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    MULTI-LAYER CIRCUIT BOARD
    1.
    发明申请
    MULTI-LAYER CIRCUIT BOARD 审中-公开
    多层电路板

    公开(公告)号：US20160135295A1

    公开(公告)日：2016-05-12

    申请号：US14985657

    申请日：2015-12-31

    Applicant: Zhen Ding Technology Co., Ltd.

    Inventor： CHE-WEI HSU ,  SHIH-PING HSU

    IPC: H05K1/11

    CPC classification number: H05K1/11 ,  H05K3/429 ,  H05K3/4652 ,  Y10T29/49155

    Abstract: A multi-layer circuit board includes a plurality of circuit substrates, a plurality of dielectric layers, and a plurality of metal bumps. Each circuit substrate includes two first trace layers and an insulating layer between the two trace layers. Each electric layer is laminated between two neighboring circuit substrates. At latest one metal bump is arranged between each two neighboring circuit substrates. Each metal bump passes through one dielectric layer. Two opposite ends of each metal bump are connected with the trace layer of the circuit substrate to be electrically connected to the two neighbor circuit substrates.

    Abstract translation: 多层电路板包括多个电路基板，多个电介质层和多个金属凸块。 每个电路衬底包括两个第一迹线层和两个迹线层之间的绝缘层。 每个电层层压在两个相邻的电路基板之间。 最近在每个两个相邻的电路基板之间布置一个金属凸块。 每个金属凸块通过一个电介质层。 每个金属凸块的两个相对端与电路基板的迹线层连接以电连接到两个相邻电路基板。

    METHOD FOR MANUFACTURING IC SUBSTRATE
    2.
    发明申请
    METHOD FOR MANUFACTURING IC SUBSTRATE 有权
    制造IC基板的方法

    公开(公告)号：US20130318785A1

    公开(公告)日：2013-12-05

    申请号：US13891204

    申请日：2013-05-10

    Applicant: ZHEN DING TECHNOLOGY CO., LTD.

    Inventor： CHE-WEI HSU ,  SHIH-PING HSU

    IPC: H05K3/10

    CPC classification number: H05K3/108 ,  H01L21/486 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K3/0097 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2203/1545 ,  Y10T29/49155 ,  Y10T29/49162 ,  Y10T29/49165 ,  H01L2924/00

    Abstract: A method for manufacturing an IC substrate includes following steps: providing a roll of double-sided flexible copper clad laminate; converting the roll of double sided flexible copper clad laminate into a roll of double sided flexible wiring board in a roll to roll manner; cutting the roll of double-sided flexible wiring board into a plurality of separate sheets of double sided flexible wiring board; forming first and second rigid insulating layers on the first and second wiring layers of each sheet of double sided flexible wiring board; forming third and fourth wiring layers on the first and second rigid insulating layers, and electrically connecting the first and third wiring layers, and electrically connecting the fourth and second wiring layers, thereby obtaining a sheet of substrate having a plurality of IC substrate units; and cutting the sheet of substrate into separate IC substrate units.

    Abstract translation: 制造IC基板的方法包括以下步骤：提供一卷双面柔性覆铜层压板; 将双面柔性覆铜层压板卷以卷对卷方式转换成双面柔性布线板卷; 将双面柔性布线板的卷筒切割成多个单独的双面柔性布线板; 在每张双面柔性布线板的第一和第二布线层上形成第一和第二刚性绝缘层; 在第一和第二刚性绝缘层上形成第三和第四布线层，并且电连接第一和第三布线层，并电连接第四和第二布线层，从而获得具有多个IC基板单元的基片; 并将基片切割成单独的IC基片单元。

    PRINTED CIRCUIT BOARD WITH EMBEDDED COMPONENT AND METHOD FOR MANUFACTRUING SAME
    3.
    发明申请
    PRINTED CIRCUIT BOARD WITH EMBEDDED COMPONENT AND METHOD FOR MANUFACTRUING SAME 有权
    具有嵌入式组件的印刷电路板及其制造方法

    公开(公告)号：US20140182892A1

    公开(公告)日：2014-07-03

    申请号：US14109913

    申请日：2013-12-17

    Applicant: Zhen Ding Technology Co., Ltd.

    Inventor： SHIH-PING HSU

    IPC: H05K1/18 ,  H05K3/32 ,  H05K1/11

    CPC classification number: H05K3/4697 ,  H05K1/186 ,  H05K3/4602 ,  H05K2201/09072 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913

    Abstract: A printed circuit board with an embedded component includes a double-sided wiring board, an electronic component, and many conductive pastes. The wiring board includes a first wiring layer, a base layer, a first insulating layer, and a second wiring layer. The base layer has an opening exposing a portion of the second surface of the first insulating layer to the outside. The second wiring layer includes electrical contact pads. The conductive blind vias are formed in the first insulating layer. Each electrical contact pad is electrically connected to an end of the corresponding conductive blind via. The other ends of the conductive blind vias are adjacent to the first surface. A filling through hole is formed in the double-sided wiring board. The conductive pastes are respectively electrically connected to the conductive blind vias. The electronic component is adhered to and electrically connected to the conductive paste.

    Abstract translation: 具有嵌入式部件的印刷电路板包括双面布线板，电子部件和许多导电浆料。 布线基板包括第一布线层，基底层，第一绝缘层和第二布线层。 底层具有将第一绝缘层的第二表面的一部分暴露于外部的开口。 第二布线层包括电接触垫。 导电盲孔形成在第一绝缘层中。 每个电接触垫电连接到相应的导电盲孔通孔的一端。 导电盲孔的另一端与第一表面相邻。 填充通孔形成在双面布线板中。 导电膏分别电连接到导电盲孔。 电子部件粘附并电连接到导电膏。

    PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING BODY HAVING SAME
    5.
    发明申请
    PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING BODY HAVING SAME 审中-公开
    包装基板，其制造方法和具有相同的芯片包装体

    公开(公告)号：US20140036465A1

    公开(公告)日：2014-02-06

    申请号：US13863400

    申请日：2013-04-16

    Applicant: ZHEN DING TECHNOLOGY CO., LTD.

    Inventor： CHU-CHIN HU ,  SHIH-PING HSU ,  E-TUNG CHOU

    IPC: H05K1/18 ,  H05K3/40

    CPC classification number: H05K1/181 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K3/0097 ,  H05K3/4038 ,  Y10T29/49165 ,  H01L2924/00014

    Abstract: A packaging substrate includes a copper foil substrate, a sputtering copper layer, a dielectric layer, a plurality of electrically conductive connection points, and an electrically conductive pattern layer. The sputtering copper layer is formed on the copper foil substrate. The electrically conductive connection points are formed on a surface of the sputtering copper layer, which is away from the copper foil substrate. The dielectric layer is sandwiched between the electrically conductive pattern layer and the sputtering copper layer. A plurality of first blind via are formed in the first dielectric layer. The electrically conductive pattern layer includes a plurality of electrically conductive traces and a plurality of connection pads. Each electrically conductive connection point is electrically connected to the electrically conductive trace by the first blind via.

    Abstract translation: 封装基板包括铜箔基板，溅射铜层，电介质层，多个导电连接点以及导电图案层。 在铜箔基板上形成溅射铜层。 导电连接点形成在溅射铜层的远离铜箔衬底的表面上。 电介质层夹在导电图案层和溅射铜层之间。 多个第一通孔形成在第一电介质层中。 导电图案层包括多个导电迹线和多个连接焊盘。 每个导电连接点通过第一盲通孔电连接到导电迹线。

    MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
    6.
    发明申请
    MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME 审中-公开
    多层印刷电路板及其制造方法

    公开(公告)号：US20140144675A1

    公开(公告)日：2014-05-29

    申请号：US14084502

    申请日：2013-11-19

    Applicant: Zhen Ding Technology Co., Ltd.

    Inventor： SHIH-PING HSU

    IPC: H05K1/02 ,  H05K3/46

    CPC classification number: H05K3/4694 ,  H05K1/111 ,  H05K1/183 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2201/09127 ,  H05K2201/09445 ,  H05K2201/09472 ,  Y10T156/1064

    Abstract: An exemplary multi-layer printed circuit board includes a multi-layer substrate with a recess, and a first high density wiring substrate received in the recess. The multi-layer substrate includes a base layer, a first wiring layer arranged on the base layer, first insulating layers, and third wiring layers. The first insulating layers and the third wiring layers are alternately arranged on the first wiring layer, such that there is one first insulating layer sandwiched between each two adjacent wiring layers of the first wiring layer and the third wiring layers. The first high density wiring substrate includes first high density wiring layers and third insulating layers, which are alternately arranged on each other. An outmost first high density wiring layer is exposed outside to define third electrical contact pads corresponding to the first electrical contact pads.

    Abstract translation: 示例性的多层印刷电路板包括具有凹部的多层基板和容纳在凹部中的第一高密度布线基板。 多层基板包括基底层，布置在基底层上的第一布线层，第一绝缘层和第三布线层。 第一绝缘层和第三布线层交替布置在第一布线层上，使得夹在第一布线层和第三布线层的每两相邻布线层之间的一个第一绝缘层。 第一高密度布线基板包括彼此交替布置的第一高密度布线层和第三绝缘层。 最外面的第一高密度布线层暴露在外面以限定对应于第一电接触焊盘的第三电接触焊盘。

    INTERPOSER AND PACKAGE ON PACKAGE STRUCTURE
    7.
    发明申请
    INTERPOSER AND PACKAGE ON PACKAGE STRUCTURE 有权
    包装和包装在包装结构上

    公开(公告)号：US20140118951A1

    公开(公告)日：2014-05-01

    申请号：US14064202

    申请日：2013-10-28

    Applicant: Zhen Ding Technology Co., Ltd.

    Inventor： SHIH-PING HSU

    IPC: H05K1/02

    CPC classification number: H05K1/0206 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0209 ,  H05K1/141 ,  H05K3/284 ,  H05K2201/042 ,  H01L2924/00014

    Abstract: A heat-dissipating interposer includes an insulating base, a plurality of conductive pillars and a thermal conducting frame. The insulating base includes a first surface and an opposite second surface. The conductive pillars are arranged on the insulating base. The conductive pillars protrude from the second surface. The height of the conductive pillars relative to the second surface is greater than the thickness of the insulating base. The thermal conducting frame is placed on the second surface and receives a heat-generating component. The interposer can be used in a package on package structure.

    Abstract translation: 散热插入件包括绝缘基座，多个导电支柱和导热框架。 绝缘基座包括第一表面和相对的第二表面。 导电柱布置在绝缘基底上。 导电柱从第二表面突出。 导电柱相对于第二表面的高度大于绝缘基底的厚度。 导热框架放置在第二表面上并且接收发热部件。 内插器可用于封装结构上的封装。

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