 13, 161 and the blind via-holes 141, 142.

Abstract translation: 在包括布置在绝缘层101〜103之间的内层导体电路161,131和从绝缘层的最外表面朝向内层导体电路形成的盲通孔141,142的印刷线路板的制造中，开孔160是 预先形成在位于盲通孔141底部的内层导体电路161的中心部分，并且从绝缘层的最外表面照射激光束以形成盲通孔141,142。之后， 在内层导体电路13,161和盲通孔141,142的表面上形成金属镀膜。

公开(公告)号：EP1816905A2

公开(公告)日：2007-08-08

申请号：EP07075316.5

申请日：1998-01-23

Applicant: IBIDEN CO., LTD.

Inventor： Takada, Masaru, c/o Ibiden Co., Ltd. ,  Tsukada, Kiyotaka, c/o Ibiden Co., Ltd. ,  Kobayashi, Hiroyuki, c/o Ibiden Co., Ltd. ,  Minoura, Hisashi, c/o Ibiden Co., Ltd. ,  Ukai, Yoshikazu, c/o Ibiden Co., Ltd. ,  Kondo, Mitsuhiro, c/o Ibiden Co., Ltd.

IPC: H05K3/46

CPC classification number: H05K3/4652 ,  H01L21/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/0271 ,  H05K1/0366 ,  H05K1/112 ,  H05K1/116 ,  H05K1/182 ,  H05K3/0035 ,  H05K3/0061 ,  H05K3/3468 ,  H05K3/3484 ,  H05K3/385 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/428 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2203/0315 ,  H05K2203/041 ,  H05K2203/0554 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: In the production of a printed wiring board comprising innerlayer conductor circuits 161, 131 arranged among insulating layers 101~103 and blind via-holes 141, 142 formed from an outermost surface of the insulating layer toward the innerlayer conductor circuit, an opening hole 160 is previously formed in a central portion of the innerlayer conductor circuit 161 located at the bottom of the blind via-hole 141, and laser beams are irradiated from the outermost surface of the insulating layer to form the blind via-holes 141, 142. Thereafter, a metal plated film is formed on surfaces of the innerlayer conductor circuits 13, 161 and the blind via-holes 141, 142.

Abstract translation: 一种在内层导体电路（562）上包括两个或多个绝缘层（516,518）的印刷电路板（501），从绝缘层（516）的最外表面延伸穿过两个或多个隔离层 形成在内层导体电路（562）的层（516,518）和形成在通孔（502）中的内部金属电镀膜（521），以便与内层导体电路（562）电连接到外部导体电路 ），其特征在于，具有围绕所述通孔（502）的开孔（540）的用于加强件的环形虚设焊盘（504）布置在面向所述两个或更多个绝缘层的边界部分（517）中 （516,518）彼此连接并连接到内部金属镀膜（521）。

公开(公告)号：EP1813137A1

公开(公告)日：2007-08-01

申请号：EP05786905.9

申请日：2005-09-13

Applicant: ROBERT BOSCH GMBH

Inventor： EVANS, Stephen

IPC: H05K3/46 ,  H01R9/24 ,  H01R13/11 ,  B60R16/02

CPC classification number: H01R9/2458 ,  H01R13/11 ,  H01R2201/26 ,  H05K2201/0969 ,  H05K2201/10272

Abstract: The invention relates to a method for electrically contacting electrically conductive punched grids (10,12), according to which at least one first and one second punched grid (10, 12) are brought into electrical contact with one another at least at one point. A contact lug (22) is configured on the first punched grid (10) and at least one recess (14) comprising at least one contact zone (16) is configured in the second punched grid (12). The contact lug (22) is inserted into the recess (14) in such a way that electric contact is made between the first and the second punched grid (10, 12) at least by means of the contact zone (16). The invention also relates to a corresponding assembly (20) of at least two electrically conductive punched grids (10, 12), at least one first and one second punched grid (10,12) making electric contact with one another at least at one point.