公开(公告)号：US20170323851A1

公开(公告)日：2017-11-09

申请号：US15585168

申请日：2017-05-03

Applicant: CYNTEC CO., LTD.

Inventor： Chih Hung Wei

IPC: H01L23/522 ,  H01F27/34 ,  H01L21/302 ,  H01F17/00 ,  H01L49/02

Abstract: A multilayer electrical component is disclosed, wherein the multilayer electrical component comprises: a plurality of magnetic layers stacked over one another, wherein each magnetic layer is made of a first magnetic material, and wherein for each magnetic layer, a trench is formed in the magnetic layer, the bottom surface of the trench being located higher than the bottom surface of the magnetic layer; a second material that is different from the first material is disposed in the trench in the magnetic layer; and a conductive layer is disposed over the trench for forming a conductive element of the electrical component.

公开(公告)号：US20170317517A1

公开(公告)日：2017-11-02

申请号：US15498492

申请日：2017-04-27

Applicant: CYNTEC CO., LTD.

Inventor： Kuan-Yu Chiu ,  Hsieh-Shen Hsieh ,  Sheng-Heng Chung ,  Chien-Tung Lu

IPC: H02J7/02 ,  H02J50/10 ,  H01F41/094 ,  H01F27/28 ,  H01F41/069

CPC classification number: H02J7/025 ,  H01F5/06 ,  H01F27/2823 ,  H01F27/324 ,  H01F38/14 ,  H01F41/069 ,  H01F41/094 ,  H02J50/10

Abstract: A wireless charging coil with a high Q factor includes a plurality of wire groups. Each of the wire groups includes a plurality of wires, a self-bonding film and a plurality of insulation layers. The wires are spun together in a helical manner to form a self-woven structure of the wire group. The self-bonding film surrounds the plurality of wires, and each of the insulation layers covers a surface of a wire. The plurality of wire groups together are wound into a plurality of turns on a same winding surface, and all of the plurality of wire groups are wound on the same winding surface. Each turn is wound by the plurality of wire groups.

公开(公告)号：US20170316954A1

公开(公告)日：2017-11-02

申请号：US15654703

申请日：2017-07-20

Applicant: CYNTEC CO., LTD.

Inventor： BAU-RU LU ,  DA-JUNG CHEN ,  YI-CHENG LIN

IPC: H01L21/48 ,  H01L21/768 ,  H01L23/495 ,  H01L25/16 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L21/4825 ,  H01L21/4821 ,  H01L21/76877 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49527 ,  H01L23/49534 ,  H01L23/49558 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/215 ,  H01L2224/24011 ,  H01L2224/24247 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/49123 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer over the top surface or the bottom surface of the plurality of metal parts; and forming a conductive pattern layer on the insulating layer for making electrical connections with at least one portion of the plurality of metal parts.

公开(公告)号：US09772459B2

公开(公告)日：2017-09-26

申请号：US14970231

申请日：2015-12-15

Applicant: CYNTEC CO., LTD.

Inventor： Ming-Che Wu

IPC: G02B6/12 ,  G02B6/42

CPC classification number: G02B6/4245 ,  G02B6/423 ,  G02B6/4246 ,  G02B6/428

Abstract: An optoelectronic module includes an interposer base having first and second recesses formed on a specified surface thereof; a joint material layer filled in the first and second recesses; a first optoelectronic element placed in the first recess and coupled to the interposer base via the joint material layer, wherein an optical signal is emitted from or passes through a lateral surface of the first optoelectronic element; and a second optoelectronic element placed in the second recess and coupled to the interposer base via the joint material layer, wherein a lateral surface of the second optoelectronic element faces the lateral surface of the first optoelectronic element for coupling to and receiving the optical signal emitted from or passing through the lateral surface of the first optoelectronic element. A fixture is used to place the first and second optoelectronic elements into the first and second recesses while controlling some critical distances.

公开(公告)号：US20170223835A1

公开(公告)日：2017-08-03

申请号：US15414602

申请日：2017-01-24

Applicant: CYNTEC CO., LTD.

Inventor： Chun Hsien Lu ,  Bau-Ru Lu ,  Kaipeng Chiang

IPC: H05K1/18 ,  H01F27/29

CPC classification number: H05K1/181 ,  H01F5/00 ,  H01F27/06 ,  H01F27/29 ,  H01F27/292 ,  H01F2027/065 ,  H01F2027/297 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10174

Abstract: An electronic module is provided. The electronic module includes: a magnetic device having a magnetic body, electronic devices, and a substrate, wherein a first lead extends out from a first lateral surface and a second lead extends out from a second lateral surface opposite to the first lateral surface of the magnetic body and the substrate and the second lead of the magnetic device are located at a same lateral side of the magnetic body and the second lead is extended from the second lateral surface of the magnetic body to the substrate to electrically connect the magnetic device and the substrate.

公开(公告)号：US09719159B2

公开(公告)日：2017-08-01

申请号：US14693956

申请日：2015-04-23

Applicant: CYNTEC CO., LTD.

Inventor： Lu-Kuei Lin ,  Shih-Feng Chien ,  Po-I Wu

IPC: H01F27/24 ,  H01F5/00 ,  C22C38/32 ,  C22C45/02 ,  C22C38/34 ,  H01F1/153 ,  H01F17/04

CPC classification number: C22C38/32 ,  B22F1/00 ,  B22F1/0014 ,  C22C33/0264 ,  C22C38/002 ,  C22C38/02 ,  C22C38/34 ,  C22C45/02 ,  C22C2200/02 ,  C22C2202/02 ,  H01F1/153 ,  H01F1/15375 ,  H01F5/00 ,  H01F17/04 ,  H01F27/24 ,  H01F2017/048

Abstract: Mixed magnetic powders for making a magnetic core or body is disclosed, wherein the mixed magnetic powders comprises: a first magnetic powder; a second magnetic powder, wherein the first magnetic powder and the second magnetic powder are made of a same soft magnetic material, wherein the ratio of the D50 of the first magnetic powder to the D50 of the second magnetic powder is in the range of 5 to 12, wherein the first magnetic powder weighs 50 to 90 percent of the total weight of the first magnetic powder and the second magnetic powder; and the second magnetic powder weighs 10 to 50 percent of the total weight of the first magnetic powder and the second magnetic powder.

公开(公告)号：US20170148955A1

公开(公告)日：2017-05-25

申请号：US14948366

申请日：2015-11-22

Applicant: CYNTEC CO., LTD.

Inventor： Ming-Che Wu

IPC: H01L33/48 ,  H01L21/768 ,  H01L21/683 ,  H01S5/022 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/18 ,  H01L21/48 ,  H01L33/62

CPC classification number: H01L33/483 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/6835 ,  H01L21/76898 ,  H01L25/167 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/1876 ,  H01L33/486 ,  H01L33/62 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01S5/02208 ,  H01S5/02236 ,  H01L2924/00014

Abstract: The method of a wafer level packaging includes preparing a substrate, assembling a system on a first side of the substrate, and placing solder balls on a second side of the substrate. The soldering balls s fixed on to the second side of the substrate after the module has been assembled.

公开(公告)号：US20170025216A1

公开(公告)日：2017-01-26

申请号：US15283451

申请日：2016-10-03

Applicant: CYNTEC CO., LTD.

Inventor： Wen-Hsiung Liao ,  Roger Hsieh ,  Hideo Ikuta ,  Yueh-Lang Chen

IPC: H01F27/255 ,  H01F1/22 ,  H01F27/28 ,  H01F27/32 ,  B22F3/16 ,  B22F7/08

CPC classification number: H01F27/255 ,  B22F3/12 ,  B22F3/16 ,  B22F5/00 ,  B22F7/08 ,  H01F1/22 ,  H01F5/00 ,  H01F17/04 ,  H01F27/24 ,  H01F27/2823 ,  H01F27/292 ,  H01F27/32 ,  H01F41/0246 ,  H01F2017/048 ,  H05K1/18

Abstract: A method for manufacturing an electronic device, the method comprising: providing a conducting wire; forming a mixture with the conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference; and performing a molding process on the conducting wire and the mixture, wherein by means of the first hardness difference of the first magnetic powder and the second magnetic powder, the mixture and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.

Abstract translation: 一种电子设备的制造方法，所述方法包括：提供导线; 与埋入其中的导线形成混合物，其中所述混合物包括：第一磁粉和第二磁粉，其中所述第一磁粉的平均粒径大于所述第二磁粉的平均粒径， 第一磁粉的维克氏硬度大于第二磁粉的维氏硬度第一硬度差; 对所述导线和所述混合物进行成型处理，其中，通过所述第一磁性粉末和所述第二磁性粉末的所述第一硬度差，将所述混合物和埋入其中的所述导线组合在一起形成一体磁性体 温度低于导线的熔点。

公开(公告)号：US20170011841A1

公开(公告)日：2017-01-12

申请号：US14980358

申请日：2015-12-28

Applicant: CYNTEC CO., LTD.

Inventor： Shih-Feng Chien ,  Lu-Kuei Lin ,  I-Feng Lin

IPC: H01F27/28 ,  H01F27/24

CPC classification number: H01F27/306 ,  H01F27/26

Abstract: A transformer structure with high magnetic permeability utilization is provided. The transformer structure includes a first magnetically permeable unit, at least one winding and a second magnetically permeable unit. The winding is wound around a winding portion of the first magnetically permeable unit to generate magnetic flux in the winding portion of the first magnetically permeable unit. The first magnetically permeable unit includes a first coupling structure and the second magnetically permeable unit includes a second coupling structure. The first coupling structure and the second coupling structure extend to an edge area of the transformer structure. The magnetic flux from the winding portion of the first magnetically permeable unit flows to the first coupling structure and the second coupling structure in sequence when the first coupling structure is coupled to the second coupling structure.

Abstract translation: 提供了一种具有高磁导率利用率的变压器结构。 变压器结构包括第一导磁单元，至少一个绕组和第二导磁单元。 绕组缠绕在第一导磁单元的绕组部分上，以在第一导磁单元的绕组部分中产生磁通量。 第一导磁单元包括第一耦合结构，第二导磁单元包括第二耦合结构。 第一耦合结构和第二耦合结构延伸到变压器结构的边缘区域。 当第一耦合结构耦合到第二耦合结构时，来自第一导磁单元的绕组部分的磁通量依次流到第一耦合结构和第二耦合结构。

公开(公告)号：US09538660B2

公开(公告)日：2017-01-03

申请号：US14594084

申请日：2015-01-10

Applicant: CYNTEC CO., LTD.

Inventor： Da-Jung Chen ,  Chun-Tiao Liu ,  Bau-Ru Lu

IPC: H05K5/00 ,  H05K1/18 ,  H01L23/64 ,  H01L25/16 ,  H01F27/24 ,  H01F27/29 ,  H01F27/40 ,  H01F27/02 ,  H05K3/34 ,  H01L23/24 ,  H01L23/31 ,  H01L23/552 ,  H01L23/00

CPC classification number: H05K1/181 ,  H01F27/022 ,  H01F27/027 ,  H01F27/24 ,  H01F27/29 ,  H01F27/40 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/552 ,  H01L23/645 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.

Abstract translation: 本发明公开了一种电子封装结构。 本体具有其上具有空腔的顶表面，第一导电元件设置在空腔中，并且第二导电元件设置在主体中。 电连接到第一导电元件的第一外部电极和与第二导电元件电连接的第二外部电极都设置在主体的顶表面上或由封装化合物的顶表面形成的第一表面和暴露部分 的未被封装化合物覆盖的身体的顶表面。