公开(公告)号：JP2008016630A

公开(公告)日：2008-01-24

申请号：JP2006186152

申请日：2006-07-06

Applicant: Matsushita Electric Ind Co Ltd ,  松下電器産業株式会社

Inventor： NAKANO TAKAHIRO

IPC: H05K3/46

CPC classification number: H05K1/0271 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K3/3452 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/068 ,  H05K2201/09781 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2203/0588 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a printed circuit board which is capable of preventing a surface insulating resin layer from being warped at reflow in the mounting region of a semiconductor device.
SOLUTION: Conductor wiring layers 12, and 14b and interlayer insulating resin layers 13 are alternately laminated on both the main surfaces of a core board 11, and a surface insulating resin layer 16 is formed covering the uppermost conductor wiring layer formed on the surface of the core board 11 for the formation of a multilayer printed circuit board 1. A square region is removed from the surface insulating resin layer 16 which is formed on the interlayer insulating resin layer 13, to form a vacant area 17 at the center within the mounting region 10 of a semiconductor device in a region just under the semiconductor device excluding conductor lands 14a bonded to the external electrodes of the semiconductor device.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种能够防止在半导体器件的安装区域中的表面绝缘树脂层在回流时翘曲的印刷电路板。 解决方案：导体布线层12和14b以及层间绝缘树脂层13交替层叠在芯板11的两个主表面上，并且形成表面绝缘树脂层16，覆盖形成在芯板11上的最上层的导体布线层 用于形成多层印刷电路板1的芯板11的表面。从形成在层间绝缘树脂层13上的表面绝缘树脂层16去除正方形区域，以在中心内形成空区域17 在半导体器件正下方的区域中的半导体器件的安装区域10，除了接合到半导体器件的外部电极的导体焊盘14a之外。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2007297597A

公开(公告)日：2007-11-15

申请号：JP2007071435

申请日：2007-03-19

Applicant: E I Du Pont De Nemours & Co ,  イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company

Inventor： KANAKARAJAN KUPPSUAMY

IPC: C09J179/08 ,  C08K5/00 ,  C08L79/08 ,  C09J11/04 ,  C09J11/08 ,  C09J177/00 ,  C09J177/10

CPC classification number: C09J179/08 ,  C08L77/10 ,  C08L2205/16 ,  C08L2666/20 ,  H05K1/0373 ,  H05K3/281 ,  H05K3/386 ,  H05K2201/0154 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/068 ,  Y10T428/1023 ,  Y10T428/24917 ,  Y10T428/28 ,  Y10T428/2804 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721 ,  Y10T442/2361

Abstract: PROBLEM TO BE SOLVED: To obtain a polyimide-based adhesive having a coefficient of thermal expansion of ≤50ppm/°C. SOLUTION: The polyimide-based adhesive comprises (a) a polyimide base polymer which is a polyimide base polymer having a glass transition temperature in a range of from 150 to 300°C, is present in an amount from 25 to 95 weight percent based on the total weight of the polyimide-based adhesive and has a coefficient of thermal expansion above 50 ppm/°C and (b) a microfiber reinforcing material having an average diameter of 2-2,000 nanometer and an average length of 10-10 7 nanometer in an amount from 5 to 75 weight percent, based upon the total weight of the polyimide-based adhesive and has a coefficient of thermal expansion of ≤50 ppm/°C. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：获得热膨胀系数≤50ppm/℃的聚酰亚胺系粘合剂。 聚酰亚胺系粘合剂包含（a）作为玻璃化转变温度为150〜300℃的聚酰亚胺基聚合物的聚酰亚胺基聚合物的含量为25〜95重量％ 基于聚酰亚胺类粘合剂的总重量的百分比，并且具有高于50ppm /℃的热膨胀系数，和（b）平均直径为2-2,000纳米且平均长度为10-10的微纤维增强材料 基于聚酰亚胺类粘合剂的总重量，5〜75重量％的纳米粒子，其热膨胀系数≤50ppm/℃。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP3968068B2

公开(公告)日：2007-08-29

申请号：JP2003341478

申请日：2003-09-30

Applicant: 株式会社クラレ

Inventor： 稔 小野寺 ,  辰也 砂本

IPC: B29C71/02 ,  B29L7/00 ,  H05K1/00 ,  H05K3/00

CPC classification number: H05K3/0011 ,  B29C71/02 ,  B29K2105/0079 ,  B29L2007/008 ,  H05K1/0393 ,  H05K2201/0141 ,  H05K2201/068 ,  H05K2203/0152 ,  H05K2203/1105

公开(公告)号：JP3906767B2

公开(公告)日：2007-04-18

申请号：JP2002257241

申请日：2002-09-03

Applicant: 株式会社日立製作所

Inventor： 光泰 増田

IPC: H01L25/04 ,  H01L25/18 ,  H01L23/31 ,  H01L23/495 ,  H05K3/00 ,  H05K3/28

CPC classification number: H05K3/0061 ,  H01L23/3107 ,  H01L23/49531 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K3/284 ,  H05K2201/068 ,  H05K2201/10924 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

公开(公告)号：JP2007042989A

公开(公告)日：2007-02-15

申请号：JP2005227798

申请日：2005-08-05

Applicant: Ibiden Co Ltd ,  イビデン株式会社

Inventor： TSUKADA KIYOTAKA

IPC: H05K1/16 ,  H05K1/09

CPC classification number: H01G4/33 ,  H01G4/008 ,  H01G4/1218 ,  H05K1/162 ,  H05K3/025 ,  H05K3/143 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2201/068 ,  H05K2201/09763

Abstract: PROBLEM TO BE SOLVED: To provide a thin film embedded capacitance having a large electric capacitance per unit, and to provide its manufacturing method. SOLUTION: The thin film embedded capacitance comprises a metal thin film 2P for wiring comprising a metal material in an unyielded state; a first electrode 4 formed on the metal thin film for wiring; a dielectric material layer 6 formed by a sputtering method on the first electrode and the metal thin film for wiring at a temperature not lower than room temperature, and at lower than the yielding temperature of the metal thin film for wiring, and having a smaller coefficient of thermal expansion than that of the metal thin film wiring; and a second electrode 8 formed on the dielectric material layer. Its manufacturing method is also provided. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供每单位具有大电容量的薄膜嵌入式电容器，并提供其制造方法。 解决方案：薄膜嵌入电容包括用于布线的金属薄膜2P，其包括处于非屏蔽状态的金属材料; 形成在用于布线的金属薄膜上的第一电极4; 通过溅射法在第一电极上形成的电介质层6和用于布线的金属薄膜，其温度不低于室温，低于布线金属薄膜的屈服温度，并且具有较小的系数 的热膨胀比金属薄膜布线; 以及形成在电介质材料层上的第二电极8。 还提供其制造方法。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2006117935A

公开(公告)日：2006-05-11

申请号：JP2005302676

申请日：2005-10-18

Applicant: General Electric Co ,  ゼネラル・エレクトリック・カンパニイGeneral Electric Company

Inventor： BLACKBURN SAPNA ,  CROLL JOSHUA ,  DRIS IRENE ,  GUREL EMINE E ,  SHETH KAPIL C

IPC: C08L79/08 ,  C08G73/10 ,  C08J5/18 ,  C08K3/00

CPC classification number: H05K1/0373 ,  C08K3/01 ,  C08L79/08 ,  H05K1/0346 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/068 ,  C08L2666/54

Abstract: PROBLEM TO BE SOLVED: To provide a polymer composition having improved stability.
SOLUTION: Various embodiments of the polymer composition are provided. In one embodiment, the polymer composition comprises about 50 to about 95 wt.% of a polyetherimide and about 5 to about 50 wt.% of an inorganic substance. The polymer composition has a thermal expansion coefficient of less than about 50 ppm/°C, when formed into a film. The film has average roughness of

Abstract translation: 要解决的问题：提供具有改进的稳定性的聚合物组合物。 解决方案：提供聚合物组合物的各种实施方案。 在一个实施方案中，聚合物组合物包含约50至约95重量％的聚醚酰亚胺和约5至约50重量％的无机物质。 当形成膜时，聚合物组合物的热膨胀系数小于约50ppm /℃。 该膜根据ANSI B46.1测量的平均粗糙度<2.0μm。 该膜可以通过溶液流延法或挤出法制造。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2005057258A

公开(公告)日：2005-03-03

申请号：JP2004212512

申请日：2004-07-21

Applicant: Samsung Electronics Co Ltd ,  三星電子株式会社

Inventor： KANG SA YOON ,  KIM DONG HAN ,  JUNG YE-JUNG

IPC: H01L21/60 ,  G02F1/13 ,  G02F1/1345 ,  H01L23/538 ,  H05K1/11 ,  H05K1/14

CPC classification number: G02F1/13452 ,  H01L23/5387 ,  H01L2224/16 ,  H01L2924/07811 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/068 ,  H05K2201/10681 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide an inexpensive flexible film package module and a method for manufacturing the same. SOLUTION: In the flexible film package and the method for manufacturing the same, a first insulation substrate 10 in which the tape film of the flexible film package module is made of a polyimide material and a second insulation substrate 170 less expensive than the first insulation substrate are used in a linked state. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：为了提供廉价的柔性膜包装模块及其制造方法。 解决方案：在柔性膜封装及其制造方法中，第一绝缘基板10，其中柔性膜封装模块的带膜由聚酰亚胺材料制成，第二绝缘基板170比第一绝缘基板 第一绝缘基板以连接状态使用。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2004327814A

公开(公告)日：2004-11-18

申请号：JP2003122058

申请日：2003-04-25

Applicant: Shinko Electric Ind Co Ltd ,  新光電気工業株式会社

Inventor： ASAHI YOJI ,  WATANABE KOJI ,  UEDA KEISUKE

IPC: H01L23/14 ,  H01L23/498 ,  H05K1/05 ,  H05K3/46

CPC classification number: H01L23/49822 ,  H01L2924/0002 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/068 ,  H05K2201/10674 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a substrate for semiconductor device that can mount a semiconductor element with a reduced strength by preventing cracks generating in a substrate in the case when a material approximating to the coefficient of thermal expansion of the semiconductor element is used as a core substrate.
SOLUTION: The substrate for semiconductor device is provided with wiring patterns 12, 14 and 16 formed on one surface or both surfaces of a core substrate 10 with resin layers 18, 20 and 22 in between. The core substrate 10 is made of a material approximating to the coefficient of thermal expansion of the semiconductor element, and a resin layer 24 as the outermost layer of the substrate is made of a resin material of which strength and elongation is higher than that of one used for the resin layers 18, 20 and 22 inside the substrate. Thus, a failure such as cracks or deformation occurring in the substrate due to a thermal stress between the core substrate 10 and the resin layers 18, 20 and 22 and the wiring patterns 12, 14 and 16 inside the substrate can be prevented.
COPYRIGHT: (C)2005,JPO&NCIPI

公开(公告)号：JP2004128497A

公开(公告)日：2004-04-22

申请号：JP2003334361

申请日：2003-09-25

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： EGITTO FRANK D ,  FARQUHAR DONALD S ,  MARKOVICH VOYA R ,  MARK D POLIKS ,  POWELL DOUGLAS O

IPC: H01L23/12 ,  G02F1/1347 ,  H01L21/48 ,  H01L23/373 ,  H05K3/46

CPC classification number: H01L21/4853 ,  H01L23/3735 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/114 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4608 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4632 ,  H05K3/4641 ,  H05K3/4688 ,  H05K2201/0141 ,  H05K2201/0191 ,  H05K2201/068 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1092

Abstract: PROBLEM TO BE SOLVED: To provide a multilayer interconnection structure using a LCP dielectric layer and a method for forming the structure. SOLUTION: Each of a first and second LCP (liquid crystal polymer) dielectric layers is bonded directly to each of a first and second opposed layers of a heat conduction layer without an extrinsic adhesive material that bonds the heat conduction layer to either of a first and second LCP dielectric layers. Alternatively, each of a first and second 2S1P substructures is bonded directly to each of a first and second opposed layers of a LCP dielectric bonding layer without an extrinsic adhesive material that bonds the LCP dielectric bonding layer to either of the first and second 2S1P substructures. COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：提供使用LCP介电层的多层互连结构和形成该结构的方法。 解决方案：第一和第二LCP（液晶聚合物）电介质层中的每一个直接结合到导热层的第一和第二相对层中的每一个，而不需要将导热层粘合到 第一和第二LCP电介质层。 或者，第一和第二2S1P子结构中的每一个直接结合到LCP电介质结合层的第一和第二相对层中的每一个上，而不会将LCP电介质结合层结合到第一和第二2S1P子结构中的任一个的外在粘合材料。 版权所有（C）2004，JPO

公开(公告)号：JP2003059979A

公开(公告)日：2003-02-28

申请号：JP2001249499

申请日：2001-08-20

Applicant: Mitsui Mining & Smelting Co Ltd ,  三井金属鉱業株式会社

Inventor： KAWASAKI SHUICHI ,  TERADA HIROSHI

IPC: H01L21/60 ,  H01L23/498 ,  H05K1/00 ,  H05K1/03 ,  H05K3/38

CPC classification number: H05K1/032 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K3/386 ,  H05K2201/0129 ,  H05K2201/068 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a laminated film for packaging electronic components that can easily and effectively reduce the warpage in a widthwise direction of the laminated firm for packaging electronic components, and to provide a film carrier tape for packaging electronic components.
SOLUTION: In a laminated film 10 where a conductor layer 11 and an insulating film 14 are subjected to thermocompression bonding, a coefficient of thermal expansion in the widthwise direction of the insulating film 14 is nearly the same as or larger than that in the widthwise direction of the conductor layer 11.
COPYRIGHT: (C)2003,JPO

Abstract translation: 要解决的问题：提供一种用于包装电子部件的层压膜，其可以容易且有效地减少用于包装电子部件的层压制品的宽度方向的翘曲，并且提供用于包装电子部件的胶片载带。 解决方案：在导体层11和绝缘膜14进行热压接的层叠膜10中，绝缘膜14的宽度方向的热膨胀系数几乎与宽度方向的热膨胀系数相同或者更大 的导体层11。