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    Method for producing a plurality of semiconductor chips and semiconductor chip
    2.
    发明授权
    Method for producing a plurality of semiconductor chips and semiconductor chip 有权

    公开(公告)号：US10453989B2

    公开(公告)日：2019-10-22

    申请号：US15552259

    申请日：2016-02-15

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Lutz Hoeppel ,  Alexander F. Pfeuffer ,  Dominik Scholz ,  Isabel Otto ,  Norwin Von Malm ,  Stefan Illek

    IPC: H01L21/76 ,  H01L33/00 ,  H01L33/48 ,  H01L21/02

    Abstract: Disclosed is a method for producing a plurality of semiconductor chips (10). A composite (1), which comprises a carrier (4) and a semiconductor layer sequence (2, 3), is provided. Separating trenches (17) are formed in the semiconductor layer sequence (2, 3) along an isolation pattern (16). A filling layer (11) limiting the semiconductor layer sequence (2, 3) toward the separating trenches (17) is applied to a side of the semiconductor layer sequence (2, 3) facing away from the carrier (4). Furthermore, a metal layer (10) adjacent to the filling layer (11) is applied in the separating trenches (17). The semiconductor chips (20) are isolated by removing the metal layer (10) adjacent to the filling layer (11) in the separating trenches (17). Each isolated semiconductor chip (20) has one part of the semiconductor layer sequence (2, 3), and of the filling layer (11). Also disclosed is a semiconductor chip (10).

    Optoelectronic module comprising an optical waveguide and method for producing same
    5.
    发明授权
    Optoelectronic module comprising an optical waveguide and method for producing same 有权
    包括光波导的光电模块及其制造方法

    公开(公告)号：US09356210B2

    公开(公告)日：2016-05-31

    申请号：US14370211

    申请日：2013-01-11

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Siegfried Herrmann ,  Stefan Illek

    IPC: H01L29/18 ,  H01L33/00 ,  H01L33/60 ,  G02B27/09 ,  H01L27/15 ,  H01L33/50 ,  H01L25/075

    CPC classification number: H01L33/60 ,  G02B27/0905 ,  G02B27/0994 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/507 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

    Abstract: An optoelectronic module (202, 204, 206, 208, 210, 212, 214, 216, 218, 220, 222, 224, 226, 228, 230, 232, 234) comprises a carrier (102), at which and/or in which are arranged at least two semiconductor chips (104, 104a1, 104a2, 104b; 106, 106a1, 106a2, 106b, 106c) for emitting electromagnetic radiation (108a, 108b). An emission unit (110) for emitting electromagnetic radiation (109) from the optoelectronic module (202, 204, 206, 208, 210, 212, 214, 216, 218, 220, 222, 224, 226, 228, 230, 232, 234) is arranged on or in the carrier (102). At least one of the semiconductor chips (106, 106a1, 106a2, 106b, 106c) is spaced apart from the emission unit (110). A waveguide (112) guides the electromagnetic radiation (108a) of the at least one spaced-apart semiconductor chip (106, 106a1, 106a2, 106b, 106c) to the emission unit (110). The emission unit (110) has a coupling-out structure (114, 114a, 114b, 114c) for coupling out the electromagnetic radiation (108a) from the waveguide (112).

    Abstract translation: 光电子模块（202,204,206,208,210,212,214,216,218,220,222,224,226,228,230,232,234,226,228,220,232,224,226,228,230,232,234,234,226,228,220,232,224,226,228,230,232,234,224,226,228,230,232,234,224,226,228,230,232 其中布置有用于发射电磁辐射（108a，108b）的至少两个半导体芯片（104,104a1,104a2,104b; 106,106a1,106a2,106b，106c）。 一种用于从光电子模块（202,204,206,208,210,212,214,216,218,220,222,224,226,228,230,232,232,218,218,220,222,224,226,228,230,232,232）发射电磁辐射（109）的发射单元（110） 234）布置在载体（102）上或载体（102）中。 半导体芯片（106,106a1,106a2,106b，106c）中的至少一个与发射单元（110）间隔开。 波导（112）将至少一个间隔开的半导体芯片（106,106a1,106a2,106b，106c）的电磁辐射（108a）引导到发射单元（110）。 发射单元（110）具有用于从波导（112）耦合出电磁辐射（108a）的耦合输出结构（114,114a，114b，114c）。

    Optoelectronic Semiconductor Component and Method for Producing Said Component
    7.
    发明申请
    Optoelectronic Semiconductor Component and Method for Producing Said Component 有权
    光电子半导体元件及其制造方法

    公开(公告)号：US20150249070A1

    公开(公告)日：2015-09-03

    申请号：US14430215

    申请日：2013-09-06

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： Stefan Illek ,  Thomas Schwarz ,  Jürgen Moosburger ,  Walter Wegleiter

    IPC: H01L25/075 ,  H01L33/52 ,  H01L33/64 ,  H01L33/50 ,  H01L33/62

    CPC classification number: H01L25/0753 ,  H01L33/505 ,  H01L33/52 ,  H01L33/62 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01L2924/00

    Abstract: An optoelectronic semiconductor component and a method for making an optoelectronic semiconductor component are disclosed. In an embodiment the component includes a carrier including at least one conversion-medium body and a potting body, the potting body surrounding the conversion-medium body at least in places, as seen in plan view, electrical contact structures fitted at least indirectly to the carrier and a plurality of optoelectronic semiconductor chips fitted to a main face of the carrier, the optoelectronic semiconductor chips configured to generate radiation, wherein the conversion-medium body is shaped as a plate, wherein the semiconductor chips are directly mechanically connected to the conversion-medium body, and wherein the conversion-medium body is free of cutouts for the electrical contact structures and is not penetrated by the electrical contact structure.

    Abstract translation: 公开了一种光电子半导体部件和制造光电半导体部件的方法。 在一个实施例中，部件包括载体，该载体包括至少一个转化介质体和灌封体，灌封体至少在一些地方围绕转化介质体，如平面图所示，电接触结构至少间接地安装在 载体和安装在载体的主面上的多个光电半导体芯片，所述光电子半导体芯片被配置为产生辐射，其中所述转换介质体被成形为板，其中所述半导体芯片直接机械地连接到所述转换 - 中间体，并且其中所述转换介质主体没有用于所述电接触结构的切口并且不被所述电接触结构穿透。

    Optoelectronic Module and Method for Producing an Optoelectronic Module
    8.
    发明申请
    Optoelectronic Module and Method for Producing an Optoelectronic Module 有权
    光电子模块及其制造方法

    公开(公告)号：US20150108511A1

    公开(公告)日：2015-04-23

    申请号：US14404428

    申请日：2013-05-15

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Stefan Illek

    IPC: H01L33/62 ,  H01L33/58 ,  H01L33/64

    CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/58 ,  H01L33/64 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01L2933/0091 ,  H01L2924/00

    Abstract: An optoelectronic module has at least one semiconductor chip for emitting electromagnetic radiation. The semiconductor chip has a layer having a first conductivity, a layer having a second conductivity, a radiation surface and a contact surface which lies opposite the radiation surface. A contact is attached to the radiation surface. A frame made of a potting compound laterally encloses the semiconductor chip in at least some regions such that the radiation surface and the contact surface are substantially free of the potting compound. A first contact structure is arranged in at least some regions on the frame and in at least some regions on the contact surface. A second contact structure is arranged in at least some regions on the frame and in at least some regions on the contact of the radiation surface.

    Abstract translation: 光电子模块具有至少一个用于发射电磁辐射的半导体芯片。 半导体芯片具有具有第一导电性的层，具有第二导电性的层，辐射表面和与辐射表面相对的接触表面。 接触件附着在辐射表面上。 由灌封化合物制成的框架在至少一些区域中侧向包围半导体芯片，使得辐射表面和接触表面基本上不含灌封化合物。 第一接触结构布置在框架和接触表面上的至少一些区域中的至少一些区域中。 第二接触结构布置在框架上的至少一些区域中以及辐射表面的接触件上的至少一些区域中。

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