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公开(公告)号：EP1566846A3
公开(公告)日：2009-08-19
申请号：EP05011759.7
申请日：1998-07-27
发明人： Arndt, Karlheinz
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L25/0753 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/01068 , H01L2924/12041 , H01L2924/00014
摘要： Optoelektronisches Bauelement, bei dem ein optoelektronischer Chip (1) auf einem Chipträgerteil (2) eines Leadframe (7) befestigt ist, bei dem der Leiterrahmen (7) einen in einem Abstand zum Chipträgerteil (2) angeordneten Anschlussteil (8) aufweist, der mit einem elektrischen Kontakt des optoelektronischen Chips (7) elektrisch leitend verbunden ist. Der Chipträgerteil (2) weist zur verbesserten Ableitung der Wärme vom Chip (1) eine Mehrzahl von externen Anschlüssen (4,5,6) auf, die an verschiedenen, einen Abstand voneinander aufweisenden Stellen einer Umhüllung (3) aus dieser herausragen.
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公开(公告)号：EP1414066B1
公开(公告)日：2009-07-29
申请号：EP03023086.6
申请日：2003-10-15
IPC分类号： H01L25/07 , G01R31/316 , G01R31/28 , G01R31/04 , G01R31/27 , H01L23/498 , H01L23/544 , H01L25/16
CPC分类号： G01R31/2853 , G01R31/046 , G01R31/275 , H01L22/34 , H01L23/49844 , H01L24/06 , H01L24/48 , H01L24/49 , H01L25/072 , H01L25/16 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05647 , H01L2224/0603 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49111 , H01L2224/49113 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01055 , H01L2924/01058 , H01L2924/01068 , H01L2924/12043 , H01L2924/1301 , H01L2924/13055 , H01L2924/13091 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
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公开(公告)号：EP1487017A3
公开(公告)日：2009-07-08
申请号：EP04102546.1
申请日：2004-06-04
申请人： Nokia Corporation
发明人： Nurminen, Janne T
IPC分类号： H01L23/498 , H01L23/367
CPC分类号： H01L23/49827 , H01L23/3677 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05599 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/49175 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01087 , H01L2924/14 , H01L2924/15173 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： An IC package dissipates thermal energy using thermally and electrically conductive projections. The IC package includes a substrate material with a die pad area, which is suitable to support an integrated circuit. A plurality of solder ball pads is disposed on a first surface of the substrate material and a plurality of conductive projections radiate outwardly from the die pad area and extend to cover a corresponding selected solder ball pad to facilitate the dissemination of thermal energy from the die pad area to the substrate and/or printed wiring board.
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公开(公告)号：EP2061071A2
公开(公告)日：2009-05-20
申请号：EP08018435.1
申请日：2008-10-22
CPC分类号： H01L24/40 , H01L21/56 , H01L23/3121 , H01L23/3735 , H01L23/49833 , H01L23/4985 , H01L24/27 , H01L24/32 , H01L24/37 , H01L24/75 , H01L24/83 , H01L24/92 , H01L25/072 , H01L25/50 , H01L2224/2402 , H01L2224/24226 , H01L2224/2732 , H01L2224/29294 , H01L2224/293 , H01L2224/29339 , H01L2224/371 , H01L2224/40225 , H01L2224/751 , H01L2224/75315 , H01L2224/83101 , H01L2224/83136 , H01L2224/83192 , H01L2224/83801 , H01L2224/8384 , H01L2224/9221 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01047 , H01L2924/01068 , H01L2924/014 , H01L2924/12044 , H01L2924/00
摘要： Die Erfindung betrifft ein Verfahren zur Herstellung einer Halbleiterbaugruppe mit den wesentlichen Schritten: Ausbildung einer Anordnung mit mindestens einem Halbleiterbauelement, mit mindestens einer Anschlusseinrichtung und mit mindestens einem dazwischen angeordneten Verbindungsmittel; Vollständige oder teilweise Umhüllung der Anordnung; Ausbildung einer stoffschlüssigen Verbindung des mindestens einen Halbleiterbauelements und der mindestens einen Anschlusseinrichtung.
摘要翻译： 所述方法包括显影具有半导体元件（30）的布置，并且入口单元和紧固件（20）布置在它们之间。 该布置完全或部分地包覆。 形成半导体元件和存取单元的牢固结合的连接。 紧固件形成为焊接板或焊膏，并且通过丝网印刷技术施加在半导体元件或存取单元的主表面上。
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65.发明公开Verlegevorrichtung, Kontaktiervorrichtung, Zustellsystem, Verlege- und Kontaktiereinheit, herstellungsanlage, Verfahren zur Herstellung und eine Transpondereinheit 审中-公开用于制备和一个应答器单元铺设设备，接触，递送系统，铺设和接触，制造设备，处理
公开(公告)号：EP2039460A2
公开(公告)日：2009-03-25
申请号：EP08170034.6
申请日：2005-10-27
申请人： HID Global GmbH
发明人： Lang, Ulrich
CPC分类号： H01L24/78 , B23K20/005 , B23K20/106 , H01L24/45 , H01L2224/45147 , H01L2224/78301 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01052 , H01L2924/01057 , H01L2924/01068 , H01L2924/12042 , H01L2924/19043 , H05K13/06 , Y10T29/49018 , Y10T29/5313 , Y10T29/53174 , Y10T29/53261 , H01L2924/00 , H01L2224/48
摘要： Offenbart ist eine Verlegevorrichtung zum Verlegen von Drahtwicklungen bei Transpondereinheiten mit einer axialen Drahtzuführung zur Verlegevorrichtung, eine Kontaktiervorrichtung zum Kontaktieren der Drähte mit einer selbsttätigen Thermodenklemmanordnung, ein Zustellsystem zum Zustellen von Bearbeitungsvorrichtungen mit einem Piezo-Leg-Motor, eine Herstellungsanlage zur Herstellung von Transpondereinheiten in Konsolenbauweise, ein Verfahren zur Herstellung von Transpondereinheiten mit horizontaler Ultraschalleinleitung und eine Transpondereinheit, bei der die Drahtenden direkt an den Anschlussflächen des Chips angreifen.
摘要翻译： 甲超声焊极（12）被设置用于在基板（6）上敷设的导线（4）。 超声换能器（10）适用超声波至超声焊极。 线相对于敷设装置轴向进给。 的导向通道（14）被同轴地设置在铺设设备用于引导导线。 金属丝优选地在通道中通过空气悬架（48）的方式被引导。 独立权利要求中包括了一个接触装置中，铺设设备输送系统，铺设和接触单元，制造系统，制造应答器单元的方法，和一个应答单元。
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公开(公告)号：EP2018664A1
公开(公告)日：2009-01-28
申请号：EP07722445.9
申请日：2007-05-16
发明人： PLÖSSL, Andreas , ILLEK, Stefan
IPC分类号： H01L21/58
CPC分类号： H05K3/321 , H01L24/27 , H01L24/32 , H01L24/48 , H01L24/83 , H01L33/0079 , H01L33/20 , H01L2224/26145 , H01L2224/27013 , H01L2224/32057 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83051 , H01L2224/83385 , H01L2224/838 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/10155 , H01L2924/10158 , H01L2924/12036 , H01L2924/12041 , H01L2924/12044 , H01L2924/15788 , H01L2924/19043 , H05K2201/0373 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Device with a first component (5) with a first surface (6), a second component (8) with a second surface (9), and a connecting layer (7) between the first surface (6) of the first component (5) and the second surface (9) of the second component (8), in which the connecting layer (7) comprises an electrically insulating adhesive, and an electrically conducting contact exists between the first surface (6) of the first component (5) and the second surface (9) of the second component (8).
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67.发明授权
公开(公告)号：EP1324389B1
公开(公告)日：2008-12-10
申请号：EP03003230.4
申请日：1999-07-06
IPC分类号： H01L23/48 , H01L23/482 , H01L23/485 , H01L21/60 , H01L23/532 , H01L23/31
CPC分类号： H01L24/10 , H01L24/03 , H01L24/05 , H01L24/13 , H01L2224/0401 , H01L2224/05599 , H01L2224/13 , H01L2224/13099 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01032 , H01L2924/01033 , H01L2924/01068 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/351 , H05K3/321 , H05K3/3436 , H05K2201/0212 , H05K2201/10234 , H05K2201/10992 , Y02P70/613 , Y10T29/49117 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49798 , Y10T156/1089 , H01L2924/00
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68.发明公开Verfahren zum Herstellen eines Anschlusskontaktes an einem Halbleiterbauelement für die Leistungselektronik und elektronisches Bauteil mit einem auf diese Weise an einem Halbleiterbauelement hergestellten Anschlusskontakt 审中-公开制造用于电力电子和电子元件的半导体器件上的连接接触，以这种方式的半导体装置的连接端子而得到的产品的方法
公开(公告)号：EP1988569A2
公开(公告)日：2008-11-05
申请号：EP07008553.5
申请日：2007-04-26
IPC分类号： H01L21/60 , H01L21/607 , H01L23/49 , B23K20/10
CPC分类号： H01L24/01 , B23K20/12 , B23K2201/40 , H01L24/37 , H01L24/40 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/91 , H01L2224/2402 , H01L2224/24226 , H01L2224/371 , H01L2224/37599 , H01L2224/48091 , H01L2224/48463 , H01L2224/4903 , H01L2224/49051 , H01L2224/73219 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/85205 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01068 , H01L2924/014 , H01L2924/1301 , H01L2924/13055 , H01L2924/00 , H01L2224/45099
摘要： Bei einem Verfahren zum Herstellen eines Anschlusskontaktes an einem Halbleiterbauelement (2) für die Leistungselektronik wird das Halbleiterbauelement (2) auf zumindest einer seiner Flachseiten (8, 12) mit einem Reibschweißverfahren mit einem metallischem Kontaktelement (22) verschweißt.
摘要翻译： 在一个过程，用于创建电源向半导体部件（2），金属接触部（22）是摩擦焊接到所述平坦的侧面（8）的半导体E.G. thrysistor。 在摩擦焊接过程通过超声波排放实现。 进一步声称是结合一个摩擦焊接接触的电子半导体装置。
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69.发明公开
公开(公告)号：EP1969631A2
公开(公告)日：2008-09-17
申请号：EP06780488.0
申请日：2006-09-12
申请人： Micro Components Ltd
发明人： MIRSKY, Uri , NEFTIN, Shimon , FURER, Lev
IPC分类号： H01L27/01
CPC分类号： H01L33/64 , H01L23/3677 , H01L23/3735 , H01L24/48 , H01L25/0753 , H01L33/62 , H01L33/641 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48465 , H01L2924/00014 , H01L2924/01004 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01055 , H01L2924/01063 , H01L2924/01068 , H01L2924/01078 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H05K1/021 , H05K1/053 , H05K3/445 , H05K2201/09745 , H05K2201/10106 , H05K2203/0315 , H05K2203/049 , H05K2203/1142 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A LED (Light Emitting Diode) substrate and packaging for a single diode or a diode array is disclosed. Described herein is a substrate (200) with direct metal connection of low thermal path between a die and a bottom surface of the substrate. The substrate comprises an aluminum conductive area (202) enclosed by anodized aluminum oxide isolation structures (204). The resulting substrate and packaging afford the required electrical interconnections and enhanced thermal performance while maintaining excellent mechanical properties. The same substrate and packaging concepts can be applied for other high power devices requiring high thermal conductivity substrate and package.
摘要翻译： 描述了用于单个二极管或二极管阵列的LED（发光二极管）基板和封装。 衬底包括用于容纳二极管管芯的成形空腔（或空腔）形式的二极管的整体反射器。 反射器腔壁可以可选地镀有反射材料，并且可以包括用作透镜和密封剂的模制材料。 还描述了一种用于在管芯和衬底的底表面之间构建具有低热路径的直接金属连接的衬底的方法。 另一个实施例是两个电迹线彼此交叉而不需要两层互连结构。 基板和反射器结构由铝 - 铝氧化物组合物构成，应用本领域已知的技术作为ALOX技术。 所得到的基底和包装提供所需的电互连和增强的热性能，同时保持优异的机械性能。 相同的基板和封装概念可以应用于需要高导热性基板和封装的其他大功率器件。
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公开(公告)号：EP1411553A4
公开(公告)日：2008-09-03
申请号：EP02747659
申请日：2002-07-12
申请人： HITACHI LTD
发明人： SATOH TOSHIYA , OGINO MASAHIKO , MIWA TAKAO , NAITOU TAKASHI , NAMEKAWA TAKASHI , NABATAME TOSHIHIDE , MOTOWAKI SHIGEHISA
IPC分类号： H01F17/00 , H01L23/498 , H01L27/06 , H01L27/08 , H05K1/16 , H05K3/28 , H05K3/34 , H05K3/46 , H01L27/01 , H01G4/40
CPC分类号： H01L27/13 , H01F17/0006 , H01L23/49822 , H01L23/49827 , H01L27/016 , H01L27/0676 , H01L27/08 , H01L2224/16 , H01L2924/01021 , H01L2924/01025 , H01L2924/01057 , H01L2924/01063 , H01L2924/01066 , H01L2924/01067 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/12044 , H01L2924/19011 , H01L2924/3011 , H01L2924/3025 , H05K1/16 , H05K1/162 , H05K1/165 , H05K1/167 , H05K3/28 , H05K3/3457 , H05K3/4602 , H05K3/4644 , H05K2201/09536 , H05K2201/09827 , H01L2924/00
摘要： A low-cost, small, high-performance electronic circuit component which restricts an increase in the size of a module and a rise in mounting costs due to the substrate mounting of a single passive element, is high in reliability, is excellent in production yield, and integrates at high density a variety of electronic parts such as a capacitor, inductor and resistor. An electronic circuit component characterized by comprising an insulating substrate, a capacitor element consisting of a plurality of electrodes provided on the insulating substrate and having areas different from one another and dielectric materials interposed between them, one or a plurality of elements selected from an inductor element and a resistor element, a metal wiring connecting the elements, a metal terminal unit forming a part of the metal wiring, and an organic insulating material surrounding metal wiring portions excluding the elements and the metal terminal unit.
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