公开(公告)号：US20240364023A1

公开(公告)日：2024-10-31

申请号：US18140346

申请日：2023-04-27

Applicant: Intel Corporation

Inventor： Thomas WAGNER ,  Georg SEIDEMANN ,  Tae Young YANG ,  Harald GOSSNER ,  Telesphor KAMGAING ,  Bernd WAIDHAS

IPC: H01Q21/20 ,  H01Q5/35

CPC classification number: H01Q21/205 ,  H01Q5/35

Abstract: Embodiments disclosed herein include a communication module. In an embodiment, the communication module comprises a package substrate, and a die on the package substrate. In an embodiment, a plurality of antennas are around the die. In an embodiment, the plurality of antennas are coupled to the die by a plurality of traces, and heights of each of the plurality of antennas is greater than a thickness of the traces.

公开(公告)号：US20230361802A1

公开(公告)日：2023-11-09

申请号：US18029932

申请日：2020-11-03

Applicant: Intel Corporation

Inventor： Jayprakash THAKUR ,  Ofir DEGANI ,  Ronen KRONFELD ,  Ehud RESHEF ,  Seong-Youp J. SUH ,  Tal SHOSHANA ,  Eytan MANN ,  Maruti TAMRAKAR ,  Ashoke RAVI ,  Jose Rodrigo CAMACHO PEREZ ,  Timo Sakari HUUSARI ,  Eli BOROKHOVICH ,  Amir RUBIN ,  Ofer BENJAMIN ,  Tae Young YANG ,  Harry SKINNER ,  Kwan ho LEE ,  Jaejin LEE ,  Dong-Ho Han ,  Shahar GROSS ,  Eran SEGEV ,  Telesphor KAMGAING

IPC: H04B1/40

CPC classification number: H04B1/40

Abstract: In various aspects, a radio frequency circuit is provided. The radio frequency circuit may include a substrate that may include a radio frequency front-end to antenna (RF FE-to-Ant) connector. The RF FE-to-Ant connector may include a conductor track structure and a substrate connection structure coupled to the conductor track structure. The substrate may include radio frequency front-end circuitry monolithically integrated in the substrate. The substrate connection structure may include at least one of a solderable structure, a weldable structure, or an adherable structure. The substrate connection structure may be configured to form at least one radio frequency signal interface with an antenna circuit connection structure of a substrate-external antenna circuit. The substrate may include an edge region. The substrate connection structure may be disposed in the edge region.

公开(公告)号：US20250004121A1

公开(公告)日：2025-01-02

申请号：US18885758

申请日：2024-09-16

Applicant: INTEL CORPORATION

Inventor： Arnaud AMADJIKPE ,  Timo Sakari HUUSARI ,  Tae Young YANG ,  Hossein ALAVI ,  Steven CALLENDER ,  Bradley JACKSON ,  Ofer MARKISH ,  Woorim SHIN ,  Shengbo XU ,  Zhen ZHOU ,  Wei QIAN ,  Mengyuan HUANG

IPC: G01S13/42 ,  G01S7/35 ,  G01S13/89

Abstract: Disclosed herein is a lens antenna system that includes a reconfigurable aperture configured to receive a source beam. The reconfigurable aperture also provides an output beam based on a surface impedance distribution of the reconfigurable aperture and the received source beam. The control device is operatively coupled to the reconfigurable aperture, wherein the control device is configured to control the surface impedance distribution of the reconfigurable aperture to configure and reconfigure a beam pattern of the output beam. A plurality of antenna elements may be physically positioned proximate the reconfigurable aperture, wherein the plurality of antennas may be configured to generate the source beam.

公开(公告)号：US20240222859A1

公开(公告)日：2024-07-04

申请号：US18147768

申请日：2022-12-29

Applicant: Intel Corporation

Inventor： Tae Young YANG ,  Zhen ZHOU ,  Shuhei YAMADA ,  Tolga ACIKALIN ,  Kenneth P. FOUST ,  Bryce D. HORINE

IPC: H01Q1/52 ,  H01Q1/22 ,  H01Q17/00 ,  H01Q19/10

CPC classification number: H01Q1/526 ,  H01Q1/2291 ,  H01Q17/00 ,  H01Q19/10

Abstract: An apparatus may include a substrate including: a first antenna configured to form a first short range wireless interconnection with a first antenna of a further substrate, a second antenna spaced apart from the first antenna, the second antenna is configured to form a second short range wireless interconnection with a second antenna of the further substrate, and a metamaterial configured to form a surface with effective negative permeability within a space formed between a surface of the substrate and a surface of the further substrate for an established short range wireless interconnection of the first short range wireless interconnection and the second short range wireless interconnection.

公开(公告)号：US20240113438A1

公开(公告)日：2024-04-04

申请号：US17955551

申请日：2022-09-29

Applicant: Intel Corporation

Inventor： Zhen ZHOU ,  Shuhei YAMADA ,  Renzhi LIU ,  Tae Young YANG ,  Tolga ACIKALIN ,  Kenneth P. FOUST

IPC: H01Q9/16

CPC classification number: H01Q9/16

Abstract: A package-to-package communication system is provided including a first package having integrated on a first substrate a first antenna, a second antenna, and a first transceiver coupled to the first antenna and the second antenna. The first antenna is arranged along a first edge of the first substrate. The second antenna is arranged along a second edge of the first substrate. A second package having integrated on a second substrate a third antenna, a fourth antenna and a second transceiver coupled to the third antenna and the fourth antenna. The third antenna is arranged along a third edge of the second substrate. The fourth antenna is arranged along a fourth edge of the second substrate. The first antenna and the third antenna are configured to communicate signals of a vertical polarization. The second antenna and the fourth antenna are configured to communicate signals of a horizontal polarization.

公开(公告)号：US20240363567A1

公开(公告)日：2024-10-31

申请号：US18140465

申请日：2023-04-27

Applicant: Intel Corporation

Inventor： Bernd WAIDHAS ,  Thomas WAGNER ,  Georg SEIDEMANN ,  Harald GOSSNER ,  Telesphor KAMGAING ,  Shuhei YAMADA ,  Tae Young YANG

IPC: H01L23/00 ,  H01Q1/22 ,  H01Q1/38

CPC classification number: H01L24/08 ,  H01L24/05 ,  H01Q1/2283 ,  H01Q1/38 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/05647 ,  H01L2224/08265 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32265 ,  H01L2924/0665

Abstract: Embodiments disclosed herein include a die module. In an embodiment, the die module comprises a die with a first surface and a second surface. In an embodiment, a first pad is on the second surface of the die, where a top surface of the first pad is substantially coplanar with the second surface. In an embodiment, the die module comprises an antenna module with a third surface and a fourth surface. In an embodiment, a second pad is on the third surface of the antenna module, where a bottom surface of the second pad is substantially coplanar with the third surface. In an embodiment, the top surface of the first pad directly contacts the bottom surface of the second pad.

公开(公告)号：US20240106126A1

公开(公告)日：2024-03-28

申请号：US18352296

申请日：2023-07-14

Applicant: Intel Corporation

Inventor： Zhen ZHOU ,  Tolga ACIKALIN ,  Kenneth FOUST ,  Shuhei YAMADA ,  Tae Young YANG ,  Timothy F. COX ,  Renzhi LIU ,  Richard DORRANCE ,  Johanny ESCOBAR PELAEZ

IPC: H01Q9/04 ,  H01Q1/22

CPC classification number: H01Q9/0414 ,  H01Q1/2283 ,  H01Q9/045

Abstract: A communication system, including a first carrier and a first antenna mounted on the first carrier; a second carrier and a second antenna mounted on the second carrier, wherein the first antenna and the second antenna are arranged relative to each other that the first antenna and the second antenna can establish wireless link; a third carrier and a third antenna mounted on the third carrier; a fourth carrier and a fourth antenna mounted on the fourth carrier, wherein the third antenna and the fourth antenna are arranged relative to each other that the third antenna and the fourth antenna can establish wireless link; and a transmission structure, within which the signal propagate through, connects the second antenna and the third antenna.

公开(公告)号：US20240021522A1

公开(公告)日：2024-01-18

申请号：US18253945

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Tolga ACIKALIN ,  Tae Young YANG ,  Debabani CHOUDHURY ,  Shuhei YAMADA ,  Roya DOOSTNEJAD ,  Hosein NIKOPOUR ,  Issy KIPNIS ,  Oner ORHAN ,  Mehnaz RAHMAN ,  Kenneth P. FOUST ,  Christopher D. HULL ,  Telesphor KAMGAING ,  Omkar KARHADE ,  Stefano PELLERANO ,  Peter SAGAZIO ,  Sai VADLAMANI

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/00 ,  H01L23/66 ,  H01L23/498 ,  H01Q1/22

CPC classification number: H01L23/5381 ,  H01L25/0652 ,  H01L24/16 ,  H01L23/66 ,  H01L23/49822 ,  H01Q1/2283 ,  H01L24/81 ,  H01L2924/14222 ,  H01L2924/1431 ,  H01L2223/6677 ,  H01L2223/6616 ,  H01L2223/6655 ,  H01L2224/16235 ,  H01L2224/16146

Abstract: Various devices, systems, and/or methods perform wireless chip to chip high speed data transmission. Strategies for such transmission include use of improved microbump antennas, wireless chip to chip interconnects, precoding and decoding strategies, channel design to achieve spatial multiplexing gain in line of sight transmissions, open cavity chip design for improved transmission, and/or mixed signal channel equalization.

公开(公告)号：US20220196821A1

公开(公告)日：2022-06-23

申请号：US17369994

申请日：2021-07-08

Applicant: Intel Corporation

Inventor： Arnaud AMADJIKPE ,  Timo Sakari HUUSARI ,  Tae Young YANG ,  Hossein ALAVI ,  Steven CALLENDER ,  Bradley JACKSON ,  Ofer MARKISH ,  Woorim SHIN ,  Shengbo XU ,  Zhen ZHOU ,  Wei QIAN ,  Mengyuan HUANG

IPC: G01S13/42 ,  G01S13/89

Abstract: A radar device may include a digital to analog converter (DAC) stage. The DAC stage may generate a plurality of analog signals. The DAC stage may generate a different analog signal for each transmitter chain of a plurality of transmitter chains. Each analog signal of the plurality of analog signals may represent a single digital signal. Each transmitter chain of the plurality of transmitter chains may include a transmit chain portion and switched analog beamforming network (BFN). The transmit chain portion may generate a plurality of intermediate analog signals representative of the corresponding analog signal. The switched analog BFN may generate a plurality of analog transmit signals for an intermediate analog signal of the plurality of intermediate analog signals. The plurality of analog transmit signals may include a beam formed in accordance with a state of the switched analog BFN.

公开(公告)号：US20250112357A1

公开(公告)日：2025-04-03

申请号：US18817279

申请日：2024-08-28

Applicant: Intel Corporation

Inventor： Zhen ZHOU ,  Tae Young YANG ,  Shuhei YAMADA ,  Tolga ACIKALIN ,  Renzhi LIU ,  Kenneth FOUST ,  Bryce HORINE

IPC: H01Q1/22 ,  H01L23/31 ,  H01L23/538 ,  H01L25/00 ,  H01L25/065 ,  H01Q1/48 ,  H01Q5/40 ,  H01Q9/04

Abstract: The present disclosure relates to a semiconductor package comprising a substrate, a radio frequency integrated circuit attached to the substrate, optionally at least one semiconductor die attached to the substrate and coupled to a radio frequency integrated circuit (RFIC) via one or more signal lines, a molding compound encapsulating the RFIC and the optional semiconductor die, and an antenna formed on the molding compound and coupled to the RFIC.