公开(公告)号：US5919603A

公开(公告)日：1999-07-06

申请号：US967196

申请日：1997-10-29

申请人： Masashi Miyazaki ,  Haruo Akahoshi ,  Shozo Nohara ,  Kenzi Kikuta ,  Toshiaki Ishimaru

发明人： Masashi Miyazaki ,  Haruo Akahoshi ,  Shozo Nohara ,  Kenzi Kikuta ,  Toshiaki Ishimaru

IPC分类号： G03F7/033 ,  G03F7/30 ,  G03F7/32 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  G03C1/725 ,  C08J3/28

CPC分类号： G03F7/322 ,  G03F7/033 ,  G03F7/30 ,  H05K3/108 ,  H05K3/184 ,  H05K2203/0783 ,  H05K2203/0793 ,  H05K3/0076 ,  Y10T29/49126 ,  Y10T29/49156

摘要： In an additive process for producing printed wiring boards, by using a developer comprising a chlorine-free organic solvent and an alkaline aqueous solution and as a resist material a copolymer of methacrylic acid and methyl methacrylate or the like, the production steps are simplified even if a substrate having a large area is used, and abolishment of chlorine-containing organic solvent as a developer becomes possible.

公开(公告)号：US5472563A

公开(公告)日：1995-12-05

申请号：US265050

申请日：1994-06-24

申请人： Kiyonori Kogawa ,  Nobuaki Ooki ,  Masami Kawaguchi ,  Motoyo Wajima ,  Haruo Akahoshi ,  Akira Nagai

发明人： Kiyonori Kogawa ,  Nobuaki Ooki ,  Masami Kawaguchi ,  Motoyo Wajima ,  Haruo Akahoshi ,  Akira Nagai

IPC分类号： H05K3/24 ,  H05K3/38 ,  H05K3/46 ,  B44C1/22

CPC分类号： H05K3/384 ,  H05K3/385 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/072 ,  H05K2203/1157 ,  H05K3/383 ,  H05K3/4611

摘要： The present invention provides a printed circuit board which is high in acid resistance, mechanical strength at high temperature and bond strength, a method for making the printed circuit board and an apparatus used for making the printed circuit board. The technique of the present invention is characterized in that a metallic film having metal particles discretely distributed therein is provided on a roughened surface of copper circuit pattern on an insulating substrate which has been oxidized to form copper oxide and thereafter reduced.

摘要翻译： 本发明提供一种耐酸性高，高温机械强度和粘合强度的印刷电路板，制造印刷电路板的方法和用于制造印刷电路板的装置。 本发明的技术特征在于，在绝缘基板上的铜电路图案的粗糙化表面上设置具有分散在其中的金属粒子的金属膜，所述绝缘基板被氧化形成氧化铜，之后被还原。

公开(公告)号：US5028513A

公开(公告)日：1991-07-02

申请号：US336771

申请日：1989-04-13

申请人： Kanji Murakami ,  Mineo Kawamoto ,  Akio Tadokoro ,  Haruo Akahoshi ,  Toshikazu Narahara ,  Ritsuji Toba ,  Toshiaki Ishimaru ,  Nobuyuki Hayashi ,  Motoyo Wajima

发明人： Kanji Murakami ,  Mineo Kawamoto ,  Akio Tadokoro ,  Haruo Akahoshi ,  Toshikazu Narahara ,  Ritsuji Toba ,  Toshiaki Ishimaru ,  Nobuyuki Hayashi ,  Motoyo Wajima

IPC分类号： C23C18/40 ,  H05K3/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  H05K3/28 ,  H05K3/38

CPC分类号： H05K3/282 ,  H05K3/108 ,  H05K2201/0355 ,  H05K2203/0591 ,  H05K2203/072 ,  H05K2203/1105 ,  H05K2203/124 ,  H05K3/0076 ,  H05K3/062 ,  H05K3/383

摘要： The present invention provide a process for producing printed circuit boards which comprises the steps of(a) roughening a surface of a copper layer formed on an insulating board.(b) coating the roughened surface of copper layer with a photo-resist layer containing a sublimable copper-corrosion inhibitor, exposing the resist layer selectively to actinic rays according to a circuit pattern to form, and developing the resulting resist layer, thereby forming plating-resist coats on circuit-negative pattern portions of the copper layer,(c) heat-treating the plating-resist coats,(d) plating chemically the circuit-corresponding portion with copper,(e) removing the plating-resist coats, and(f) removing the copper layer except the circuit-corresponding portion thereof.

公开(公告)号：US4632852A

公开(公告)日：1986-12-30

申请号：US746099

申请日：1985-06-18

申请人： Haruo Akahoshi ,  Kanji Murakami ,  Mineo Kawamoto ,  Motoyo Wajima ,  Rituji Toba ,  Shoji Kawakubo ,  Akio Tadokoro

发明人： Haruo Akahoshi ,  Kanji Murakami ,  Mineo Kawamoto ,  Motoyo Wajima ,  Rituji Toba ,  Shoji Kawakubo ,  Akio Tadokoro

IPC分类号： C23C18/40 ,  H05K3/18 ,  C23C3/02

CPC分类号： H05K3/187 ,  C23C18/40

摘要： In a process for electroless copper plating in an electroless copper plating solution containing a copper salt, a complexing agent for the copper salt, a reducing agent for the copper salt, and a pH-adjusting agent, a plating film having distinguished mechanical properties can be obtained by adding at least one of soluble inorganic silicon compounds and soluble inorganic germanium compounds and conducting the electroless copper plating by injecting an oxygen-containing gas into the plating solution or by adding an oxidizing agent to the plating solution or by both injection or the oxygen-containing gas and addition of the oxidizing agent thereto. The stability of the electroless copper plating solution can be maintained better thereby and substantially thick plating is possible.

摘要翻译： 在含有铜盐，铜盐络合剂，铜盐还原剂和pH调节剂的化学镀铜溶液中的无电镀铜方法中，具有显着的机械性能的镀膜可以是 通过添加可溶性无机硅化合物和可溶性无机锗化合物中的至少一种而进行无电镀铜，通过将含氧气体注入镀液中或者通过向镀液中添加氧化剂，或者通过注入或氧气 并且向其中加入氧化剂。 可以更好地保持化学镀铜溶液的稳定性，并且可以实现基本上厚的镀覆。

公开(公告)号：US4604160A

公开(公告)日：1986-08-05

申请号：US689802

申请日：1985-01-08

申请人： Kanji Murakami ,  Haruo Akahoshi ,  Mineo Kawamoto ,  Motoyo Wajima ,  Yoichi Matsuda ,  Kyoji Kawakubo ,  Minoru Kanechiku ,  Toyofusa Yoshimura ,  Makoto Matsunaga

发明人： Kanji Murakami ,  Haruo Akahoshi ,  Mineo Kawamoto ,  Motoyo Wajima ,  Yoichi Matsuda ,  Kyoji Kawakubo ,  Minoru Kanechiku ,  Toyofusa Yoshimura ,  Makoto Matsunaga

IPC分类号： H01F41/04 ,  H05K1/00 ,  H05K1/16 ,  H05K3/20 ,  C23F1/02 ,  B05D5/12 ,  B44C1/22 ,  C25D5/02

CPC分类号： H05K1/165 ,  H01F41/042 ,  H05K3/205 ,  H01L2221/68345 ,  H05K1/0393 ,  H05K2201/09881 ,  H05K2203/0152 ,  H05K2203/0726 ,  Y10T29/49155

摘要： This invention concerns a method for the manufacture of a printed wiring board which particularly proves useful as a printed coil. This method is characterized by the fact that in the work in process which has undergone the step for formation of a conductor circuit and which has not undergone the step for separation of a plating resist, the plating resist and other insulating substratal material are separated for transfer from the surface of the substrate having the conductor circuit formed thereon.Since this method permits formation of an extremely thin insulating layer and a conductor circuit layer thicker than the insulating layer, it enables production of very thin printed wiring board and printed coil having high circuit density in the surfaces of component layers as well as in the direction of superposition of component layers.

摘要翻译： 本发明涉及一种特别证明可用作印刷线圈的印刷线路板的制造方法。 该方法的特征在于，在已经经历了形成导体电路的步骤的工作中，没有经历电镀抗蚀剂分离的步骤，电镀抗蚀剂和其它绝缘底材分离用于转印 从其上形成有导体电路的基板的表面。 由于该方法可以形成非常薄的绝缘层和比绝缘层更厚的导体电路层，所以能够在部件层表面和方向上制造非常薄的印刷线路板和具有高电路密度的印刷线圈 的组件层的叠加。

公开(公告)号：US09234861B2

公开(公告)日：2016-01-12

申请号：US13992514

申请日：2011-12-06

申请人： Hiroshi Kanemoto ,  Haruo Akahoshi ,  So Oguchi ,  Kenta Imai ,  Taku Sakazume ,  Hiroshi Yoshida

发明人： Hiroshi Kanemoto ,  Haruo Akahoshi ,  So Oguchi ,  Kenta Imai ,  Taku Sakazume ,  Hiroshi Yoshida

IPC分类号： G01N27/30 ,  C25B11/04 ,  H01M4/92 ,  G01N27/327 ,  G01N33/49

CPC分类号： G01N27/307 ,  C25B11/0426 ,  C25B11/0431 ,  C25B11/0473 ,  C25B11/0484 ,  C25F3/16 ,  C25F7/00 ,  G01N27/30 ,  G01N27/3271 ,  G01N27/403 ,  G01N33/4915 ,  H01M4/92 ,  H01M4/921 ,  H01M4/923 ,  H01M4/925

摘要： Provided are an electrode, an electrolysis cell, and an electrochemical analyzer that improve the long-term stability of analysis data. A working electrode, a counter electrode, and reference electrode are disposed in an electrolysis cell. The working electrode is obtained by forming a lead wire in a composite material having platinum or a platinum alloy as a base material, in which a metal oxide is dispersed, or in a laminated material obtained by laminating a valve metal and platinum such that the cross sectional crystal texture in the thickness direction of the platinum is formed in layers and the thickness of each layer of the platinum is 5 micrometers or less. The metal oxide is selected from among zirconium oxide, tantalum oxide, and niobium oxide, and the metal oxide content of the platinum or the platinum alloy is 0.005 to 1 wt % in terms of the zirconium, tantalum, or niobium metal.

摘要翻译： 提供了提高分析数据的长期稳定性的电极，电解槽和电化学分析装置。 工作电极，对电极和参比电极设置在电解槽中。 工作电极是通过在具有铂或铂合金作为其中分散有金属氧化物的基材的复合材料中形成引线而获得的，或者通过层压阀金属和铂得到的层压材料，使得交叉 铂的厚度方向上的截面晶体结构形成层，铂层的厚度为5微米以下。 金属氧化物选自氧化锆，氧化钽和氧化铌，铂或铂合金的金属氧化物含量以锆，钽或铌金属换算为0.005〜1重量％。

公开(公告)号：US20140045055A1

公开(公告)日：2014-02-13

申请号：US14113742

申请日：2012-04-25

申请人： Hiroshi Nakano ,  Yoshinori Negishi ,  Haruo Akahoshi ,  Katsunori Nishimura

发明人： Hiroshi Nakano ,  Yoshinori Negishi ,  Haruo Akahoshi ,  Katsunori Nishimura

IPC分类号： H01M10/0569 ,  H01M10/0525

CPC分类号： H01M10/0569 ,  H01M4/38 ,  H01M4/463 ,  H01M4/485 ,  H01M4/505 ,  H01M4/525 ,  H01M10/052 ,  H01M10/0525 ,  H01M10/0568 ,  H01M10/39 ,  H01M2300/0028 ,  Y02T10/7011

摘要： A secondary battery capable of charging and discharging includes a positive electrode, a negative electrode, and an electrolytic solution, wherein the negative electrode permits aluminum to deposit thereon and the positive electrode permits lithium to be released therefrom at the time of discharging. The secondary battery excels conventional ones in output density and safety.

摘要翻译： 能够充放电的二次电池包括正极，负极和电解液，其中负极允许铝沉积在其上，正极允许锂在放电时从其中释放。 二次电池在输出密度和安全性方面优于常规电池。

公开(公告)号：US20130270684A1

公开(公告)日：2013-10-17

申请号：US13994417

申请日：2011-12-13

申请人： Yoshinori Negishi ,  Hiroshi Nakano ,  Eiichi Ide ,  Haruo Akahoshi ,  Motoko Harada ,  Toshiaki Ishii

发明人： Yoshinori Negishi ,  Hiroshi Nakano ,  Eiichi Ide ,  Haruo Akahoshi ,  Motoko Harada ,  Toshiaki Ishii

IPC分类号： H01L23/495

CPC分类号： H01L23/49568 ,  H01L21/4803 ,  H01L21/4807 ,  H01L21/481 ,  H01L21/4871 ,  H01L21/4878 ,  H01L21/4882 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/36 ,  H01L23/373 ,  H01L23/3731 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/49582 ,  H01L24/26 ,  H01L24/27 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention aims at providing a power module and a lead frame for the power module which can enhance adhesion between a heat sink and an insulating resin sheet while maintaining heat radiation properties. The power module includes: the lead frame including a conductor plate formed from Cu or a Cu alloy, and an Al film formed at least on the other side, opposite to one side on which to mount a semiconductor device, of the conductor plate; the semiconductor device mounted on the one side of the conductor plate; a sealing resin which seals at least the semiconductor device and the conductor plate; and an insulating resin sheet adhered to the conductor plate through the Al film therebetween.

摘要翻译： 本发明旨在提供一种功率模块的功率模块和引线框架，其能够在保持散热性能的同时提高散热器和绝缘树脂片材之间的粘附性。 功率模块包括：引线框架，包括由Cu或Cu合金形成的导体板，以及至少形成在导体板的至少另一侧的与安装半导体器件的一侧相反的Al膜; 所述半导体器件安装在所述导体板的一侧上; 至少密封半导体器件和导体板的密封树脂; 以及通过它们之间的Al膜粘附到导体板的绝缘树脂片。

公开(公告)号：US20130248378A1

公开(公告)日：2013-09-26

申请号：US13992514

申请日：2011-12-06

申请人： Hiroshi Kanemoto ,  Haruo Akahoshi ,  So Oguchi ,  Kenta Imai ,  Taku Sakazume ,  Hiroshi Yoshida

发明人： Hiroshi Kanemoto ,  Haruo Akahoshi ,  So Oguchi ,  Kenta Imai ,  Taku Sakazume ,  Hiroshi Yoshida

IPC分类号： G01N27/30

CPC分类号： G01N27/307 ,  C25B11/0426 ,  C25B11/0431 ,  C25B11/0473 ,  C25B11/0484 ,  C25F3/16 ,  C25F7/00 ,  G01N27/30 ,  G01N27/3271 ,  G01N27/403 ,  G01N33/4915 ,  H01M4/92 ,  H01M4/921 ,  H01M4/923 ,  H01M4/925

摘要： Provided are an electrode, an electrolysis cell, and an electrochemical analyzer that improve the long-term stability of analysis data. A working electrode, a counter electrode, and reference electrode are disposed in an electrolysis cell. The working electrode is obtained by forming a lead wire in a composite material having platinum or a platinum alloy as a base material, in which a metal oxide is dispersed, or in a laminated material obtained by laminating a valve metal and platinum such that the cross sectional crystal texture in the thickness direction of the platinum is formed in layers and the thickness of each layer of the platinum is 5 micrometers or less. The metal oxide is selected from among zirconium oxide, tantalum oxide, and niobium oxide, and the metal oxide content of the platinum or the platinum alloy is 0.005 to 1 wt % in terms of the zirconium, tantalum, or niobium metal.

摘要翻译： 提供了提高分析数据的长期稳定性的电极，电解槽和电化学分析装置。 工作电极，对电极和参比电极设置在电解槽中。 工作电极是通过在具有铂或铂合金作为其中分散有金属氧化物的基材的复合材料中形成引线而获得的，或者通过层压阀金属和铂得到的层压材料，使得交叉 铂的厚度方向上的截面晶体结构形成层，铂层的厚度为5微米以下。 金属氧化物选自氧化锆，氧化钽和氧化铌，铂或铂合金的金属氧化物含量以锆，钽或铌金属换算为0.005〜1重量％。

公开(公告)号：US20130168258A1

公开(公告)日：2013-07-04

申请号：US13820701

申请日：2011-09-01

申请人： Hiroshi Nakano ,  Yoshinori Negishi ,  Haruo Akahoshi

发明人： Hiroshi Nakano ,  Yoshinori Negishi ,  Haruo Akahoshi

IPC分类号： C25D3/44

CPC分类号： C25D3/44 ,  C25D3/665

摘要： The purpose of the present invention is to provide an aluminum electroplating solution that allows aluminum electroplating to be conducted efficiently and in a short period of time, can increase the amount of electricity in the current of electroplating, and has high solubility in a nonaqueous solvent. This aluminum electroplating solution is characterized by comprising an aluminum metal salt, an ionic liquid obtained by an organic compound forming an ion pair with the aluminum metal salt, and an organic solvent having a dielectric constant of 8 or less. It is preferable for the volume percentage of the organic solvent in relation to the total volume of the ionic liquid and the organic solvent to be at least 30%, and for at least one of the following to be included as the organic solvent having a dielectric constant of 8 or less: hexane, toluene, diethyl ether, ethylacetate, cyclohexane, xylene, benzene, naphthalene, heptane, cyclopentyl methyl ether, and dioxane.

摘要翻译： 本发明的目的是提供一种铝电镀溶液，其能够有效地进行铝电镀，并且在短时间内可以增加电镀电流的电量，并且在非水溶剂中的溶解度高。 这种铝电镀溶液的特征在于包括铝金属盐，通过与铝金属盐形成离子对的有机化合物获得的离子液体和介电常数为8以下的有机溶剂。 有机溶剂的体积百分比相对于离子液体和有机溶剂的总体积优选为至少30％，并且对于以下中的至少一个作为具有电介质的有机溶剂，优选 常数为8或更少：己烷，甲苯，乙醚，乙酸乙酯，环己烷，二甲苯，苯，萘，庚烷，环戊基甲基醚和二恶烷。