Method of applying washcoat to monolithic substrate
    93.
    发明授权
    Method of applying washcoat to monolithic substrate 有权
    将修补基面涂敷于单片基板上的方法

    公开(公告)号:US09144796B1

    公开(公告)日:2015-09-29

    申请号:US12752753

    申请日:2010-04-01

    Abstract: A method of coating substrate monoliths is disclosed. The method comprises locating a containment means on top of the first end face of the monolith; and dosing a predetermined quantity of washcoat composition comprising a liquid phase, at least one polysaccharide rheology modifier and at least one of (i) a suspension of metal oxide particles into the containment means; and (ii) at least one metal salt solute in the liquid phase. The locating step may occur before or after the dosing step. Pressure is applied to the washcoat composition to generate shear stress and to transfer an entirety of washcoat composition into the channels of the monolith by plug flow. Substantially all of the predetermined quantity is retained within the monolith. The part-coated monolith is then rotated so that the second end face is located at the top, and the first three steps are repeated without drying the part-coated monolith.

    Abstract translation: 公开了一种涂覆基底单块的方法。 该方法包括在容器的第一端面的顶部上定位容纳装置; 并给予预定量的包含液相,至少一种多糖流变改性剂和至少一种(i)金属氧化物颗粒的悬浮液到所述容纳装置中的修补基面涂料组合物; 和(ii)液相中的至少一种金属盐溶质。 定位步骤可以在给药步骤之前或之后进行。 将压力施加到修补基面涂层组合物以产生剪切应力,并通过柱塞流将整个修补基面涂层组合物转移到整体的通道中。 基本上所有的预定量都保留在整料中。 然后旋转部分涂覆的整料,使得第二端面位于顶部,并且重复前三个步骤,而不干燥部件涂覆的整料。

    MICROFLUIDIC DEVICE
    96.
    发明申请
    MICROFLUIDIC DEVICE 有权
    微流体装置

    公开(公告)号:US20150190811A1

    公开(公告)日:2015-07-09

    申请号:US14408433

    申请日:2013-03-04

    Abstract: The present invention provides a miniaturized microfluidic device with a heater that has a simple structure without needing adhesion means for improving the heat transfer between the heater block and the device, and which can form the uniform temperature regions. Disclosed is a microfluidic device, including: a substrate; a reaction flow path formed on the substrate; and a temperature adjustment heater for heating the reaction flow path, in which a reaction flow path formation region including the reaction flow path formed therein and a temperature adjustment heater formation region including the temperature adjustment heater formed therein are alternately arranged on the substrate, the reaction flow path is formed to be bent at least one time in the reaction flow path formation region, and the temperature adjustment heater is formed to be bent at least one time in the temperature adjustment heater formation region.

    Abstract translation: 本发明提供了具有加热器的微型微流体装置,其具有简单的结构,而不需要用于改善加热器块和装置之间的热传递的粘合装置,并且可以形成均匀的温度区域。 公开了一种微流体装置,包括:基板; 形成在基板上的反应流路; 以及温度调节加热器,用于加热其中形成有反应流路的反应流路形成区域和其中形成有温度调节加热器的温度调节加热器形成区域的反应流路的反应流路交替排列在基板上,反应 流路形成为在反应流路形成区域中弯曲至少一次,并且在温度调节加热器形成区域中形成至少一次弯曲温度调节加热器。

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