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公开(公告)号:US20240008291A1
公开(公告)日:2024-01-04
申请号:US17856872
申请日:2022-07-01
申请人: Intel Corporation
发明人: Abhishek Anil Sharma , Tahir Ghani , Anand Murthy , Wilfred Gomes
IPC分类号: H01L27/11507 , H01L23/427 , H01L27/11514 , H01L49/02 , H01L29/423 , H01L29/06 , H01L29/66 , H01L29/775 , H01L29/786
CPC分类号: H01L27/11507 , H01L23/427 , H01L27/11514 , H01L28/55 , H01L29/42392 , H01L29/0673 , H01L29/66439 , H01L29/775 , H01L29/78696
摘要: Bits are stored in an array with multiple capacitors per access transistor. An array of multiple ferroelectric capacitors shares a nanowire or nanosheet as a common plate and stores information accessed by a single common select transistor, which uses the nanowire or nanosheet for its channel. In an integrated circuit (IC) system, a group of bitlines is connected to a capacitor array by arrays of nanowires or nanosheets and wordline-controlled non-planar transistors. An IC die with a capacitor array accessed by a single select transistor and sharing a nanowire or nanosheet is coupled to a power supply and a cooling structure.
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公开(公告)号:US20240008286A1
公开(公告)日:2024-01-04
申请号:US17856878
申请日:2022-07-01
申请人: Intel Corporation
IPC分类号: H01L27/11514 , H01L29/78 , H01L29/66 , H01L23/522 , H01L23/528
CPC分类号: H01L27/11514 , H01L29/78391 , H01L29/6684 , H01L23/5226 , H01L23/5283
摘要: Bits are stored in an array with multiple storage elements sharing a single access transistor and a storage line coupled to the transistor. A single common select transistor accesses information stored in an array of storage elements. Other arrays of storage elements on parallel storage lines can be coupled into a crosspoint array by source lines orthogonal to the storage lines. The storage elements may be non-volatile. In an integrated circuit system, the array may be coupled to a power supply and a cooling structure.
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公开(公告)号:US20230292531A1
公开(公告)日:2023-09-14
申请号:US17690650
申请日:2022-03-09
发明人: Meng-Han LIN , Chia-En HUANG
IPC分类号: H01L27/24 , H01L27/11514 , H01L27/22
CPC分类号: H01L27/2454 , H01L27/11514 , H01L27/228
摘要: A memory device includes two word-line electrodes, two source-line electrodes, and two data storage features for use by four memory cells, which are referred to as first, second, third and fourth memory cells. One word-line electrode is common to the first and second memory cells, and the other word-line electrode is common to the third and fourth memory cells. One source-line electrode is common to the first and second memory cells, and the other source-line electrode is common to the third and fourth memory cells. One data storage feature is common to the first and third memory cells, and the other data storage feature is common to the second and fourth memory cells.
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公开(公告)号:US20230206978A1
公开(公告)日:2023-06-29
申请号:US17646259
申请日:2021-12-28
IPC分类号: G11C11/22 , G11C7/12 , H01L27/11514
CPC分类号: G11C11/2273 , G11C11/221 , G11C7/12 , H01L27/11514
摘要: Methods, systems, and devices for techniques to perform a sense operation are described. In some examples, a memory device may include a pair of transistor to precharge a digit line. A first transistor of the pair of transistors may be coupled with a first node and a second transistor of the pair of transistors may be coupled with a second node. In some cases, the first node and the second node may be selectively coupled via a transistor. The first and second transistors may be activated to precharge the first and second nodes. In some examples, a pulse may be applied to a capacitor coupled with the second node to transfer a charge to the digit line. In some cases, the cascode transistor may maintain or control the voltage of the digit line to be at or below an upper operating voltage of the memory cell.
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公开(公告)号:US20180331114A1
公开(公告)日:2018-11-15
申请号:US15969302
申请日:2018-05-02
发明人: Daniele Vimercati
IPC分类号: H01L27/11514 , G11C11/22
CPC分类号: H01L27/11514 , G11C11/221 , G11C11/2259
摘要: Methods, systems, and devices for plate node configurations and operations for a memory array are described. A single plate node of a memory array may be coupled to multiple rows or columns of memory cells (e.g., ferroelectric memory cells) in a deck of memory cells. The single plate node may perform the functions of multiple plate nodes. The number of contacts to couple the single plate node to the substrate may be less than the number of contacts to couple multiple plate nodes to the substrate. Connectors or sockets in a memory array with a single plate node may define a size that is less than a size of the connectors or sockets with multiple plate nodes. In some examples, a single plate node of the memory array may be coupled to multiple lines of a memory cells in multiple decks of memory cells.
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公开(公告)号:US20180323214A1
公开(公告)日:2018-11-08
申请号:US16020712
申请日:2018-06-27
发明人: Kamal M. Karda , Chandra Mouli , Gurtej S. Sandhu
IPC分类号: H01L27/11597 , H01L29/49 , H01L27/11585 , H01L21/28 , H01L29/51 , H01L27/1157 , H01L29/24 , H01L29/423 , H01L29/66 , H01L29/786 , H01L27/11582
CPC分类号: H01L27/11597 , G11C11/22 , H01L21/02568 , H01L21/28291 , H01L27/11514 , H01L27/1157 , H01L27/11578 , H01L27/11582 , H01L27/11585 , H01L27/1159 , H01L29/0649 , H01L29/1037 , H01L29/24 , H01L29/42384 , H01L29/42392 , H01L29/4908 , H01L29/516 , H01L29/6684 , H01L29/7827 , H01L29/78642 , H01L29/78681 , H01L2029/42388
摘要: A vertical ferroelectric field effect transistor construction comprises an isolating core. A transition metal dichalcogenide material encircles the isolating core and has a lateral wall thickness of 1 monolayer to 7 monolayers. A ferroelectric gate dielectric material encircles the transition metal dichalcogenide material. Conductive gate material encircles the ferroelectric gate dielectric material. The transition metal dichalcogenide material extends elevationally inward and elevationally outward of the conductive gate material. A conductive contact is directly against a lateral outer sidewall of the transition metal dichalcogenide material that is a) elevationally inward of the conductive gate material, or b) elevationally outward of the conductive gate material. Additional embodiments are disclosed.
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公开(公告)号:US20180204845A1
公开(公告)日:2018-07-19
申请号:US15919453
申请日:2018-03-13
申请人: Guobiao ZHANG
发明人: Guobiao ZHANG
IPC分类号: H01L27/112 , H01L27/06 , H01L27/24 , H01L27/11514 , H01L27/11597 , H01L27/22 , H01L23/525 , G11C17/16
CPC分类号: H01L27/11206 , G11C13/0004 , G11C13/0007 , G11C13/003 , G11C17/16 , G11C17/165 , G11C17/18 , G11C2213/15 , G11C2213/71 , G11C2213/73 , H01L23/5252 , H01L27/0688 , H01L27/11514 , H01L27/11597 , H01L27/224 , H01L27/2409 , H01L27/2427 , H01L27/2454 , H01L27/249 , H01L45/04 , H01L45/06 , H01L45/1226 , H01L45/144 , H01L45/146
摘要: The present invention discloses a three-dimensional vertical multiple-time-programmable memory (3D-MTPV). It comprises horizontal address lines and memory holes there-through, a re-programmable layer and vertical address lines in said memory holes. The re-programmable layer comprises at least first and second sub-layers with different re-programmable materials. The 3D-MTPV comprises no separate diode layer.
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公开(公告)号:US10020062B1
公开(公告)日:2018-07-10
申请号:US15792983
申请日:2017-10-25
申请人: SK hynix Inc.
发明人: Sung-Lae Oh , Jin-Ho Kim , Dong-Hyuk Kim , Soo-Nam Jung
IPC分类号: G11C16/16 , G11C16/04 , H01L27/11582 , H01L27/11514 , G11C16/34
CPC分类号: G11C16/16 , G11C16/0483 , G11C16/3418 , G11C16/3427 , G11C16/3477 , H01L27/11514 , H01L27/1157 , H01L27/11582
摘要: A nonvolatile memory device includes well regions formed in a substrate and arranged in a first direction; a memory block including sub blocks which are formed over the substrate and correspond to the well regions, respectively; and bit lines disposed over the memory block, and extending in the first direction. Each of the sub blocks includes channel layers which are formed in a vertical direction between a corresponding well region and the bit lines, word lines and at least one drain select line and at least one erase prevention line, which are stacked over the substrate along the channel layers. In an erase operation, an erase voltage is applied to a well region corresponding to a selected sub block and an erase preventing voltage is applied to an erase prevention line included in an unselected sub block, the erase voltage may be prevented from being transferred to the unselected sub block.
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公开(公告)号:US09935114B1
公开(公告)日:2018-04-03
申请号:US15402679
申请日:2017-01-10
IPC分类号: H01L21/02 , H01L27/11507
CPC分类号: H01L27/11507 , H01L27/11514
摘要: A method of forming an array comprising pairs of vertically opposed capacitors comprises forming a conductive lining in individual capacitor openings in support material. An elevational mid-portion of individual of the conductive linings is removed to form an upper capacitor electrode lining and a lower capacitor electrode lining that are elevationally separate and spaced from one another in the individual capacitor openings. A capacitor insulator is formed laterally outward of the upper and lower capacitor electrode linings. Conductive material is formed laterally outward of the capacitor insulator to comprise a shared capacitor electrode that is shared by vertically opposed capacitors in individual of the pairs of vertically opposed capacitors. Other methods and structure independent of method of manufacture are disclosed.
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公开(公告)号:US09928912B2
公开(公告)日:2018-03-27
申请号:US15489272
申请日:2017-04-17
发明人: Boon Bing Ng , Hang Ru Goy
IPC分类号: G11C11/34 , G11C16/08 , G11C8/04 , G11C16/24 , G11C8/08 , G11C16/10 , G11C16/26 , H01L27/11514 , H01L29/423 , H01L29/78 , G11C8/12 , H01L27/11582
CPC分类号: G11C16/08 , G11C8/04 , G11C8/08 , G11C8/12 , G11C16/10 , G11C16/24 , G11C16/26 , H01L27/11514 , H01L27/11582 , H01L29/42344 , H01L29/7841
摘要: Three-dimensional addressing for erasable programmable read only memory (EPROM) can include a number of EPROM banks, a number of shift registers, a row select data signal, a column select data signal, and a bank select data signal.
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