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    Multilayer printed circuit board and method of manufacturing the same
    31.
    发明专利
    Multilayer printed circuit board and method of manufacturing the same 审中-公开
    多层印刷电路板及其制造方法

    公开(公告)号：JP2011077537A

    公开(公告)日：2011-04-14

    申请号：JP2010262261

    申请日：2010-11-25

    Applicant: Samsung Electro-Mechanics Co Ltd ,  サムソン エレクトロ−メカニックス カンパニーリミテッド.

    Inventor： MOK JEE SOO ,  YOO JE GWANG ,  RYU CHANG SUP

    IPC: H05K3/46 ,  H01L23/12 ,  H05K3/06 ,  H05K3/40

    CPC classification number: H05K3/1258 ,  H01L2224/11 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09545 ,  H05K2201/096 ,  H05K2203/0568 ,  H05K2203/1152 ,  Y10T29/49156

    Abstract: PROBLEM TO BE SOLVED: To prevent a deflection of a substrate during and after the manufacturing thereof, and to obviate a separate PSR process by causing a support to prevent the deflection of the substrate and to have a function of a solder resist layer. SOLUTION: In a manufacturing method, a circuit pattern (56) is formed on both sides or one side of a copper-clad laminate plate, and after laminating a build-up layer (57) thereon, a solder resist layer (58) is formed on the top surface of the build-up layer (57). Thus, an insulating resin layer (50) having via holes (54) and in which a first circuit layer including the circuit pattern (56) is formed on one surface and a second circuit layer including a solder ball mounting connection pad projecting over the via hole (54) is formed, the build-up layer (57) including a number of insulating layers and a number of circuit layers formed on the first circuit layer, and the solder resist layer (58) formed on the outermost layer of the build-up layer (57) are included. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题：为了防止在其制造期间和之后的基板的偏转，并且通过使支撑件防止基板的偏转并且具有阻焊层的功能而消除单独的PSR工艺 。 解决方案：在制造方法中，电路图案（56）形成在覆铜层压板的两侧或一侧上，并且在层叠叠层之后，阻焊层（ 58）形成在积层（57）的顶表面上。 因此，具有通孔（54）的绝缘树脂层（50），其中包括电路图案（56）的第一电路层形成在一个表面上，第二电路层包括在通孔上突出的焊球安装连接焊盘 形成有形成在第一电路层上的多个绝缘层和多个电路层的堆积层（57），形成在构造体的最外层的阻焊层（58） 上层（57）。 版权所有（C）2011，JPO＆INPIT

    Process for producing circuit board
    34.
    发明专利
    Process for producing circuit board 有权
    生产电路板的工艺

    公开(公告)号：JP2010263023A

    公开(公告)日：2010-11-18

    申请号：JP2009111591

    申请日：2009-04-30

    Applicant: Showa Denko Kk ,  昭和電工株式会社

    Inventor： SHOJI TAKASHI ,  SAKAI TAKEKAZU

    IPC: H05K3/24

    CPC classification number: H05K3/3478 ,  H05K3/3489 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/124 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156

    Abstract: PROBLEM TO BE SOLVED: To provide a process for producing a circuit board that prevents the separation of solder bumps during the formation of the solder bumps and the formation of needle-like crystals and enables the steady production of a normal circuit board. SOLUTION: The process for producing a circuit board includes the following steps of: applying an adhesiveness-imparting compound onto the surface of a terminal 2 arranged on a circuit board 1 to form an adhesive layer 5; attaching solder particles 11 onto the adhesive layer; applying an activating agent containing a hydrohalic acid salt of an organic acid base onto the solder particles and heating the circuit board on which the solder particles are attached at a temperature equal to or lower than the melting temperature of the solder to fix the solder particles; applying a flux onto the circuit board on which the solder particles are fixed; and heating the circuit board to melt the solder particles. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种制造电路板的方法，该电路板防止在焊料凸块形成期间分离焊料凸块并形成针状晶体，并且能够稳定地生产普通电路板。 解决方案：电路板的制造方法包括以下步骤：在布置在电路板1上的端子2的表面上施加粘合性化合物以形成粘合剂层5; 将焊料颗粒11附着到粘合剂层上; 将含有有机酸碱的氢卤酸盐的活化剂施加到焊料颗粒上，并在等于或低于焊料熔融温度的温度下加热附着有焊料颗粒的电路板，以固定焊料颗粒; 将焊剂施加到焊料颗粒固定的电路板上; 并加热电路板以熔化焊料颗粒。 版权所有（C）2011，JPO＆INPIT

    Printed wiring board and method for manufacturing printed wiring board
    40.
    发明专利
    Printed wiring board and method for manufacturing printed wiring board 审中-公开
    印刷线路板和制造印刷线路板的方法

    公开(公告)号：JP2010157718A

    公开(公告)日：2010-07-15

    申请号：JP2009287060

    申请日：2009-12-18

    Applicant: Ibiden Co Ltd ,  イビデン株式会社

    Inventor： KAWAI SATORU ,  SAKAI KENJI ,  CHIN TOSHIMASU

    IPC: H05K3/34 ,  H01L23/12 ,  H01L23/32 ,  H05K3/18 ,  H05K3/24 ,  H05K3/46

    CPC classification number: H05K3/4007 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/113 ,  H05K3/205 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/09436 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T29/49213 ,  H01L2224/05599

    Abstract: PROBLEM TO BE SOLVED: To provide a printed wiring board in which cracks seldom occur in resin insulation layers and a method for manufacturing the printed wiring board. SOLUTION: A protruding portion 76B protruding from a resin insulation layer 42 of a pad 76 is formed to be larger than an embedded portion 76A embedded in the resin insulation layer 42. The protruding portion 76B covers an upper surface of the resin insulation layer 42 present at a periphery of the embedded portion 76A. Namely, in addition to highly rigid pads 76 touching the resin insulation layer 42 on their side surfaces, the protruding portions 76B are in contact with the upper surface of the resin insulation layer 42 present around the embedded portions 76A. Therefore, even if a multilayer printed wiring board 10 warps during heat cycle testing, since the contact area between pads 76 and the resin insulation layer 42 is large, stress may be dispersed, so that cracks seldom occur in the resin insulation layer 42. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种其中难以在树脂绝缘层中发生裂纹的印刷线路板以及印刷线路板的制造方法。 解决方案：从衬垫76的树脂绝缘层42突出的突出部分76B形成为大于嵌入树脂绝缘层42中的嵌入部分76A。突出部分76B覆盖树脂绝缘体的上表面 层42存在于嵌入部分76A的周边。 即，除了突出部76B与树脂绝缘层42的侧面接触的高刚性焊盘76之外，与嵌入部76A周围的树脂绝缘层42的上表面接触。 因此，即使在热循环试验中多层印刷电路板10发生翘曲，由于焊盘76与树脂绝缘层42的接触面积大，因此可能会分散应力，因此在树脂绝缘层42中很少发生裂纹。 P>版权所有（C）2010，JPO＆INPIT

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