利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

217 条记录 (耗时 0.041 秒)

    Dielectric structure and method of formation
    6.
    发明授权
    Dielectric structure and method of formation 失效
    介电结构和形成方法

    公开(公告)号：US06495239B1

    公开(公告)日：2002-12-17

    申请号：US09458291

    申请日：1999-12-10

    申请人： Anilkumar C. Bhatt ,  Stephen J. Fuerniss ,  Roy H. Magnuson ,  Voya R. Markovich

    发明人： Anilkumar C. Bhatt ,  Stephen J. Fuerniss ,  Roy H. Magnuson ,  Voya R. Markovich

    IPC分类号： B32B310

    CPC分类号： B32B7/04 ,  B32B27/26 ,  B32B27/32 ,  B32B2250/40 ,  B32B2305/72 ,  H05K3/0023 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4641 ,  H05K2201/09509 ,  H05K2201/09536 ,  Y10S428/901 ,  Y10T428/24273 ,  Y10T428/28 ,  Y10T428/31511

    摘要： A dielectric structure, wherein two fully cured photoimageable dielectric (PID) layers of the structure are nonadhesively interfaced by a partially cured PID layer. The partially cured PID layer includes a power plane sandwiched between a first partially cured PID sheet and a second partially cured PID sheet. The fully cured PID layers each include an internal power plane, a plated via having a blind end conductively coupled to the internal power plane, and a plated via passing through the fully cured PID layer. The dielectric structure may further include a first PID film partially cured and nonadhesively coupled to one of the fully cured PID layers. The dialectric structure may further include a second PID film partially cured and nonadhesively coupled to the other fully cured PID layer.

    摘要翻译： 一种电介质结构，其中该结构的两个完全固化的可光成像电介质（PID）层通过部分固化的PID层非粘性地接合。 部分固化的PID层包括夹在第一部分固化的PID片和第二部分固化的PID片之间的动力平面。 完全固化的PID层各自包括内部电源平面，具有导电耦合到内部电源平面的盲端的电镀通孔以及穿过完全固化的PID层的电镀通孔。 电介质结构还可以包括部分固化并非粘性地耦合到完全固化的PID层之一的第一PID膜。 所述方程式结构还可以包括部分固化并非粘性地耦合到另一完全固化的PID层的第二PID膜。

    Dielectric structure and method of formation
    7.
    发明授权
    Dielectric structure and method of formation 失效
    介电结构和形成方法

    公开(公告)号：US06699350B2

    公开(公告)日：2004-03-02

    申请号：US10217616

    申请日：2002-08-12

    申请人： Anilkumar C. Bhatt ,  Stephen J. Fuerniss ,  Roy H. Magnuson ,  Voya R. Markovich

    发明人： Anilkumar C. Bhatt ,  Stephen J. Fuerniss ,  Roy H. Magnuson ,  Voya R. Markovich

    IPC分类号： B32B3100

    CPC分类号： B32B7/04 ,  B32B27/26 ,  B32B27/32 ,  B32B2250/40 ,  B32B2305/72 ,  H05K3/0023 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4641 ,  H05K2201/09509 ,  H05K2201/09536 ,  Y10S428/901 ,  Y10T428/24273 ,  Y10T428/28 ,  Y10T428/31511

    摘要： A method for forming a dielectric structure. A first layer is formed, wherein the first layer includes a first fully cured photoimageable dielectric (PID) material. A sticker lays is nonadhesively formed on the first layer, wherein the sticker layer includes a partially cured PID material. A second layer is nonadhesively formed on the sticker layer, wherein the second layer includes a second fully cured PID material, wherein the sticker layer is nonadhesively sandwiched between the first layer and the second layer such that the sticker layer is in non-adhesive contact with the first layer and in non-adhesive contact with the second layer, and wherein the sticker layer is capable of remaining in non-adhesive contact with the first layer and the second layer until the sticker layer is subsequently subjected to additional curing.

    摘要翻译： 一种形成电介质结构的方法。 形成第一层，其中第一层包括第一完全固化的可光成像的电介质（PID）材料。 在第一层上非粘性地形成贴纸，其中贴纸层包括部分固化的PID材料。 第二层非粘性地形成在粘合剂层上，其中第二层包括第二完全固化的PID材料，其中粘合层非粘性地夹在第一层和第二层之间，使得粘合剂层与 所述第一层与所述第二层非粘合接触，并且其中所述粘合剂层能够保持与所述第一层和所述第二层的非粘合性接触，直到所述粘合剂层随后进行另外的固化。

    Circuitized substrate with low loss capacitive material and method of making same
    8.
    发明授权
    Circuitized substrate with low loss capacitive material and method of making same 有权
    具有低损耗电容性材料的电路化基板及其制造方法

    公开(公告)号：US08446707B1

    公开(公告)日：2013-05-21

    申请号：US13269770

    申请日：2011-10-10

    申请人： Rabindra N. Das ,  Konstantinos I. Papathomas ,  Voya R. Markovich ,  James J. McNamara

    发明人： Rabindra N. Das ,  Konstantinos I. Papathomas ,  Voya R. Markovich ,  James J. McNamara

    IPC分类号： H01G4/06

    CPC分类号： H01G4/33 ,  H01G7/06 ,  H05K1/0231 ,  H05K3/429 ,  H05K3/4602

    摘要： A low loss capacitance and low loss insulating dielectric material consisting of a thermosetting resin, thermoplastic resin, a cross-linker, and containing a quantity of ferroelectric ceramic nano-particles of barium titanate within. The combined low loss insulating dielectric layer and a low loss capacitive layer resulting from the material allows one continuous layer that can form internal capacitors and permit the modifying the dielectric thickness between signal layers for impedance matching within a layer of substrate. More significantly, the applied layer of low loss capacitive materials can simultaneously act as a capacitor as well as a dielectric for separation of signal layers.

    摘要翻译： 由热固性树脂，热塑性树脂，交联剂组成的含有钛酸钡的铁电陶瓷纳米粒子的低损耗电容和低损耗绝缘介电材料。 组合的低损耗绝缘电介质层和由该材料产生的低损耗电容层允许一个连续的层可以形成内部电容器并且允许改变信号层之间的介电厚度以在衬底层内进行阻抗匹配。 更重要的是，所应用的低损耗电容材料层可以同时充当电容器以及用于分离信号层的电介质。

    Solid via layer to layer interconnect
    9.
    发明授权
    Solid via layer to layer interconnect 失效
    实体通过层间互连

    公开(公告)号：US07076869B2

    公开(公告)日：2006-07-18

    申请号：US10260153

    申请日：2002-09-27

    申请人： Brian E. Curcio ,  Donald S. Farquhar ,  Voya R. Markovich ,  Konstantinos I. Papathomas

    发明人： Brian E. Curcio ,  Donald S. Farquhar ,  Voya R. Markovich ,  Konstantinos I. Papathomas

    IPC分类号： H01K3/10

    CPC分类号： H05K3/462 ,  H05K3/321 ,  H05K3/423 ,  H05K3/4623 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： The present invention relates to a method for providing an interconnect between layers of a multilayer circuit board. A first via extending through a total thickness of a first layer is formed. The first via is totally filled with a first solid conductive plug and an end of the first solid conductive plug includes a first contact pad that is in contact with a surface of the first layer. A second via extending through a total thickness of a second layer is formed. The second via totally filling with a second solid conductive plug and an end of the second solid conductive plug includes a second contact pad that is in contact with a surface of the second layer. The second layer is electrically and mechanically coupled to the first layer by an electrically conductive adhesive that is in electrical and mechanical contact with both the end of the first plug and the end of the second plug.

    摘要翻译： 本发明涉及一种在多层电路板的层之间提供互连的方法。 形成延伸通过第一层的总厚度的第一通孔。 第一通孔完全填充有第一固体导电插塞，并且第一固体导电插塞的端部包括与第一层的表面接触的第一接触垫。 形成延伸穿过第二层的总厚度的第二通孔。 通过完全填充第二固体导电插塞和第二固体导电插塞的端部的第二通孔包括与第二层的表面接触的第二接触垫。 第二层通过与第一插头的端部和第二插头的端部电接触和机械接触的导电粘合剂电和机械地耦合到第一层。