公开(公告)号：US20170336315A1

公开(公告)日：2017-11-23

申请号：US15529787

申请日：2016-01-29

Applicant: LG CHEM, LTD.

Inventor： Young Kook KIM ,  Jung Hak KIM ,  Hee Jung KIM ,  Se Ra KIM ,  Jung Ho JO ,  Kwang Joo LEE ,  Seung Hee NAM ,  Ji Ho HAN

IPC: G01N15/08 ,  G01N27/04

CPC classification number: G01N15/0806 ,  G01N27/041 ,  G01N27/3335 ,  G01N2013/003 ,  G01N2015/086

Abstract: The present invention relates to a method for measuring metal ion permeability of a polymer film, comprising the steps of applying a voltage to the polymer film, while at least one side of the polymer film is brought into contact with an electrolyte comprising metal ions, an organic solvent and an aqueous solvent; and measuring the change rate of resistance or change rate of current of the polymer film according to time, after the voltage is applied, and a device for measuring metal ion permeability of a polymer film used therefor.

公开(公告)号：US20160040042A1

公开(公告)日：2016-02-11

申请号：US14781507

申请日：2014-12-12

Applicant: LG CHEM, LTD.

Inventor： Young Kook KIM ,  Se Ra KIM ,  Hee Jung KIM ,  Jung Ho JO ,  Kwang Joo LEE ,  Jung Hak KIM ,  Seung Hee NAM

IPC: C09J11/08 ,  H01L21/26 ,  H01L21/78 ,  C09J133/00 ,  C09J7/02

CPC classification number: C09J11/08 ,  C09J5/00 ,  C09J7/20 ,  C09J133/00 ,  C09J2201/128 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2205/31 ,  C09J2433/00 ,  C09J2463/00 ,  C09J2475/00 ,  C09J2483/00 ,  H01L21/26 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68336 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83203 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/3512 ,  H01L2924/0665 ,  H01L2224/27 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: There are provided a composition for forming an adhesive layer of a dicing film including: a silicon compound oil including at least one reactive functional group; an adhesive binder; and a photoinitiator, wherein a weight ratio of the silicon compound oil including at least one reactive functional group to the adhesive binder is 0.01% to 4.5%, a dicing film including an adhesive layer including the composition, a dicing die bonding film including the dicing film, and a method for dicing a semiconductor wafer using the dicing die bonding film.

Abstract translation: 提供一种用于形成切割膜的粘合剂层的组合物，其包括：包含至少一个反应性官能团的硅化合物油; 粘合剂; 和光引发剂，其中包含至少一个反应性官能团的硅化合物油与粘合剂粘合剂的重量比为0.01％至4.5％，包括包含该组合物的粘合剂层的切割膜，包括切割的切割模片接合膜 膜，以及使用切割芯片接合膜对半导体晶片进行切割的方法。

公开(公告)号：US20180237667A1

公开(公告)日：2018-08-23

申请号：US15752666

申请日：2017-03-31

Applicant: LG CHEM, LTD.

Inventor： Jung Hak KIM ,  Hee Jung KIM ,  Se Ra KIM ,  Kwang Joo LEE ,  Seung Hee NAM ,  Young Kook KIM

IPC: C09J133/10 ,  C09J163/04 ,  H01L21/56 ,  H01L23/31 ,  H01L25/065

CPC classification number: C09J133/10 ,  C08G59/621 ,  C09J163/00 ,  C09J163/04 ,  H01L21/565 ,  H01L23/3157 ,  H01L25/065 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/181 ,  H01L2924/00012 ,  C08L33/20

Abstract: The present invention relates to a semiconductor device including: a first semiconductor element fixed onto an adherend by flip-chip connection; an adhesive layer for embedding a space between the adherend and the first semiconductor element and embedding the first semiconductor element; and a second semiconductor element connected to the first semiconductor element via the adhesive layer, wherein the adhesive layer has a predetermined melt viscosity and thixotropic index.

公开(公告)号：US20160336290A1

公开(公告)日：2016-11-17

申请号：US15030525

申请日：2015-11-17

Applicant: LG CHEM, LTD.

Inventor： Hee Jung KIM ,  Jung Hak KIM ,  Se Ra KIM ,  Kwang Joo LEE

IPC: H01L23/00 ,  C09J133/14 ,  C08L33/14 ,  C09J7/02

CPC classification number: H01L24/29 ,  C08L61/12 ,  C08L63/04 ,  C08L2201/08 ,  C08L2201/52 ,  C08L2203/16 ,  C08L2203/20 ,  C08L2205/03 ,  C09J5/00 ,  C09J7/21 ,  C09J7/22 ,  C09J7/35 ,  C09J7/38 ,  C09J133/068 ,  C09J133/14 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2205/31 ,  C09J2433/00 ,  C09J2463/00 ,  H01L2224/2919 ,  H01L2924/0635 ,  H01L2924/066 ,  H01L2924/0665 ,  H01L2924/0675

Abstract: The present invention relates to an adhesive resin composition for bonding semiconductors, including: a (meth)acrylate-based resin including more than 17% by weight of (meth)acrylate-based repeating units containing epoxy-based functional groups; an epoxy resin having a softening point of more than 70° C; and a phenol resin having a softening point of more than 105° C, wherein the weight ratio of the (meth)acrylate-based resin is 0.48 to 0.65 relative to the total weight of the (meth)acrylate-based resin, the epoxy resin, and the phenol resin, an adhesive film for semiconductors obtained from the resin composition, a dicing die-bonding film including an adhesive layer that includes the adhesive film for semiconductors, a semiconductor wafer including the dicing die-bonding film, and a dicing method for the semiconductor wafer using the dicing die-bonding film.

Abstract translation: 本发明涉及一种用于接合半导体的粘合剂树脂组合物，其包括：（甲基）丙烯酸酯基树脂，其包含含有环氧基官能团的（甲基）丙烯酸酯系重复单元17重量％以上的（甲基）丙烯酸酯系树脂; 软化点大于70℃的环氧树脂; 和软化点大于105℃的酚醛树脂，其中（甲基）丙烯酸酯类树脂的重量比相对于（甲基）丙烯酸酯类树脂的总重量为0.48〜0.65，环氧树脂 ，酚醛树脂，由树脂组合物得到的半导体用粘合膜，包括具有半导体用粘合膜的粘合剂层的切割芯片接合膜，包括该切割芯片接合膜的半导体晶片和切割方法 对于使用切割芯片接合膜的半导体晶片。

公开(公告)号：US20140093662A1

公开(公告)日：2014-04-03

申请号：US14074274

申请日：2013-11-07

Applicant: LG CHEM, LTD.

Inventor： Se Ra KIM ,  Kee Young KIM ,  Sung Soo YOON ,  Min Ki LEE ,  No Ma KIM ,  In Cheon HAN

IPC: G02F1/1335

CPC classification number: G02F1/133528 ,  B32B2457/202 ,  C08L33/08 ,  C08L33/10 ,  C08L2205/02 ,  C08L2312/00 ,  C09J7/22 ,  C09J7/38 ,  C09J7/385 ,  C09J133/08 ,  C09J133/10 ,  C09J133/12 ,  G02B5/305 ,  Y10T428/1041 ,  Y10T428/105 ,  Y10T428/1073 ,  Y10T428/1077 ,  C08L2666/04

Abstract: The invention relates to an acrylic adhesive composition, more particularly, to an adhesive composition which: specifies the contents of a (meth)acrylic ester-based monomer and an aromatic group-containing monomer of an acrylic copolymer as a composition having little or no difference of birefringence; has excellent durability; and can reduce light leakage due to flexure by mixing a crosslinkable functional group-containing acrylic copolymer (A) and an acrylic copolymer (B) which does not contain the crosslinkable functional group, in a ratio of 1:9 to 5:5.

Abstract translation: 本发明涉及一种丙烯酸类粘合剂组合物，更具体地说，涉及一种粘合剂组合物，其特征在于：指定丙烯酸共聚物的（甲基）丙烯酸酯类单体和含芳香族基团的单体作为组成物的含量很少或没有差异 的双折射; 具有优异的耐久性; 并且可以通过将含交联性官能团的丙烯酸共聚物（A）和不含有交联性官能团的丙烯酸共聚物（B）以1:9〜5:5的比例混合来减少挠曲引起的漏光。

公开(公告)号：US20180265758A1

公开(公告)日：2018-09-20

申请号：US15571210

申请日：2016-09-23

Applicant: LG CHEM, LTD.

Inventor： Jung Hak KIM ,  Hee Jung KIM ,  Se Ra KIM ,  Kwang Joo LEE ,  Young Kook KIM ,  Seung Hee NAM

IPC: C09J163/10 ,  H01L23/00

Abstract: The present invention relates to an adhesive film having a thixotropic index at 110° C. of 1.5 to 7.5, which is used for fixing a first semiconductor device and a second semiconductor device, a ratio of an area of said first semiconductor device to an area of said second semiconductor device being 0.65 or less, a method for preparing a semiconductor device using the adhesive film, and a semiconductor device.

公开(公告)号：US20170247585A1

公开(公告)日：2017-08-31

申请号：US15486150

申请日：2017-04-12

Applicant: LG CHEM, LTD.

Inventor： Se Ra KIM ,  Kee Young KIM ,  In Cheon HAN

IPC: C09J133/08 ,  G02F1/1335 ,  G02B1/14 ,  C09J133/14 ,  B32B7/12

CPC classification number: C09J133/08 ,  B32B7/12 ,  B32B2255/26 ,  B32B2307/42 ,  B32B2457/202 ,  C08F2220/1825 ,  C08G18/6254 ,  C08G18/8029 ,  C09D133/066 ,  C09J133/14 ,  C09J2201/606 ,  G02B1/14 ,  G02F1/133528 ,  G02F2202/28 ,  Y10T428/10 ,  Y10T428/1059 ,  Y10T428/1077 ,  Y10T428/2848 ,  Y10T428/2891 ,  C08F220/06 ,  C08F2220/281 ,  C08F2220/1808 ,  C08F220/30

Abstract: The present invention relates to a pressure-sensitive adhesive composition, a protective film for polarizers, which includes a cured product of the pressure-sensitive adhesive composition, a polarizer, and a liquid crystal display (LCD). In the present invention, a pressure-sensitive adhesive showing excellent endurance reliability in high-temperature and/or high-humidity conditions and having superior physical properties such as cuttability, re-peeling property, and workability can be provided. In particular, it is possible to provide the pressure-sensitive adhesive composition which can prevent light leakage that may occur in an LCD, even when being applied to a film having a low stress optical coefficient.

公开(公告)号：US20170233610A1

公开(公告)日：2017-08-17

申请号：US15500355

申请日：2016-04-29

Applicant: LG CHEM, LTD.

Inventor： Hee Jung KIM ,  Se Ra KIM ,  Jung Hak KIM ,  Seung Hee NAM ,  Jung Ho JO ,  Kwang Joo LEE ,  Young Kook KIM

IPC: C09J7/00 ,  H01L23/00

CPC classification number: C09J7/00 ,  B32B7/06 ,  B32B7/12 ,  B32B15/08 ,  B32B15/082 ,  B32B15/085 ,  B32B15/09 ,  B32B27/06 ,  B32B27/08 ,  B32B27/16 ,  B32B27/18 ,  B32B27/20 ,  B32B27/24 ,  B32B27/26 ,  B32B27/281 ,  B32B27/285 ,  B32B27/286 ,  B32B27/288 ,  B32B27/302 ,  B32B27/304 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/38 ,  B32B27/42 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2270/00 ,  B32B2307/306 ,  B32B2307/50 ,  B32B2307/51 ,  B32B2307/558 ,  B32B2307/58 ,  B32B2307/732 ,  B32B2405/00 ,  B32B2457/14 ,  B32B2553/00 ,  C08L63/00 ,  C09D163/00 ,  C09J7/10 ,  C09J7/20 ,  C09J161/12 ,  C09J163/00 ,  C09J163/04 ,  C09J201/00 ,  C09J2201/162 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2423/006 ,  C09J2433/00 ,  C09J2433/006 ,  C09J2461/00 ,  C09J2463/00 ,  C09J2467/005 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/00 ,  H01L24/29 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2924/066 ,  H01L2924/0665 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/20642 ,  H01L2924/20643 ,  C08L33/08

Abstract: The present invention relates to an adhesive film for a semiconductor that can more easily bury unevenness such as through wires of a semiconductor substrate or a wire attached to a semiconductor chip and the like, and yet can be applied to various cutting methods without specific limitations to realize excellent cuttability, thus improving reliability and efficiency of a semiconductor packaging process.

公开(公告)号：US20170328851A1

公开(公告)日：2017-11-16

申请号：US15529813

申请日：2016-01-29

Applicant: LG CHEM, LTD.

Inventor： Jung Hak KIM ,  Young Kook KIM ,  Kwang Joo LEE ,  Hee Jung KIM ,  Se Ra KIM ,  Jung Ho JO ,  Seung Hee NAM ,  Ji Ho HAN

IPC: G01N27/12 ,  G01N27/04 ,  G01N27/14 ,  G01N27/404

CPC classification number: G01N27/125 ,  G01N27/041 ,  G01N27/14 ,  G01N27/404 ,  G01N27/447

Abstract: The present invention relates to a method for measuring metal ion permeability of a polymer film, comprising the steps of: applying a voltage to the polymer film at a temperature of 5° C. to 250° C., while one side of the polymer film is brought into contact with an electrolyte comprising metal ions, an organic solvent and an aqueous solvent; and measuring the change rate of resistance or change rate of current of the polymer film according to time, after the voltage is applied, and a device for measuring metal ion permeability of a polymer film used therefor.

公开(公告)号：US20160060489A1

公开(公告)日：2016-03-03

申请号：US14781537

申请日：2014-12-29

Applicant: LG CHEM, LTD.

Inventor： Se Ra KIM ,  Jung Ho JO ,  Young Kook KIM ,  Hee Jung KIM ,  Kwang Joo LEE ,  Jung Hak KIM ,  Seung Hee NAM

IPC: C09J7/02 ,  H01L23/00 ,  H01L21/78 ,  H01L21/683 ,  C09J133/04 ,  C09J163/00

CPC classification number: H01L21/6836 ,  C08L63/00 ,  C09D133/04 ,  C09J7/29 ,  C09J133/04 ,  C09J2203/326 ,  C09J2400/22 ,  C09J2433/006 ,  C09J2463/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/83885 ,  H01L2224/92 ,  H01L2224/94 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/27 ,  H01L2221/68304 ,  H01L21/78

Abstract: The present invention relates to a dicing film including: a substrate film; and a cohesive layer, wherein a storage modulus of the cohesive layer at 30° C. is 3*105 to 4*106 Pa, and the cohesive layer has a degree of cross-linking of 80% to 99%, a dicing die-bonding film including the dicing film, and a dicing method of a semiconductor wafer using the dicing die-bonding film.

Abstract translation: 本发明涉及一种切割膜，其包括：基底膜; 和内聚层，其中内聚层在30℃下的储能模量为3×10 5至4×10 6 Pa，并且内聚层的交联度为80％至99％，切割模具 - 使用切割芯片接合薄膜的半导体晶片的切割方法。