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    Circuit board and manufacturing method therefor
    3.
    发明授权
    Circuit board and manufacturing method therefor 有权

    公开(公告)号：US10681820B2

    公开(公告)日：2020-06-09

    申请号：US16291547

    申请日：2019-03-04

    Applicant: TAIYO YUDEN CO., LTD.

    Inventor： Tatsuro Sawatari ,  Norio Sekiguchi

    IPC: H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/06 ,  H05K1/02 ,  H05K1/05

    Abstract: A circuit board includes: a metal core base material including a first main surface, a second main surface on an opposite side of the first main surface, a side surface, and a projection that projects from the side surface; an outer cover including a first insulation layer that covers the first main surface, a second insulation layer that covers the second main surface, and a third insulation layer that covers the side surface; a first wiring layer provided in the first main surface with the first insulation layer interposed between the first wiring layer and the first main surface; a second wiring layer provided in the second main surface with the second insulation layer interposed between the second wiring layer and the second main surface; and a sealing portion that is made of an insulation material embedded in the outer cover and covers an end surface of the projection.

    Method of manufacturing substrate having cavity
    4.
    发明授权
    Method of manufacturing substrate having cavity 有权
    制造具有空腔的基板的方法

    公开(公告)号：US09301407B2

    公开(公告)日：2016-03-29

    申请号：US14316382

    申请日：2014-06-26

    Applicant: TAIYO YUDEN CO., LTD.

    Inventor： Masashi Miyazaki ,  Yuichi Sugiyama ,  Tatsuro Sawatari ,  Hideki Yokota ,  Yutaka Hata

    IPC: B05D5/12 ,  H05K3/46 ,  H05K3/44 ,  B05D3/12 ,  H05K3/00 ,  H05K3/04 ,  H05K3/30 ,  H05K3/42 ,  H05K3/06 ,  H05K1/18

    CPC classification number: H05K3/4697 ,  B05D3/12 ,  B05D5/12 ,  H05K1/185 ,  H05K3/0044 ,  H05K3/007 ,  H05K3/0094 ,  H05K3/04 ,  H05K3/06 ,  H05K3/30 ,  H05K3/42 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/4647 ,  H05K2201/10204

    Abstract: The method of manufacturing a substrate includes: forming a penetrating hole in a base layer; inserting a metal dummy part in the penetrating hole; forming an insulating portion made of synthetic resin to fill a ring-shaped gap between the penetrating hole and the dummy part; forming lower insulating layers, covering the bottom surface of the dummy part, that are made of synthetic resin on the bottom surface of the base layer to be continuous with the insulating portion; forming upper insulating layers, covering the top surface of the dummy part, that are made of synthetic resin on the top surface of the base layer to be continuous with the insulating portion; forming an exposing hole by routing in the upper insulating layers to expose the top surface of the dummy part; and forming a cavity by removing the dummy part exposed through the exposing hole by etching.

    Abstract translation: 制造基板的方法包括：在基层中形成贯通孔; 将金属虚设部件插入穿透孔中; 形成由合成树脂制成的绝缘部分，以填充所述穿透孔和所述虚拟部件之间的环形间隙; 在所述基底层的底面上形成覆盖所述虚拟部的底面的由合成树脂制成的下绝缘层，以与所述绝缘部连续; 在所述基底层的顶表面上形成覆盖所述虚拟部分的上表面的由合成树脂制成的上绝缘层，以与所述绝缘部分连续; 通过在上绝缘层中布线来形成暴露孔以暴露虚拟部分的顶表面; 并且通过蚀刻去除暴露在暴露孔中的虚拟部分来形成空腔。

    Substrate with built-in electronic component
    5.
    发明授权
    Substrate with built-in electronic component 有权

    公开(公告)号：US09055671B2

    公开(公告)日：2015-06-09

    申请号：US14461245

    申请日：2014-08-15

    Applicant: Taiyo Yuden Co., Ltd.

    Inventor： Tatsuro Sawatari ,  Yuichi Sugiyama

    IPC: H05K1/18 ,  H05K1/02

    CPC classification number: H05K1/0216 ,  H05K1/0231 ,  H05K1/0298 ,  H05K1/183 ,  H05K1/185 ,  H05K3/4697 ,  H05K2201/0187 ,  H05K2201/10522

    Abstract: A substrate with built-in electronic component includes: a core layer that includes a core material and a cavity formed in the core material and containing an insulating material; an insulating layer that includes a ground wiring and a signal wiring and is formed on the core layer; and a plurality of electronic components that each include a first terminal and a second terminal and are stored in the cavity, the plurality of electronic components each having one end portion and the other end portion, the first terminal being formed at the one end portion and connected to the ground wiring, the second terminal being formed at the other end portion and connected to the signal wiring, the plurality of electronic components having at least one of arrangements in which the first terminals face each other and in which the second terminals face each other.

    Electronic circuit module and method for producing the same
    6.
    发明授权
    Electronic circuit module and method for producing the same 有权
    电子电路模块及其制造方法

    公开(公告)号：US08988885B2

    公开(公告)日：2015-03-24

    申请号：US14073287

    申请日：2013-11-06

    Applicant: Taiyo Yuden Co., Ltd.

    Inventor： Tatsuro Sawatari ,  Masashi Miyazaki ,  Yoshiki Hamada ,  Yuichi Sugiyama ,  Kazuaki Ida

    IPC: H05K5/00 ,  H05K9/00 ,  H01L23/552 ,  H01L21/56 ,  H01L23/00

    CPC classification number: H05K9/00 ,  H01L21/561 ,  H01L23/552 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/19105 ,  Y10T29/49146 ,  H01L2224/81

    Abstract: An electronic circuit module includes a substrate with built-in component, a mount component mounted on the substrate with built-in component, a sealing portion covering the mount component, and a shield made of a conductive synthetic resin covering the sealing portion. The substrate with built-in component has a core layer made of a metal, an outer cover made of an insulating synthetic resin, and a first protrusion. The core layer has corners and side faces. The outer cover covers the corners and the side faces, and has a first surface. The first protrusion has a first end face exposed at the outer cover and a second surface adjacent to the first surface, and is formed away from the corners of the side faces to protrude outwardly. The sealing portion covers the mount component. The shield covers the sealing portion, and has a third surface bonded to the first surface and the second surface.

    Abstract translation: 电子电路模块包括具有内置部件的基板，安装在具有内置部件的基板上的安装部件，覆盖安装部件的密封部分和覆盖密封部分的导电合成树脂制成的屏蔽。 具有内置部件的基板具有由金属制成的芯层，由绝缘合成树脂制成的外盖和第一突起。 芯层有拐角和侧面。 外盖覆盖角部和侧面，并且具有第一表面。 第一突起具有在外盖处露出的第一端面和与第一表面相邻的第二表面，并且远离侧面的角部形成以向外突出。 密封部分覆盖安装部件。 护罩覆盖密封部分，并且具有结合到第一表面和第二表面的第三表面。

    Substrate with built-in electronic component
    8.
    发明授权
    Substrate with built-in electronic component 有权
    基板内置电子元器件

    公开(公告)号：US09363897B2

    公开(公告)日：2016-06-07

    申请号：US14133372

    申请日：2013-12-18

    Applicant: Taiyo Yuden Co., Ltd.

    Inventor： Yuichi Sugiyama ,  Tatsuro Sawatari ,  Yusuke Inoue ,  Masashi Miyazaki

    IPC: H05K1/18 ,  H05K1/02 ,  H01L23/00 ,  H05K3/46

    CPC classification number: H05K1/183 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2924/12042 ,  H01L2924/19105 ,  H05K1/0298 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/10636 ,  H05K2203/1469 ,  Y02P70/611 ,  H01L2924/00

    Abstract: Provided is a substrate with built-in electronic component including a component storage layer and two buildup layers. The component storage layer includes an electronic component and a cover portion having an insulating property. The electronic component includes a terminal surface and a main body. The cover portion includes a first surface formed to be flush with the terminal surface, covers the main body of the electronic component, and has a first linear expansion coefficient. The two buildup layers each include an insulating layer and a via portion. The insulating layer is adjacent to the cover portion and has a second linear expansion coefficient larger than the first linear expansion coefficient. The via portion is provided in the insulating layer and connected to the terminal surface. The insulating layer of one of the two buildup layers is formed to be in contact with the terminal surface and the first surface.

    Abstract translation: 提供了具有内置电子部件的基板，包括部件存储层和两个累积层。 部件存储层包括电子部件和具有绝缘性的盖部。 电子部件包括终端面和主体。 盖部包括形成为与端子表面齐平的第一表面，覆盖电子部件的主体，并且具有第一线性膨胀系数。 两个堆积层各自包括绝缘层和通孔部分。 绝缘层与盖部相邻，并且具有大于第一线膨胀系数的第二线膨胀系数。 通孔部分设置在绝缘层中并连接到端子表面。 两个堆积层之一的绝缘层形成为与端子表面和第一表面接触。

    Camera module
    9.
    发明授权
    Camera module 有权
    相机模块

    公开(公告)号：US09253386B2

    公开(公告)日：2016-02-02

    申请号：US14155311

    申请日：2014-01-14

    Applicant: TAIYO YUDEN CO., LTD.

    Inventor： Masashi Miyazaki ,  Yuichi Sugiyama ,  Tatsuro Sawatari ,  Hideki Yokota ,  Yutaka Hata

    IPC: H04N5/225 ,  H01L23/00

    CPC classification number: H04N5/2257 ,  H01L24/47 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H04N5/2253 ,  H04N5/2254 ,  H01L2224/45015 ,  H01L2924/207

    Abstract: A camera module, in which a recessed portion that has a greater depth than the thickness of an imaging device is disposed on the surface (top surface) of an embedded-component substrate. An imaging device is bonded to a bottom of the recessed portion such that an opening is present between the surface (top surface) of the imaging device and the surface (top surface) of the embedded-component substrate. Connection pads on the imaging device are connected to conductor pads disposed on the surface (top surface) of the embedded-component substrate by bonding wires that go through the opening.

    Abstract translation: 在嵌入式部件基板的表面（上表面）上设置相机模块，其中具有比成像装置的厚度更大的深度的凹部。 成像装置结合到凹部的底部，使得在成像装置的表面（顶表面）和嵌入部件基板的表面（顶表面）之间存在开口。 成像装置上的连接焊盘通过接合穿过开口的导线连接到设置在嵌入式组件衬底的表面（顶表面）上的导体焊盘。

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