公开(公告)号：US20150228839A1

公开(公告)日：2015-08-13

申请号：US14692041

申请日：2015-04-21

Applicant: Seoul Viosys Co., Ltd.

Inventor： Ki Yon PARK ,  Hwa Mok KIM ,  Young Hwan SON ,  Daewoong SUH

IPC: H01L31/12 ,  H01L33/48 ,  H01L31/09

CPC classification number: H01L31/125 ,  H01L24/05 ,  H01L24/06 ,  H01L31/0203 ,  H01L31/03044 ,  H01L31/03046 ,  H01L31/03048 ,  H01L31/09 ,  H01L31/1013 ,  H01L31/108 ,  H01L31/1848 ,  H01L33/486 ,  H01L2224/0603 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2924/16195 ,  Y02E10/544 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A photo detection package including a package body configured to have an upward opened groove unit formed in the package body, a photo detection device mounted on a bottom surface of the groove unit and electrically connected externally, and a Light-Emitting Diode (LED) mounted on an inner surface of the groove unit that is formed of an inclined surface on a periphery of the bottom surface and electrically connected externally.

Abstract translation: 一种光检测封装，包括：封装主体，被构造成具有形成在封装主体中的向上开放的槽单元;安装在槽单元的底表面上并与外部电连接的光检测装置;以及安装在发光二极管 在槽单元的内表面上，该内表面由底表面的周边上的倾斜表面形成并且外部电连接。

公开(公告)号：US20140151714A1

公开(公告)日：2014-06-05

申请号：US14096189

申请日：2013-12-04

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Ki Yon PARK ,  Hwa Mok Kim ,  Daewoong Suh ,  Young Hwan Son

IPC: H01L33/32 ,  H01L33/12 ,  H01L33/00

CPC classification number: H01L21/0237 ,  C30B25/04 ,  C30B25/183 ,  C30B25/186 ,  C30B29/406 ,  H01L21/02381 ,  H01L21/0243 ,  H01L21/02433 ,  H01L21/02458 ,  H01L21/02494 ,  H01L21/02505 ,  H01L21/0251 ,  H01L21/0254 ,  H01L21/0262 ,  H01L33/007 ,  H01L33/0075 ,  H01L33/12

Abstract: Exemplary embodiments of the present invention relate to a single-crystal substrate including a buffer layer including a nitride semiconductor, holes penetrating the buffer layer, and a single-crystal nitride semiconductor disposed on the buffer layer.

Abstract translation: 本发明的示例性实施例涉及包括包括氮化物半导体的缓冲层，穿过缓冲层的空穴和设置在缓冲层上的单晶氮化物半导体的单晶衬底。

公开(公告)号：US20210050483A1

公开(公告)日：2021-02-18

申请号：US17086734

申请日：2020-11-02

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Yuriy BILENKO ,  Ki Yon PARK

IPC: H01L33/44 ,  H01L33/62 ,  H01L33/60 ,  H01L33/48 ,  H01L33/54 ,  H01L33/56

Abstract: A light emitting element package includes a substrate provided with an interconnect portion, a light emitting element mounted on the substrate and connected to the interconnect portion, and a cover member contacting an upper surface of the light emitting element while covering the light emitting element. The cover member comprises Teflon-based organic polymers and has a light transmittance of 85% or more in an ultraviolet wavelength range.

公开(公告)号：US20190133515A1

公开(公告)日：2019-05-09

申请号：US16240614

申请日：2019-01-04

Applicant: Seoul Viosys Co., Ltd.

Inventor： Ki Yon PARK ,  Seong Tae Jang

IPC: A61B5/00

Abstract: A skin measurement apparatus for emitting a plurality of lights for photographing an image of the skin. A skin measurement apparatus includes an ultraviolet ray emitting device; a white light emitting device; a focus lens enabling incident light, which is an ultraviolet ray emitted by means of the ultraviolet ray emitting device and a white light emitted by means of the white light emitting device reflected off the skin and transmitted, to pass therethrough; and an emission control device for controlling the ultraviolet ray emitting device and the white light emitting device such that the ultraviolet ray and the white light can be emitted together. The emission control device adjusts the strength of the white light on the basis of white light control information from the outside.

公开(公告)号：US20140183526A1

公开(公告)日：2014-07-03

申请号：US14140933

申请日：2013-12-26

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Ki Yon PARK ,  Hwa Mok Kim ,  Young Hwan Son ,  Daewoong Suh

IPC: H01L31/108 ,  H01L31/18 ,  H01L31/09

CPC classification number: H01L31/1828 ,  H01L31/022483 ,  H01L31/03529 ,  H01L31/0392 ,  H01L31/108 ,  H01L31/1832 ,  Y02E10/50 ,  Y02E10/52

Abstract: Exemplary embodiments of the present invention relates to a light detection device including a substrate, a non-porous layer disposed on the substrate, a light absorption layer disposed on the non-porous layer, the light absorption layer including pores formed in a surface thereof, a Schottky layer disposed on the surface of the light absorption layer and in the pores, and a first electrode layer disposed on the Schottky layer.

Abstract translation: 本发明的示例性实施例涉及一种光检测装置，其包括基板，设置在基板上的无孔层，设置在无孔层上的光吸收层，所述光吸收层包括形成在其表面上的孔， 设置在光吸收层的表面和孔中的肖特基层，以及设置在肖特基层上的第一电极层。

公开(公告)号：US20240344672A1

公开(公告)日：2024-10-17

申请号：US18752920

申请日：2024-06-25

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Ki Yon PARK ,  Jun Yong PARK

IPC: F21K9/69 ,  F21Y105/16 ,  F21Y115/10 ,  G02B19/00

CPC classification number: F21K9/69 ,  G02B19/0066 ,  F21Y2105/16 ,  F21Y2115/10

Abstract: A light emitting apparatus includes a substrate, a plurality of light emitting structures, a window, and a reflector. The substrate has a luminous region and a non-luminous region. The plurality of light emitting structures is disposed on the luminous region of the substrate. The window has a dome shape and is disposed to cover the luminous region. The window is configured to control a traveling path of light emitted from the a plurality of light emitting structures. The reflector is configured to support the window and reflect the light emitted from the plurality of light emitting structures. The reflector has an opening that exposes the plurality of light emitting structures mounted on the substrate. A distance between two adjacent light emitting structures of the plurality of light emitting structures is 500 micrometers or less.

公开(公告)号：US20240234641A1

公开(公告)日：2024-07-11

申请号：US18615720

申请日：2024-03-25

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Yuriy BILENKO ,  Ki Yon PARK

IPC: H01L33/44 ,  H01L33/32 ,  H01L33/48 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/44 ,  H01L33/486 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/32

Abstract: A light emitting element package includes a substrate provided with an interconnect portion, a light emitting element mounted on the substrate and connected to the interconnect portion, and a cover member contacting an upper surface of the light emitting element while covering the light emitting element. The cover member comprises Teflon-based organic polymers and has a light transmittance of 85% or more in an ultraviolet wavelength range.

公开(公告)号：US20210206664A1

公开(公告)日：2021-07-08

申请号：US17208983

申请日：2021-03-22

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Yuriy BILENKO ,  Ki Yon PARK ,  Shi Hyun AHN

IPC: C02F1/32 ,  A61L2/10 ,  A61L2/08

Abstract: A sterilization apparatus includes a light source unit for emitting light to a sterilization region for sterilizing a target particle, a power supply unit for supplying power to the light source unit, and a photodiode unit for sensing the light from the light source unit. The photodiode unit is driven by the light from the light source unit.

公开(公告)号：US20210180755A1

公开(公告)日：2021-06-17

申请号：US17170350

申请日：2021-02-08

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Ki Yon PARK ,  Jun Yong PARK

IPC: F21K9/69 ,  G02B19/00

Abstract: A light emitting apparatus comprises a substrate, a plurality of light-emitting diodes provided on the substrate and arranged in a matrix, and a dome-type window provided above the light-emitting diodes to control the path of light emitted from the light-emitting diodes. The height of the window is 70% or less of the diameter of the lower portion of the window so that the view angle of the light emitted from the light-emitting diodes is 90 degrees or less.

公开(公告)号：US20240234644A1

公开(公告)日：2024-07-11

申请号：US18615603

申请日：2024-03-25

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Yuriy BILENKO ,  Ki Yon PARK

IPC: H01L33/48 ,  H01L33/58

CPC classification number: H01L33/483 ,  H01L33/58 ,  H01L2933/0033

Abstract: A light emitting diode package includes a main frame including a base frame and a middle frame disposed on the base frame, a holding frame disposed on the middle frame, a light emitting diode chip disposed on the base frame, and a window secured by the main frame and the holding frame. The middle frame includes a middle frame open portion exposing the light emitting diode chip. The holding frame includes a holding frame open portion at least partially overlapping with the middle frame open portion on a plane. The holding frame open portion has an area decreasing in a direction away from the main frame.