公开(公告)号：US5472563A

公开(公告)日：1995-12-05

申请号：US265050

申请日：1994-06-24

申请人： Kiyonori Kogawa ,  Nobuaki Ooki ,  Masami Kawaguchi ,  Motoyo Wajima ,  Haruo Akahoshi ,  Akira Nagai

发明人： Kiyonori Kogawa ,  Nobuaki Ooki ,  Masami Kawaguchi ,  Motoyo Wajima ,  Haruo Akahoshi ,  Akira Nagai

IPC分类号： H05K3/24 ,  H05K3/38 ,  H05K3/46 ,  B44C1/22

CPC分类号： H05K3/384 ,  H05K3/385 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/072 ,  H05K2203/1157 ,  H05K3/383 ,  H05K3/4611

摘要： The present invention provides a printed circuit board which is high in acid resistance, mechanical strength at high temperature and bond strength, a method for making the printed circuit board and an apparatus used for making the printed circuit board. The technique of the present invention is characterized in that a metallic film having metal particles discretely distributed therein is provided on a roughened surface of copper circuit pattern on an insulating substrate which has been oxidized to form copper oxide and thereafter reduced.

摘要翻译： 本发明提供一种耐酸性高，高温机械强度和粘合强度的印刷电路板，制造印刷电路板的方法和用于制造印刷电路板的装置。 本发明的技术特征在于，在绝缘基板上的铜电路图案的粗糙化表面上设置具有分散在其中的金属粒子的金属膜，所述绝缘基板被氧化形成氧化铜，之后被还原。

公开(公告)号：US5021296A

公开(公告)日：1991-06-04

申请号：US408530

申请日：1989-09-18

申请人： Yoshihiro Suzuki ,  Toshinari Takada ,  Masahiro Suzuki ,  Haruo Akahoshi ,  Akira Nagai ,  Akio Takahashi ,  Shigeo Amagi ,  Toshikazu Narahara ,  Motoyo Wajima ,  Kiyonori Kogawa

发明人： Yoshihiro Suzuki ,  Toshinari Takada ,  Masahiro Suzuki ,  Haruo Akahoshi ,  Akira Nagai ,  Akio Takahashi ,  Shigeo Amagi ,  Toshikazu Narahara ,  Motoyo Wajima ,  Kiyonori Kogawa

IPC分类号： B32B15/01 ,  B32B9/00 ,  B32B15/08 ,  H05K3/38 ,  H05K3/46

CPC分类号： H05K3/384 ,  H05K3/385 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/072 ,  H05K2203/1157 ,  H05K3/4611 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31 ,  Y10T428/31678

摘要： A circuit board, which comprises an insulating substrate, a copper wiring having a coarsely roughened surface provided on the insulating substrate, and a copper oxide-reduced layer provided on the coarsely roughened surface of the copper wiring and formed by reduction of copper oxide and electroless plating, the copper oxide-reduced layer having a finely roughed surface and having a deposited layer of at least one of nickel and cobalt, where the copper oxide-reduced layer having a deposited layer of at least one of nickel and cobalt on the surface is roughened in a range of 0.05 to 5 .mu.m in terms of a maximum vertical distance between the top of convex parts and the bottom of concave parts of the copper oxide-reduced layer per .mu.m of the longitudinal distance of the copper oxide-reduced layer, and at least one of nickel and cobalt is deposited in an amount of 5.times.10.sup.-7 to 1.times.10.sup.-4 g/cm.sup.2 on the copper oxide-reduced layer, has a high adhesiveness to an insulating resin.

摘要翻译： 一种电路板，其包括绝缘基板，设置在绝缘基板上的具有粗糙粗糙面的铜布线和设置在铜布线的粗糙粗糙表面上的氧化铜还原层，其通过还原氧化铜和无电镀形成 所述氧化铜还原层具有细粗糙表面并且具有镍和钴中的至少一种的沉积层，其中在表面上具有至少一种镍和钴的沉积层的氧化铜还原层是 以每50μm的氧化铜还原层的纵向距离的凸部的顶部与氧化铜还原层的凹部的底部的最大垂直距离为0.05〜5μm的范围进行粗糙化 ，并且在氧化铜还原层上以5×10 -7至1×10 -4 g / cm 2的量沉积镍和钴中的至少一种，对绝缘树脂具有高粘附性。

公开(公告)号：US4642161A

公开(公告)日：1987-02-10

申请号：US823003

申请日：1986-01-27

申请人： Haruo Akahoshi ,  Kanji Murakami ,  Motoyo Wajima ,  Kiyonori Kogawa ,  Ritsuji Toba ,  Takeshi Shimazaki

发明人： Haruo Akahoshi ,  Kanji Murakami ,  Motoyo Wajima ,  Kiyonori Kogawa ,  Ritsuji Toba ,  Takeshi Shimazaki

IPC分类号： B32B15/08 ,  B32B15/088 ,  B32B15/092 ,  C08J5/12 ,  C23C18/40 ,  C23C22/05 ,  C23C22/63 ,  C23C22/83 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46 ,  C23F1/02 ,  B31B31/26 ,  B44C1/22

CPC分类号： B32B15/08 ,  C23C18/40 ,  C23C22/63 ,  C23C22/83 ,  H05K3/385 ,  H05K2203/0315 ,  H05K2203/1157 ,  H05K3/4611

摘要： A method of bonding copper and a resin together is disclosed which comprises forming a copper oxide layer on the surface of copper to be bonded to a resin, reducing the copper oxide layer to metallic copper with a reducing solution, and bonding the metallic copper and the resin together. According to this method, a good acid resistance of the bonding interface and a sufficiently high bonding strength can be obtained.

摘要翻译： 公开了一种将铜和树脂接合在一起的方法，其包括在铜的表面上形成氧化铜层以与树脂接合，将还原溶液将氧化铜层还原为金属铜，并将金属铜和 树脂在一起。 根据该方法，可以获得接合界面的良好的耐酸性和足够高的接合强度。

公开(公告)号：US4610910A

公开(公告)日：1986-09-09

申请号：US655426

申请日：1984-09-28

申请人： Mineo Kawamoto ,  Kanji Murakami ,  Haruo Akahoshi ,  Yoichi Matsuda ,  Motoyo Wajima ,  Makoto Matsunaga ,  Shoji Kawakubo ,  Toyofusa Yoshimura ,  Haruo Suzuki ,  Tomio Yoshida

发明人： Mineo Kawamoto ,  Kanji Murakami ,  Haruo Akahoshi ,  Yoichi Matsuda ,  Motoyo Wajima ,  Makoto Matsunaga ,  Shoji Kawakubo ,  Toyofusa Yoshimura ,  Haruo Suzuki ,  Tomio Yoshida

IPC分类号： H05K3/42 ,  C23C18/16 ,  H05K3/18 ,  C23C18/28

CPC分类号： H05K3/184 ,  C23C18/1605 ,  C23C18/285 ,  C23C18/30 ,  C23C18/24 ,  C23C18/405 ,  H05K2203/0713 ,  H05K2203/1407 ,  Y10S428/901 ,  Y10T428/24917

摘要： A printed circuit board comprising an insulating board deposited with a catalyst having reactivity against electroless plating deposition, a resist for electroless plating provided on the insulating board excepting the part where a circuit is to be formed and a circuit formed by electroless plating, wherein the resist for electroless plating contains a coupling agent having a function of preventing the catalyst from ionizing. A process for producing the printed circuit board in which the insulating board surface excepting the part where a circuit is to be formed is covered with a resist for electroless plating containing a coupling agent having a function of preventing the catalyst from ionizing. Use of said resist for electroless plating can prevent drop of insulation resistance of the insulating board after moisture absorption.

摘要翻译： 一种印刷电路板，包括沉积有具有反电化学沉积反应性的催化剂的绝缘板，设置在除了要形成电路的部分之外的绝缘板上的无电电镀抗蚀剂和通过无电镀形成的电路，其中抗蚀剂 化学镀含有具有防止催化剂离子化的功能的偶联剂。 制造印刷电路板的方法，其中除了要形成电路的部分之外的绝缘板表面被含有具有防止催化剂离子化的功能的偶联剂的无电镀的抗蚀剂覆盖。 使用所述抗蚀剂进行化学镀可以防止绝缘板在吸湿后的绝缘电阻下降。

公开(公告)号：US5028513A

公开(公告)日：1991-07-02

申请号：US336771

申请日：1989-04-13

申请人： Kanji Murakami ,  Mineo Kawamoto ,  Akio Tadokoro ,  Haruo Akahoshi ,  Toshikazu Narahara ,  Ritsuji Toba ,  Toshiaki Ishimaru ,  Nobuyuki Hayashi ,  Motoyo Wajima

发明人： Kanji Murakami ,  Mineo Kawamoto ,  Akio Tadokoro ,  Haruo Akahoshi ,  Toshikazu Narahara ,  Ritsuji Toba ,  Toshiaki Ishimaru ,  Nobuyuki Hayashi ,  Motoyo Wajima

IPC分类号： C23C18/40 ,  H05K3/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  H05K3/28 ,  H05K3/38

CPC分类号： H05K3/282 ,  H05K3/108 ,  H05K2201/0355 ,  H05K2203/0591 ,  H05K2203/072 ,  H05K2203/1105 ,  H05K2203/124 ,  H05K3/0076 ,  H05K3/062 ,  H05K3/383

摘要： The present invention provide a process for producing printed circuit boards which comprises the steps of(a) roughening a surface of a copper layer formed on an insulating board.(b) coating the roughened surface of copper layer with a photo-resist layer containing a sublimable copper-corrosion inhibitor, exposing the resist layer selectively to actinic rays according to a circuit pattern to form, and developing the resulting resist layer, thereby forming plating-resist coats on circuit-negative pattern portions of the copper layer,(c) heat-treating the plating-resist coats,(d) plating chemically the circuit-corresponding portion with copper,(e) removing the plating-resist coats, and(f) removing the copper layer except the circuit-corresponding portion thereof.

公开(公告)号：US4632852A

公开(公告)日：1986-12-30

申请号：US746099

申请日：1985-06-18

申请人： Haruo Akahoshi ,  Kanji Murakami ,  Mineo Kawamoto ,  Motoyo Wajima ,  Rituji Toba ,  Shoji Kawakubo ,  Akio Tadokoro

发明人： Haruo Akahoshi ,  Kanji Murakami ,  Mineo Kawamoto ,  Motoyo Wajima ,  Rituji Toba ,  Shoji Kawakubo ,  Akio Tadokoro

IPC分类号： C23C18/40 ,  H05K3/18 ,  C23C3/02

CPC分类号： H05K3/187 ,  C23C18/40

摘要： In a process for electroless copper plating in an electroless copper plating solution containing a copper salt, a complexing agent for the copper salt, a reducing agent for the copper salt, and a pH-adjusting agent, a plating film having distinguished mechanical properties can be obtained by adding at least one of soluble inorganic silicon compounds and soluble inorganic germanium compounds and conducting the electroless copper plating by injecting an oxygen-containing gas into the plating solution or by adding an oxidizing agent to the plating solution or by both injection or the oxygen-containing gas and addition of the oxidizing agent thereto. The stability of the electroless copper plating solution can be maintained better thereby and substantially thick plating is possible.

摘要翻译： 在含有铜盐，铜盐络合剂，铜盐还原剂和pH调节剂的化学镀铜溶液中的无电镀铜方法中，具有显着的机械性能的镀膜可以是 通过添加可溶性无机硅化合物和可溶性无机锗化合物中的至少一种而进行无电镀铜，通过将含氧气体注入镀液中或者通过向镀液中添加氧化剂，或者通过注入或氧气 并且向其中加入氧化剂。 可以更好地保持化学镀铜溶液的稳定性，并且可以实现基本上厚的镀覆。

公开(公告)号：US4604160A

公开(公告)日：1986-08-05

申请号：US689802

申请日：1985-01-08

申请人： Kanji Murakami ,  Haruo Akahoshi ,  Mineo Kawamoto ,  Motoyo Wajima ,  Yoichi Matsuda ,  Kyoji Kawakubo ,  Minoru Kanechiku ,  Toyofusa Yoshimura ,  Makoto Matsunaga

发明人： Kanji Murakami ,  Haruo Akahoshi ,  Mineo Kawamoto ,  Motoyo Wajima ,  Yoichi Matsuda ,  Kyoji Kawakubo ,  Minoru Kanechiku ,  Toyofusa Yoshimura ,  Makoto Matsunaga

IPC分类号： H01F41/04 ,  H05K1/00 ,  H05K1/16 ,  H05K3/20 ,  C23F1/02 ,  B05D5/12 ,  B44C1/22 ,  C25D5/02

CPC分类号： H05K1/165 ,  H01F41/042 ,  H05K3/205 ,  H01L2221/68345 ,  H05K1/0393 ,  H05K2201/09881 ,  H05K2203/0152 ,  H05K2203/0726 ,  Y10T29/49155

摘要： This invention concerns a method for the manufacture of a printed wiring board which particularly proves useful as a printed coil. This method is characterized by the fact that in the work in process which has undergone the step for formation of a conductor circuit and which has not undergone the step for separation of a plating resist, the plating resist and other insulating substratal material are separated for transfer from the surface of the substrate having the conductor circuit formed thereon.Since this method permits formation of an extremely thin insulating layer and a conductor circuit layer thicker than the insulating layer, it enables production of very thin printed wiring board and printed coil having high circuit density in the surfaces of component layers as well as in the direction of superposition of component layers.

摘要翻译： 本发明涉及一种特别证明可用作印刷线圈的印刷线路板的制造方法。 该方法的特征在于，在已经经历了形成导体电路的步骤的工作中，没有经历电镀抗蚀剂分离的步骤，电镀抗蚀剂和其它绝缘底材分离用于转印 从其上形成有导体电路的基板的表面。 由于该方法可以形成非常薄的绝缘层和比绝缘层更厚的导体电路层，所以能够在部件层表面和方向上制造非常薄的印刷线路板和具有高电路密度的印刷线圈 的组件层的叠加。

公开(公告)号：US4587162A

公开(公告)日：1986-05-06

申请号：US754449

申请日：1985-07-12

申请人： Akira Nagai ,  Akio Takahashi ,  Katuo Sugawara ,  Masahiro Ono ,  Ritsuro Tada ,  Motoyo Wajima ,  Toshikazu Narahara

发明人： Akira Nagai ,  Akio Takahashi ,  Katuo Sugawara ,  Masahiro Ono ,  Ritsuro Tada ,  Motoyo Wajima ,  Toshikazu Narahara

IPC分类号： C08L29/00 ,  B29C70/06 ,  B29L9/00 ,  B32B27/04 ,  B32B37/00 ,  C08J5/04 ,  C08J5/24 ,  C08L7/00 ,  C08L15/00 ,  C08L21/00 ,  C08L29/04 ,  C08L29/10 ,  C08L33/00 ,  C08L33/02 ,  C08L39/00 ,  C08L39/04 ,  C08L47/00 ,  H05K1/03 ,  B32B27/00 ,  G03C1/68

CPC分类号： H05K1/0346 ,  C08L15/00 ,  C08L39/04 ,  Y10T442/3528 ,  Y10T442/3667

摘要： A resin composition comprising a prepolymer of homopolymer or copolymer of isocyanuric acid derivative or cyanuric acid derivative, and a cyclized polybutadiene can give a laminate for multi-layer printed circuit boards excellent in heat resistance, dimensional stability and high-frequency electrical properties.

摘要翻译： 包含异氰脲酸衍生物或氰尿酸衍生物的均聚物或共聚物的预聚物和环化聚丁二烯的树脂组合物可以得到耐热性，尺寸稳定性和高频电性能优异的多层印刷电路板的层压体。

公开(公告)号：US4886858A

公开(公告)日：1989-12-12

申请号：US15325

申请日：1987-02-17

申请人： Junichi Katagiri ,  Akira Nagai ,  Keiko Tawara ,  Akio Takahashi ,  Motoyo Wajima ,  Toshikazu Narahara ,  Ryo Hiraga

发明人： Junichi Katagiri ,  Akira Nagai ,  Keiko Tawara ,  Akio Takahashi ,  Motoyo Wajima ,  Toshikazu Narahara ,  Ryo Hiraga

IPC分类号： C08L25/04 ,  C08F8/00 ,  C08F12/22 ,  C08F290/12 ,  C08F299/00 ,  C08G59/34 ,  C08L63/08 ,  H05K1/03

CPC分类号： C08G59/027 ,  C08F290/124 ,  C08F299/00 ,  C08F8/00 ,  C08L63/08 ,  H05K1/034 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31511 ,  Y10T428/31529 ,  Y10T428/31678 ,  Y10T428/31696 ,  Y10T442/674

摘要： A thermosetting resin composition comprising a special poly(p-hydroxystyrene) derivative resin and a radical polymerization initiator, and if necessary an epoxy modified polybutadiene, can provide prepregs and laminates having a low dielectric constant, a shorter signalling delay time, good heat resistance and flame retardancy and thus being suitable for producing multilayer printed circuit boards.

摘要翻译： 包含特殊聚（对 - 羟基苯乙烯）衍生物树脂和自由基聚合引发剂的热固性树脂组合物，并且如果需要，可以提供环氧改性聚丁二烯，可以提供具有低介电常数，较短的信号延迟时间，良好的耐热性和较短的信号延迟时间的预浸料和层压材料 阻燃性，因此适用于生产多层印刷电路板。

公开(公告)号：US4607094A

公开(公告)日：1986-08-19

申请号：US697530

申请日：1985-02-01

申请人： Katuo Sugawara ,  Akio Takahashi ,  Masahiro Ono ,  Ritsuro Tada ,  Motoyo Wajima ,  Toshikazu Narahara ,  Akira Nagai

发明人： Katuo Sugawara ,  Akio Takahashi ,  Masahiro Ono ,  Ritsuro Tada ,  Motoyo Wajima ,  Toshikazu Narahara ,  Akira Nagai

IPC分类号： C08G73/00 ,  C08G73/06 ,  C08L79/04 ,  C08G69/14

CPC分类号： C08G73/0655

摘要： The thermosetting resin composition of the present invention is prepared by mixing an aromatic cyanamide compound with a cyclic ester compound and/or a cyclic amide compound. Although a solventless type composition is preferable, the present invention is not limited thereto. The cured product of the present invention can be prepared by heating and curing said thermosetting resin composition. The obtained cured product of the present invention usually contains melamine rings, isomelamine rings and linear polyester and/or a linear polyamide units.

摘要翻译： 本发明的热固性树脂组合物通过将芳族氨基氰化合物与环状酯化合物和/或环状酰胺化合物混合来制备。 虽然优选无溶剂型组合物，但本发明不限于此。 本发明的固化物可以通过加热固化所述热固性树脂组合物来制备。 得到的本发明的固化物通常含有三聚氰胺环，异质单胺环和线性聚酯和/或线性聚酰胺单元。