公开(公告)号：EP0152634A3

公开(公告)日：1986-06-11

申请号：EP84116514

申请日：1984-12-31

Applicant: HITACHI, LTD.

Inventor： Murakami, Kanji ,  Akahoshi, Haruo ,  Kawamoto, Mineo ,  Wajima, Motoyo ,  Matsuda, Yoichi ,  Kawakubo, Kyoji ,  Kanechiku, Minoru ,  Yoshimura, Toyofusa ,  Matsunaga, Makoto

IPC: H05K03/20 ,  H01F41/04 ,  H05K01/16

CPC classification number: H05K1/165 ,  H01F41/042 ,  H01L2221/68345 ,  H05K1/0393 ,  H05K3/205 ,  H05K2201/09881 ,  H05K2203/0152 ,  H05K2203/0726 ,  Y10T29/49155

Abstract: A method for the manufacture of a printing wiring board, which proves particularly useful as a printed coil, is characterized by the fact that in the work in process which has undergone the step for fomation of a conductor circuit and which has not undergone the step for separation of a plating resist, the plating resist and other insulating substratal material are separated for transfer from the surface of the substrate having the conductor circuit formed thereon. Since this method permits formation of an extremely thin insulating layer and a conductor circuit layer thicker than the insulating layer, it enables production of very thin printed wiring board and printed coil (8) having high circuit density in the surfaces of component layers as well as in the direction of superposition of component layers.

公开(公告)号：EP3223308A1

公开(公告)日：2017-09-27

申请号：EP15861673.0

申请日：2015-11-20

Applicant: NSK Ltd.

Inventor： SHIMAKAWA Shigeru ,  SUNAGA Takashi ,  SEKINE Takaaki ,  KOGURE Teruyoshi ,  SUZUKI Ryoichi

IPC: H01L23/36 ,  H01L23/12 ,  H01L23/48 ,  H01L23/50

CPC classification number: H01L23/49568 ,  B29C45/14065 ,  B29C2045/14122 ,  B62D5/0406 ,  G01R1/203 ,  H01L23/12 ,  H01L23/36 ,  H01L23/48 ,  H01L23/49524 ,  H01L23/49531 ,  H01L23/49537 ,  H01L23/49558 ,  H01L23/49861 ,  H01L23/50 ,  H01L24/34 ,  H01L24/37 ,  H01L25/071 ,  H01L28/20 ,  H01L2224/34 ,  H01L2224/37147 ,  H01L2224/37599 ,  H02K11/33 ,  H05K1/181 ,  H05K3/202 ,  H05K2201/09881 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: [Problem]
An object of the present invention is to provide an electronic part mounting heat-dissipating substrate which enables a circuit for which a power semiconductor in which a large current flows is used to reduce the wiring resistances of a large power operation and improve the heat dissipation.
[Means for Solving]
The present invention is an electronic part mounting heat-dissipating substrate which comprises: lead frames 110 of wiring pattern shapes on a conductor plate; and an insulating member 130 between the lead frames 110; wherein a plate surface of a part arrangement surface of the lead frames 110 and a top surface of the insulating member at a side of the part arrangement surface form one continuous surface, wherein the part arrangement surface is provided on both surfaces of the electronic part mounting heat-dissipating substrate, a reductant circuit which includes at least similar dual-system circuit is formed on the electronic part mounting heat-dissipating substrate, a first-system circuit of the dual-system circuit is formed on a first surface of the electronic part mounting heat-dissipating substrate, a second-system circuit of the dual-system circuit is formed on a second surface of the electronic part mounting heat-dissipating substrate, and the common lead frames which are commonly used in a portion of a circuit wiring are used to the first surface and the second surface of the electronic part mounting heat-dissipating substrate.

Abstract translation: 发明内容本发明的目的在于提供一种电子部件安装用散热基板，该电子部件安装用散热基板能够使用流过大电流的功率半导体的电路来降低大功率动作的布线电阻， 散热。 用于解决问题的手段本发明是一种电子部件安装散热基板，其包括：导体板上的布线图案形状的引线框110; 以及引线框架110之间的绝缘构件130; 其中引线框架110的部分布置表面的板表面和部分布置表面侧的绝缘构件的顶表面形成一个连续表面，其中部件布置表面设置在电子部件安装件的两个表面上 在所述电子部件安装散热基板上形成包括至少类似的双系统电路的还原电路，所述双系统电路的第一系统电路形成在所述电子部件的第一表面上 安装散热基板时，双系统电路的第二系统电路形成在电子部件安装散热基板的第二表面上，并且共同用于电路布线的一部分的公共引线框架是 用于电子部件安装散热基板的第一表面和第二表面。

公开(公告)号：EP1395102B1

公开(公告)日：2016-11-23

申请号：EP03018683.7

申请日：2003-08-22

Applicant: KURARAY CO., LTD.

Inventor： Tsugaru, Toshinori, Kuraray Co., Ltd. ,  Sunamoto, Tatsuya, Kuraray Co., Ltd. ,  Yoshikawa, Tadao, Kuraray Co., Ltd.

IPC: H05K3/46

CPC classification number: H05K3/4655 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4626 ,  H05K3/4652 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0195 ,  H05K2201/09881 ,  H05K2203/1189 ,  Y10T428/24917

公开(公告)号：EP2337171B1

公开(公告)日：2016-01-06

申请号：EP09819195.0

申请日：2009-10-06

Applicant: Showa Denko K.K.

Inventor： ONISHI, Mina ,  ISHIHARA, Yoshimitsu ,  INOUE, Hirofumi ,  AZUMA, Yukihiko

IPC: H01T4/10 ,  H01C7/10 ,  H05K1/02 ,  H01C7/12

CPC classification number: H01C7/12 ,  H01T4/10 ,  H05K1/0259 ,  H05K2201/09672 ,  H05K2201/09881

公开(公告)号：EP2816878A1

公开(公告)日：2014-12-24

申请号：EP13790895.0

申请日：2013-04-10

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： NISHIDA, Tomohiro ,  MORI, Seiji ,  WAKAZONO, Makoto

IPC: H05K3/34 ,  H01L23/12 ,  H05K3/28

CPC classification number: H05K1/0213 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/244 ,  H05K3/28 ,  H05K3/3452 ,  H05K2201/09881 ,  H05K2201/099 ,  H05K2203/0571 ,  H05K2203/0588 ,  H01L2924/00012 ,  H01L2924/00

Abstract: To provide a wiring substrate which can prevent short circuit between connection terminals, and which realizes reduction of the pitch between the connection terminals. The wiring substrate of the present invention includes a layered structure including one or more insulation layers and one or more conductor layers, and the wiring substrate is characterized in that a plurality of connection terminals are formed on the layered structure so as to be separated from one another; a filling member is filled between the connection terminals; and each of the connection terminals has a side surface composed of a contact surface which is in contact with the filling member, and a spaced surface which is not in contact with the filling member and which is located above the contact surface and below the top surface of the filling member.

Abstract translation: 提供一种能够防止连接端子之间短路并且实现连接端子之间的间距减小的布线基板。 本发明的布线基板包括包括一个或多个绝缘层和一个或多个导体层的分层结构，并且布线基板的特征在于多个连接端子形成在分层结构上以便与一个 另一个; 填充构件填充在连接端子之间; 并且每个连接端子具有由与填充构件接触的接触表面构成的侧表面以及不与填充构件接触并且位于接触表面上方且在顶表面下方的隔开表面 的填充构件。

公开(公告)号：EP2632237A1

公开(公告)日：2013-08-28

申请号：EP12817081.8

申请日：2012-05-16

Applicant: NGK Sparkplug Co., Ltd.

Inventor： ITO, Tatsuya ,  MORI, Seiji ,  HAYASHI, Takahiro ,  WAKAZONO, Makoto ,  NISHIDA, Tomohiro

IPC: H05K3/34 ,  H05K3/28 ,  H05K3/38 ,  H05K3/46

CPC classification number: H05K1/0213 ,  H01L23/145 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/4007 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/09881 ,  H05K2201/099 ,  H05K2201/09918 ,  Y02P70/611 ,  H01L2924/00

Abstract: A wiring substrate according to the present invention includes a laminate of one or more insulation layers and one or more conductive layers and further includes a plurality of connection terminals formed on the laminate and spaced apart from one another, each having a step formed at the outer periphery of a first main surface opposite a contact surface in contact with the laminate, and a filling member provided in a filling manner between the convection terminals.

Abstract translation: 根据本发明的布线基板包括一个或多个绝缘层和一个或多个导电层的层叠体，并且还包括形成在层压体上并彼此间隔开的多个连接端子，每个连接端子形成在外部 与层叠体接触的接触表面相对的第一主表面的周边，以及以对流端子之间的填充方式设置的填充构件。

公开(公告)号：EP1856723B1

公开(公告)日：2013-05-01

申请号：EP06737501.4

申请日：2006-03-06

Applicant: Sanmina-SCI Corporation

Inventor： DUDNIKOV, George, Jr.

IPC: H05K3/42 ,  H05K1/02 ,  H05K1/16 ,  H05K3/18

CPC classification number: H05K3/429 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/116 ,  H05K1/167 ,  H05K3/184 ,  H05K3/422 ,  H05K2201/0187 ,  H05K2201/0738 ,  H05K2201/096 ,  H05K2201/09645 ,  H05K2201/09718 ,  H05K2201/09881 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

公开(公告)号：EP1843650B1

公开(公告)日：2012-03-07

申请号：EP07013524.9

申请日：1999-07-30

Applicant: Ibiden Co., Ltd.

Inventor： Hirose, Naohiro ,  Noda, Kouta ,  Segawa, Hiroshi ,  En, Honjin ,  Tsukada, Kiyotaka ,  Ishida, Naoto ,  Asano, Kouji ,  Shouda, Atsushi

IPC: H05K3/46 ,  H05K3/00 ,  H05K3/38 ,  B23K26/38

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

公开(公告)号：EP2006909A4

公开(公告)日：2011-08-10

申请号：EP07745152

申请日：2007-06-13

Applicant: PANASONIC CORP

Inventor： TSUMURA TETSUYA ,  NISHIYAMA HIROHARU ,  TSUJIMOTO ETSUO

IPC: H01L23/36 ,  H01L23/12 ,  H05K1/02 ,  H05K3/06 ,  H05K3/08

CPC classification number: H05K3/202 ,  H01L23/3737 ,  H01L23/49861 ,  H01L24/81 ,  H01L2924/12042 ,  H01L2924/15747 ,  H05K1/0373 ,  H05K1/056 ,  H05K3/027 ,  H05K3/06 ,  H05K2201/0209 ,  H05K2201/0376 ,  H05K2201/09118 ,  H05K2201/098 ,  H05K2201/09881 ,  H05K2201/10106 ,  H05K2203/0369 ,  H05K2203/1476 ,  H01L2924/00

公开(公告)号：EP2086299A1

公开(公告)日：2009-08-05

申请号：EP09156837.8

申请日：2000-05-25

Applicant: IBIDEN CO., LTD.

Inventor： Asai, Motoo ,  Wang, Dongdong ,  Mori, Takahiro

IPC: H05K3/46

CPC classification number: H05K3/423 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K1/036 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/381 ,  H05K3/385 ,  H05K3/387 ,  H05K3/388 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/0315 ,  H05K2203/0733 ,  H05K2203/0773 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599

Abstract: A multi-layer printed circuit board comprising: a core substrate having through holes for connecting the upper and lower surfaces to each other and having a structure that interlayer resin insulating layers and conductor circuits are alternately laminated on said core substrate, wherein
through holes having different diameters are formed in said core substrate.

Abstract translation: 一种多层印刷电路板，包括：具有通孔的上表面和下表面连接到海誓山盟和具有结构做了层间树脂绝缘层和导体电路交替层叠在所述核心基板，worin通过具有不同的孔的核心基板 直径在形成在所述核心基板。