公开(公告)号：US20050046024A1

公开(公告)日：2005-03-03

申请号：US10961446

申请日：2004-10-08

申请人： Pankaj Mithal ,  William Higdon ,  Mark Gose ,  John Dikeman ,  Frank Stepniak

发明人： Pankaj Mithal ,  William Higdon ,  Mark Gose ,  John Dikeman ,  Frank Stepniak

IPC分类号： H01L23/485 ,  H01L23/528 ,  H01L21/44

CPC分类号： H01L24/02 ,  H01L23/528 ,  H01L24/10 ,  H01L2224/0401 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14

摘要： A metal runner that improves the current-carrying capability of solder bumps used to electrically connect a surface-mount circuit device to a substrate. The runner comprises at least one leg portion and a pad portion, with the pad portion having a continuous region and a plurality of separate electrical paths leading to and from the continuous region. The electrical paths are delineated in the pad portion by nonconductive regions defined in the pad portion, with at least some of the nonconductive regions extending into the leg portion. The multiple electrical paths split the current flow to and from the solder bump, distributing the current around the perimeter of the solder bump in a manner that reduces current density in regions of the solder bump where electromigration is most likely.

摘要翻译： 金属流道，其提高用于将表面贴装电路器件电连接到衬底的焊料凸块的载流能力。 流道包括至少一个支腿部分和垫部分，其中该焊盘部分具有连续区域和连续区域的多个分开的电路径。 在焊盘部分中通过限定在焊盘部分中的非导电区域描绘电路径，其中至少一些非导电区域延伸到腿部。 多个电路径将电流流向和从焊料凸块分开，以在减少电子迁移最有可能的焊料凸块区域中的电流密度的方式将电流分布在焊料凸块的周边周围。

公开(公告)号：US06822327B1

公开(公告)日：2004-11-23

申请号：US10461318

申请日：2003-06-13

申请人： Pankaj Mithal ,  William D. Higdon ,  Mark W. Gose ,  John M. Dikeman ,  Frank Stepniak

发明人： Pankaj Mithal ,  William D. Higdon ,  Mark W. Gose ,  John M. Dikeman ,  Frank Stepniak

IPC分类号： H01L2940

CPC分类号： H01L24/02 ,  H01L23/528 ,  H01L24/10 ,  H01L2224/0401 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14

摘要： A metal runner that improves the current-carrying capability of solder bumps used to electrically connect a surface-mount circuit device to a substrate. The runner comprises at least one leg portion and a pad portion, with the pad portion having a continuous region and a plurality of separate electrical paths leading to and from the continuous region. The electrical paths are delineated in the pad portion by nonconductive regions defined in the pad portion, with at least some of the nonconductive regions extending into the leg portion. The multiple electrical paths split the current flow to and from the solder bump, distributing the current around the perimeter of the solder bump in a manner that reduces current density in regions of the solder bump where electromigration is most likely.

摘要翻译： 金属流道，其提高用于将表面贴装电路器件电连接到衬底的焊料凸块的载流能力。 流道包括至少一个支腿部分和垫部分，其中该焊盘部分具有连续区域和连续区域的多个分开的电路径。 在焊盘部分中通过限定在焊盘部分中的非导电区域描绘电路径，其中至少一些非导电区域延伸到腿部。 多个电路径将电流流向和从焊料凸块分开，以在减少电子迁移最有可能的焊料凸块区域中的电流密度的方式将电流分布在焊料凸块的周边周围。

公开(公告)号：US20070029669A1

公开(公告)日：2007-02-08

申请号：US11198419

申请日：2005-08-05

申请人： Frank Stepniak ,  William Higdon

发明人： Frank Stepniak ,  William Higdon

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/10 ,  H01L24/05 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81011 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2224/05552 ,  H01L2924/00

摘要： An integrated circuit (IC) includes a semiconductor material, electronic circuitry formed on the semiconductor material, a contact layer formed on the electronic circuitry, a final passivation layer formed on the contact layer and an under-bump metallurgy (UBM) formed on at least a portion of the final passivation layer. The contact layer includes a plurality of contacts pads for providing external access to the electronic circuitry. The final passivation layer includes a plurality of windows that extend through the final passivation layer to the contact pads. The UBM includes an aluminum layer having a thickness of about 800 angstroms to about 1200 angstroms, a nickel/vanadium (Ni/V) layer having a thickness of about 800 angstroms to about 1200 angstroms and a copper (Cu) layer having a thickness of about 800 angstroms to about 1200 angstroms.

摘要翻译： 集成电路（IC）包括半导体材料，形成在半导体材料上的电子电路，形成在电子电路上的接触层，形成在接触层上的最终钝化层和至少形成的凸块下冶金（UBM） 最终钝化层的一部分。 接触层包括用于提供对电子电路的外部访问的多个接触焊盘。 最终钝化层包括多个窗口，其延伸穿过最终钝化层到接触垫。 UBM包括厚度约800埃至约1200埃的铝层，厚度约800埃至约1200埃的镍/钒（Ni / V）层和厚度为 约800埃至约1200埃。

公开(公告)号：US07397012B2

公开(公告)日：2008-07-08

申请号：US11141571

申请日：2005-05-31

申请人： Frank Stepniak ,  Larry Siebens ,  Charles Bindics ,  Anthony Reed

发明人： Frank Stepniak ,  Larry Siebens ,  Charles Bindics ,  Anthony Reed

IPC分类号： H01H33/00

CPC分类号： H01H33/02 ,  H01H1/385 ,  H01H31/32 ,  H01H33/025 ,  H01H33/565 ,  H01H2003/0273 ,  H01H2009/0292

摘要： An electrical switch which includes an insulative housing having a wall defining an axial bore therein, a first electrical contact disposed in the housing bore and a second electrical contact movably disposed in the housing bore between an open position and a closed position. When the contacts are in their open position, the second electrical contact is spaced apart from the first electrical contact and when the contacts are in their closed position, the second electrical contact is in electrical contact with the first electrical contact. The switch includes features to enhance safety and operation by reducing the possibility of arcing or flashover before and during the switching operation and to provide of visual indication of the state of the switch.

公开(公告)号：US20080157320A1

公开(公告)日：2008-07-03

申请号：US11617906

申请日：2006-12-29

申请人： Ray D. Harrison ,  Jianbai Zhu ,  Jeffrey J. Wolfe ,  Frank Stepniak

发明人： Ray D. Harrison ,  Jianbai Zhu ,  Jeffrey J. Wolfe ,  Frank Stepniak

IPC分类号： H01L23/48 ,  H01L21/58

CPC分类号： H01L23/3128 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48175 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K1/112 ,  H05K1/181 ,  H05K2201/09227 ,  H05K2201/09627 ,  H05K2201/1053 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Semiconductor devices and methods for their assembly are described in which IC packages may be combined in novel configurations. A multi-package semiconductor device system and associated methods for its construction include a plurality of packaged semiconductor devices, each provided with at least one lateral electrical contact. The plurality of packaged semiconductor devices so provided are fixed in a coplanar configuration and have the adjacent lateral contacts coupled for operation in concert.

摘要翻译： 描述了用于组装的半导体器件和方法，其中IC封装可以以新颖的结构组合。 多封装半导体器件系统及其结构的相关方法包括多个封装的半导体器件，每个封装的半导体器件均设置有至少一个横向电接触。 如此设置的多个封装半导体器件被固定为共面构造，并且具有相互连接的相邻的侧向触点以一起操作。

公开(公告)号：US20080045058A1

公开(公告)日：2008-02-21

申请号：US11801793

申请日：2007-05-10

申请人： Frank Stepniak ,  Alan Borgstrom ,  Larry Siebens

发明人： Frank Stepniak ,  Alan Borgstrom ,  Larry Siebens

IPC分类号： H01R13/53

CPC分类号： H01R43/26 ,  H01R13/5216 ,  H01R13/5221 ,  H01R13/53 ,  H01R13/629 ,  H01R13/648 ,  H01R24/20 ,  H01R33/7678 ,  H01R2101/00 ,  Y10S439/921 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49218 ,  Y10T29/4922 ,  Y10T29/49224

摘要： A high voltage loadbreak bushing insert includes an insulative housing having a first end section, a second end section opposite the first end section, a mid-section disposed between the first and second end sections and a transition shoulder portion disposed between the second end section and the mid-section. The second end section is dimensioned for insertion into a power cable elbow connector and the mid-section is dimensioned to be sealed against an elbow cuff of the power cable elbow connector. The transition shoulder portion includes at least one raised portion protruding radially outwardly from the transition shoulder portion. The raised portion is adapted to force the elbow cuff of the power cable elbow connector to expand in a radially outward direction upon withdrawal of the second end section from the power cable elbow connector, thereby venting a cavity formed between the bushing insert and the power cable elbow connector.

摘要翻译： 高压耐压破坏套管插入件包括绝缘壳体，其具有第一端部部分，与第一端部部分相对的第二端部部分，设置在第一和第二端部部分之间的中间部分，以及设置在第二端部部分和 中段。 第二端部的尺寸用于插入电力电缆弯头连接器中，并且中部的尺寸设计成与电力电缆弯头连接器的弯头箍密封。 过渡肩部包括从过渡肩部径向向外突出的至少一个凸起部分。 凸起部分适于在第二端部从动力电缆弯头连接器拔出时迫使电力电缆弯头连接器的弯头箍在径向向外的方向上膨胀，从而使形成在衬套插入件和电力电缆 弯头连接器

公开(公告)号：US06916684B2

公开(公告)日：2005-07-12

申请号：US10391101

申请日：2003-03-18

申请人： Frank Stepniak ,  Matthew R. Walsh ,  Arun K. Chaudhuri ,  Michael J. Varnau

发明人： Frank Stepniak ,  Matthew R. Walsh ,  Arun K. Chaudhuri ,  Michael J. Varnau

IPC分类号： H01L21/44 ,  H01L21/56

CPC分类号： H01L21/563 ,  H01L24/27 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/12042 ,  Y10T428/14 ,  Y10T428/1476 ,  H01L2924/00 ,  H01L2224/0401

摘要： A process for underfilling a bumped die surface using a lamination step and compound film such that solder bumps on the die are exposed during lamination. The compound film comprises a first layer containing an underfill material and a second layer on the first layer. The underfill material and the second layer comprise polymer materials that differ from each other. The compound film is laminated to the die, preferably at the wafer level, so that the underfill material is forced between the solder bumps and fills spaces between the bumps but does not cover the bumps. In contrast, the second layer covers the solder bumps, but is then selectively removed to re-expose the solder bumps and the underfill material therebetween.

摘要翻译： 使用层压步骤和复合膜对冲击模具表面进行底部填充的方法，使得在层压期间裸片上的焊料凸块暴露。 复合膜包括含有底部填充材料的第一层和第一层上的第二层。 底部填充材料和第二层包括彼此不同的聚合物材料。 复合膜优选地在晶片级层压到管芯上，使得底部填充材料被迫在焊料凸块之间并填充凸块之间的空间，但不覆盖凸块。 相比之下，第二层覆盖焊料凸块，然后被选择性地去除以重新暴露焊料凸块和底部填充材料之间。

公开(公告)号：US06811892B2

公开(公告)日：2004-11-02

申请号：US10226370

申请日：2002-08-22

申请人： Shing Yeh ,  Bradley H. Carter ,  Frank Stepniak ,  Scott D. Brandenburg

发明人： Shing Yeh ,  Bradley H. Carter ,  Frank Stepniak ,  Scott D. Brandenburg

IPC分类号： B23K3526

CPC分类号： B23K35/262 ,  B23K2101/36 ,  H01L24/81 ,  H01L2224/81801 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3463 ,  Y10T428/12528 ,  Y10T428/12715 ,  Y10T428/12903 ,  Y10T428/24917 ,  H01L2924/00

摘要： A tin-lead solder alloy containing copper and optionally silver as its alloying constituents. The solder alloy consists essentially of, by weight, about 55% to about 75% tin, about 11% to about 44% lead, up to about 4% silver, nickel, palladium, platinum and/or gold, greater than 1% to about 10% copper, and incidental impurities. The solder alloys contain a small portion of CuSn intermetallic compounds, and exhibit a melting mechanism in which all but the intermetallic compounds melt within a narrow temperature range, though the actual liquidus temperature of the alloys may be considerably higher, such that the alloys can be treated as requiring peak reflow temperatures of about 250° C. or less. The intermetallic compounds precipitate out to form a diffusion barrier that increases the reliability of solder connections formed therewith.

公开(公告)号：US08866237B2

公开(公告)日：2014-10-21

申请号：US13405513

申请日：2012-02-27

申请人： Christopher D. Manack ,  Frank Stepniak ,  Sreenivasan K. Koduri

发明人： Christopher D. Manack ,  Frank Stepniak ,  Sreenivasan K. Koduri

IPC分类号： H01L29/84 ,  H01L31/02 ,  H01L29/66 ,  H01L21/02

CPC分类号： B81C1/00246 ,  B81B7/0067 ,  B81B2201/0207 ,  B81C1/00269 ,  G01J5/045 ,  G01J5/12 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/24245 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2224/82

摘要： An embedded micro-electro-mechanical system (MEMS) (100) comprising a semiconductor chip (101) embedded in an insulating board (120), the chip having a cavity (102) including a radiation sensor MEMS (105), the opening (104) of the cavity at the chip surface covered by a plate (110) transmissive to the radiation (150) sensed by the MEMS. The plate surface remote from the cavity having a bare central area, to be exposed to the radiation sensed by the MEMS in the cavity, and a peripheral area covered by a metal film (111) touching the plate surface and a layer (112) of adhesive stacked on the metal film.

摘要翻译： 一种嵌入式微电子机械系统（MEMS）（100），包括嵌入在绝缘板（120）中的半导体芯片（101），所述芯片具有包括辐射传感器MEMS（105）的空腔（102），所述开口 在由芯片感测到的辐射（150）透射的板（110）覆盖的芯片表面处的腔的空腔（104）。 离开空腔的板表面具有裸露的中心区域，以暴露于由空腔内的MEMS感测的辐射，以及由接触板表面的金属膜（111）覆盖的周边区域和覆盖板（112）的层 粘合剂堆叠在金属膜上。

公开(公告)号：US20140054795A1

公开(公告)日：2014-02-27

申请号：US13591719

申请日：2012-08-22

申请人： Matthew David Romig ,  Lance Cole Wright ,  Leslie Edward Stark ,  Frank Stepniak ,  Sreenivasan K. Koduri

发明人： Matthew David Romig ,  Lance Cole Wright ,  Leslie Edward Stark ,  Frank Stepniak ,  Sreenivasan K. Koduri

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L23/00 ,  B41M3/06 ,  H01L23/48 ,  H01L24/24 ,  H01L24/25 ,  H01L24/76 ,  H01L24/80 ,  H01L24/82 ,  H01L25/0657 ,  H01L2224/24145 ,  H01L2224/24227 ,  H01L2224/321 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/76155 ,  H01L2224/82102 ,  H05K1/092 ,  H05K1/181 ,  H05K3/125 ,  H05K3/32 ,  H05K2201/09272 ,  H05K2201/10151 ,  H05K2201/10454 ,  Y02P70/611

摘要： One method of making an electronic assembly includes mounting one electrical substrate on another electrical substrate with a face surface on the one substrate oriented transversely of a face surface of the other substrate. The method also includes inkjet printing on the face surfaces a conductive trace that connects an electrical contact on the one substrate with an electrical connector on the other substrate. An electronic assembly may include a first substrate having a generally flat surface with a first plurality of electrical contacts thereon; a second substrate having a generally flat surface with a second plurality of electrical contacts thereon, the surface of the second substrate extending transversely of the surface of said first substrate; and at least one continuous conductive ink trace electrically connecting at least one of the first plurality of electrical contacts with at least one of the second plurality of electrical contacts.

摘要翻译： 制造电子组件的一种方法包括将一个电气基板安装在另一个电气基板上，其中一个基板上的面表面横向于另一个基板的表面。 该方法还包括在表面上喷墨印刷导电迹线，导电迹线将一个基底上的电接触与另一基底上的电连接器连接。 电子组件可以包括具有大致平坦表面的第一基板，其上具有第一多个电触点; 第二基板，其具有大致平坦的表面，其上具有第二多个电触点，所述第二基板的表面横向于所述第一基板的表面延伸; 以及至少一个连续的导电油墨迹线将所述第一多个电触点中的至少一个与所述第二多个电触点中的至少一个电连接。