公开(公告)号：US09583466B2

公开(公告)日：2017-02-28

申请号：US14141735

申请日：2013-12-27

Applicant: LuxVue Technology Corporation

Inventor： Kelly McGroddy ,  Hsin-Hua Hu ,  Andreas Bibl ,  Clayton Ka Tsun Chan

IPC: H01L25/075 ,  H01L33/00 ,  H01L33/14 ,  H01L23/00 ,  G09G3/32 ,  H01L33/20

CPC classification number: H01L25/0753 ,  G09G3/32 ,  H01L24/75 ,  H01L24/95 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/14 ,  H01L33/20 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A method and structure for forming an array of LED devices is disclosed. The LED devices in accordance with embodiments of the invention may include a confined current injection area in which a current spreading layer protrudes away from a cladding layer in a pillar configuration so that the cladding layer is wider than the current spreading layer pillar.

Abstract translation: 公开了一种用于形成LED器件阵列的方法和结构。 根据本发明的实施例的LED器件可以包括限流电流注入区域，其中电流扩散层以柱状构造从包覆层突出，使得包覆层比当前扩展层柱更宽。

公开(公告)号：US09548233B2

公开(公告)日：2017-01-17

申请号：US15052767

申请日：2016-02-24

Applicant: LuxVue Technology Corporation

Inventor： Dariusz Golda ,  Andreas Bibl

IPC: H01L21/683 ,  H01L21/768 ,  H01L23/48 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11

CPC classification number: H01L21/6833 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L2221/68368 ,  H01L2924/00 ,  H01L2924/0002 ,  H05K1/0284 ,  H05K1/03 ,  H05K1/09 ,  H05K1/115 ,  H05K2201/09036

Abstract: A micro device transfer head array and method of forming a micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect. A dielectric layer covers a top surface of each mesa structure.

Abstract translation: 描述了从SOI衬底形成微器件传输阵列的微器件转移头阵列和方法。 在一个实施例中，微器件传送头阵列包括基底衬底和基底衬底上的图案化硅层。 图案化硅层可以包括硅互连和与硅互连电连接的硅电极阵列。 每个硅电极包括突出在硅互连上方的台面结构。 介电层覆盖每个台面结构的顶面。

公开(公告)号：US09522468B2

公开(公告)日：2016-12-20

申请号：US14273298

申请日：2014-05-08

Applicant: LuxVue Technology Corporation

Inventor： Paul Argus Parks ,  Nile Alexander Light ,  Stephen P. Bathurst ,  John A. Higginson ,  Andreas Bibl

IPC: B65G47/90 ,  B25J7/00 ,  B25J18/00 ,  B25J9/00

CPC classification number: B25J7/00 ,  B25J9/0015 ,  B25J18/007 ,  H01L2224/7565 ,  H01L2224/75822 ,  Y10T74/20354

Abstract: Systems and methods for transferring a micro device or an array of micro devices to or from a substrate are disclosed. In an embodiment, a remote center robot allows on-the-fly alignment between a micro pick up array and a target substrate. The remote center robot may include a plurality of symmetric linkages that move independently and share a remote rotational center. In an embodiment, the remote rotational center may be positioned at a surface of the micro pick up array to prevent damage to the array of micro devices during transfer.

Abstract translation: 公开了用于将微器件或微阵列阵列转移到衬底或从衬底传送微阵列的系统和方法。 在一个实施例中，远程中心机器人允许微拾取阵列和目标基板之间的即时对准。 远程中心机器人可以包括独立移动并共享远程旋转中心的多个对称联动。 在一个实施例中，远程旋转中心可以定位在微拾取阵列的表面处，以防止在传送期间损坏微器件阵列。

公开(公告)号：US09511498B2

公开(公告)日：2016-12-06

申请号：US14852366

申请日：2015-09-11

Applicant: LuxVue Technology Corporation

Inventor： John A. Higginson ,  Andreas Bibl ,  David Albertalli

IPC: B25J15/00 ,  B81C99/00 ,  H01L23/00 ,  H02N13/00

CPC classification number: B25J15/0085 ,  B81C99/002 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/67259 ,  H01L24/75 ,  H01L24/95 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75753 ,  H01L2224/7598 ,  H02N13/00

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads.

公开(公告)号：US09484237B2

公开(公告)日：2016-11-01

申请号：US14814307

申请日：2015-07-30

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  Dariusz Golda

IPC: H01L21/683 ,  H01L23/00 ,  H01L21/768 ,  B81C99/00

CPC classification number: H01L21/6833 ,  B81C99/002 ,  H01L21/6835 ,  H01L21/76802 ,  H01L21/76877 ,  H01L21/76898 ,  H01L24/75 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00

Abstract: Micro pick up arrays for transferring micro devices from a carrier substrate are disclosed. In an embodiment, a micro pick up array includes a compliant contact for delivering an operating voltage from a voltage source to an array of electrostatic transfer heads. In an embodiment, the compliant contact is moveable relative to a base substrate of the micro pick up array.

Abstract translation: 公开了用于从载体衬底传送微器件的微拾取阵列。 在一个实施例中，微拾取阵列包括用于将工作电压从电压源传送到静电转印头阵列的柔性接触件。 在一个实施例中，柔性接触件可相对于微拾取阵列的基底基板移动。

公开(公告)号：US09367094B2

公开(公告)日：2016-06-14

申请号：US14109864

申请日：2013-12-17

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  Kapil V. Sakariya ,  Vikram Pavate

IPC: G06F3/02 ,  G06F1/16 ,  G06F3/041 ,  G06F3/042 ,  G09G3/32 ,  H01L25/075 ,  H01L25/16 ,  H05K1/11 ,  H05K1/18 ,  H05K1/14 ,  G06F3/14

CPC classification number: H01L25/167 ,  G04G9/10 ,  G06F1/163 ,  G06F1/1652 ,  G06F3/0412 ,  G06F3/042 ,  G06F3/14 ,  G09G3/32 ,  G09G2380/02 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5387 ,  H01L25/0753 ,  H01L31/0216 ,  H01L31/16 ,  H01L33/44 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/115 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/10128 ,  H01L2924/00

Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

Abstract translation: 描述了包括显示模块的显示模块和系统应用。 显示模块可以包括前表面，后表面和前表面上的显示区域的显示基板。 多个互连件从前表面延伸到后表面。 一组发光二极管（LED）在显示区域中并与多个互连电连接，一个或多个驱动电路位于显示基板的背面。 示例性的系统应用包括可穿戴的，可滚动的和可折叠的显示器。

公开(公告)号：US20160094160A1

公开(公告)日：2016-03-31

申请号：US14502994

申请日：2014-09-30

Applicant: LuxVue Technology Corporation

Inventor： Dariusz Golda ,  Stephen P. Bathurst ,  John A. Higginson ,  Andreas Bibl ,  Jeffrey Birkmeyer

IPC: H02N13/00

CPC classification number: B81C99/002 ,  H01H59/0009 ,  H01L41/113

Abstract: A compliant electrostatic transfer head and method of forming a compliant electrostatic transfer head are described. In an embodiment, a compliant electrostatic transfer head includes a base substrate, a cavity template layer on the base substrate, a first confinement layer between the base substrate and the cavity template layer, and a patterned device layer on the cavity template layer. The patterned device layer includes an electrode that is deflectable toward a cavity in the cavity template layer. In an embodiment, a second confinement layer is between the cavity template layer and the patterned device layer.

Abstract translation: 描述了柔性静电转印头和形成顺应性静电转印头的方法。 在一个实施例中，顺应性静电转印头包括基底衬底，在基底衬底上的空腔模板层，在基底衬底和腔模板层之间的第一限制层，以及腔模板层上的图案化器件层。 图案化器件层包括能够朝向空腔模板层中的空腔偏转的电极。 在一个实施例中，第二限制层位于空腔模板层和图案化器件层之间。

公开(公告)号：US09288899B2

公开(公告)日：2016-03-15

申请号：US14681707

申请日：2015-04-08

Applicant: LuxVue Technology Corporation

Inventor： Dariusz Golda ,  Andreas Bibl

IPC: H01L21/266 ,  H05K1/02 ,  H01L21/768 ,  H01L23/48 ,  H01L21/683 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11

CPC classification number: H01L21/6833 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L2221/68368 ,  H01L2924/00 ,  H01L2924/0002 ,  H05K1/0284 ,  H05K1/03 ,  H05K1/09 ,  H05K1/115 ,  H05K2201/09036

Abstract: A micro device transfer head array and method of forming a micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect. A dielectric layer covers a top surface of each mesa structure.

Abstract translation: 描述了从SOI衬底形成微器件传输阵列的微器件转移头阵列和方法。 在一个实施例中，微器件传送头阵列包括基底衬底和基底衬底上的图案化硅层。 图案化硅层可以包括硅互连和与硅互连电连接的硅电极阵列。 每个硅电极包括突出在硅互连上方的台面结构。 介电层覆盖每个台面结构的顶面。

公开(公告)号：US09217541B2

公开(公告)日：2015-12-22

申请号：US13894332

申请日：2013-05-14

Applicant: LuxVue Technology Corporation

Inventor： Stephen Bathurst ,  Hsin-Hua Hu ,  Andreas Bibl

IPC: H01L29/06 ,  F21K99/00 ,  H01L23/00 ,  H01L33/00

CPC classification number: F21K9/00 ,  B81C99/002 ,  H01L24/00 ,  H01L33/0095 ,  H01L2224/03002 ,  H01L2224/06181 ,  H01L2224/94 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/10331 ,  H01L2924/10336 ,  H01L2924/10342 ,  H01L2924/10346 ,  H01L2924/10349 ,  H01L2924/10375 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  Y10T29/49002 ,  H01L2224/03 ,  H01L2924/00

Abstract: A stabilization structure includes a stabilization layer on a carrier substrate. The stabilization layer includes an array of staging cavities. An array of micro devices are within the array of staging cavities. Each micro device is laterally attached to a shear release post laterally extending from a sidewall of a staging cavity. A pressure is applied to the array of micro devices from the array of transfer heads to shear the array of micro devices off the shear release posts. The sheared off micro devices are picked up from the carrier substrate using the array of transfer heads.

Abstract translation: 稳定结构包括载体基底上的稳定层。 稳定层包括分段腔阵列。 微器件阵列在分级腔阵列内。 每个微器件横向地附接到从分级腔的侧壁横向延伸的剪切释放柱。 从转移头阵列向微器件阵列施加压力以将微器件阵列剪切离开剪切释放柱。 使用转移头阵列从载体衬底拾取剪切的微器件。

公开(公告)号：US20150348504A1

公开(公告)日：2015-12-03

申请号：US14294494

申请日：2014-06-03

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： Kapil V. Sakariya ,  Mohammad Hendijanifard ,  Tore Nauta

IPC: G09G5/10 ,  G09G3/32

CPC classification number: G09G3/3233 ,  G09G3/2092 ,  G09G2300/0814 ,  G09G2300/0819 ,  G09G2300/0842 ,  G09G2320/0626 ,  G09G2360/141 ,  G09G2360/142 ,  G09G2360/144 ,  G09G2360/145 ,  G09G2360/148

Abstract: Exemplary methods and systems use a micro light emitting diode (LED) in an active matrix display to emit and sense light. Display panels, systems, and methods of operation are described in which LEDs may be used for both emission and sensing.

Abstract translation: 示例性方法和系统使用有源矩阵显示器中的微发光二极管（LED）来发射和感测光。 描述了显示面板，系统和操作方法，其中LED可以用于发射和感测两者。