公开(公告)号：US09034165B2

公开(公告)日：2015-05-19

申请号：US13000800

申请日：2009-06-23

申请人： Jia Xu Wang ,  Radoslav R. Adzic

发明人： Jia Xu Wang ,  Radoslav R. Adzic

IPC分类号： C25D5/18 ,  H01M4/92 ,  B01J21/18 ,  B01J23/42 ,  B01J23/44 ,  B01J37/02 ,  B01J37/34 ,  C25D5/34 ,  H01M4/86 ,  H01M4/88 ,  C25D7/00

CPC分类号： C25D21/12 ,  B01J21/18 ,  B01J23/42 ,  B01J23/44 ,  B01J37/0215 ,  B01J37/0228 ,  B01J37/341 ,  C25D3/50 ,  C25D5/18 ,  C25D5/34 ,  C25D7/006 ,  H01M4/8657 ,  H01M4/8853 ,  H01M4/921 ,  H01M4/926 ,  Y02E60/50

摘要： A method of depositing contiguous, conformal submonolayer-to-multilayer thin films with atomic-level control is described. The process involves the use of underpotential deposition of a first element to mediate the growth of a second material by overpotential deposition. Deposition occurs between a potential positive to the bulk deposition potential for the mediating element where a full monolayer of mediating element forms, and a potential which is less than, or only slightly greater than, the bulk deposition potential of the material to be deposited. By cycling the applied voltage between the bulk deposition potential for the mediating element and the material to be deposited, repeated desorption/adsorption of the mediating element during each potential cycle can be used to precisely control film growth on a layer-by-layer basis. This process is especially suitable for the formation of a catalytically active layer on core-shell particles for use in energy conversion devices such as fuel cells.

摘要翻译： 描述了一种沉积具有原子级控制的连续的共形亚单层到多层薄膜的方法。 该方法涉及使用第一元素的欠电位沉积来通过超电势沉积介导第二材料的生长。 在形成完整的单层介质元素的中介元件的堆积沉积电位的潜在正电位和小于或仅稍微大于待沉积材料的堆积电位的电位之间发生沉积。 通过在介质元件的体积沉积电位和待沉积的材料之间循环施加的电压，可以使用在每个电位循环期间重复解吸/吸附中间元件以逐层地精确地控制膜生长。 该方法特别适用于在诸如燃料电池的能量转换装置中用于核 - 壳颗粒上的催化活性层的形成。

公开(公告)号：US20150060291A1

公开(公告)日：2015-03-05

申请号：US14483942

申请日：2014-09-11

申请人： Novellus Systems, Inc.

发明人： Steven T. Mayer ,  David W. Porter ,  Bryan L. Buckalew ,  Robert Rash

IPC分类号： C25D21/12 ,  C25D5/04

CPC分类号： C25D5/00 ,  C25D5/04 ,  C25D5/18 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D17/007 ,  C25D17/008 ,  C25D17/06 ,  C25D17/12 ,  C25D21/10 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76873

摘要： Methods of electroplating metal on a substrate while controlling azimuthal uniformity, include, in one aspect, providing the substrate to the electroplating apparatus configured for rotating the substrate during electroplating, and electroplating the metal on the substrate while rotating the substrate relative to a shield such that a selected portion of the substrate at a selected azimuthal position dwells in a shielded area for a different amount of time than a second portion of the substrate having the same average arc length and the same average radial position and residing at a different angular (azimuthal) position. For example, a semiconductor wafer substrate can be rotated during electroplating slower or faster, when the selected portion of the substrate passes through the shielded area.

摘要翻译： 在一方面，在控制方位均匀性的同时，在基板上电镀金属的方法包括在电镀期间为电镀设备提供基板，该电镀设备被配置为在电镀期间旋转基板，以及在将基板相对于屏蔽件旋转的同时使金属电镀， 在选择的方位角位置的衬底的选定部分在屏蔽区域中停留不同于具有相同平均弧长和相同平均径向位置并且位于不同角度（方位角）处的基底的第二部分的时间量， 位置。 例如，当基板的选定部分通过屏蔽区域时，半导体晶片基板可以在电镀期间更快或更快地旋转。

公开(公告)号：US20150041327A1

公开(公告)日：2015-02-12

申请号：US13960624

申请日：2013-08-06

申请人： Novellus Systems, Inc.

发明人： Bryan L. Buckalew ,  Thomas A. Ponnuswamy ,  Ben Foley ,  Steven T. Mayer

IPC分类号： C25D21/04 ,  C25D3/12 ,  C25D21/12 ,  H01L21/02 ,  C25D7/12

CPC分类号： C25D21/04 ,  C25D3/12 ,  C25D17/001 ,  C25D17/002 ,  C25D21/12 ,  C25D21/14

摘要： Disclosed herein are electroplating systems for electroplating nickel onto a semiconductor substrate having an electroplating cell for holding an electrolyte solution during electroplating which includes a cathode chamber and an anode chamber configured to hold a nickel anode, and having an oxygen removal device arranged to reduce oxygen concentration in the electrolyte solution as it is flowed to the anode chamber during electroplating and during idle times when the system is not electroplating. Also disclosed herein are methods of electroplating nickel onto a substrate in an electroplating cell having anode and cathode chambers, which include reducing the oxygen concentration in an electrolyte solution, flowing the electrolyte solution into the anode chamber and contacting a nickel anode therein, and electroplating nickel from the electrolyte solution onto a substrate in the cathode chamber, wherein the electrolyte solution in the cathode chamber is maintained at a pH of between about 3.5 and 4.5.

摘要翻译： 本文公开了一种电镀系统，用于将镍电镀到具有用于在电镀期间保持电解质溶液的电镀单元的半导体衬底上，所述电镀单元包括阴极室和构造成保持镍阳极的阳极室，并且具有设置成减少氧浓度的除氧装置 在电解液中，当电镀期间和当系统不进行电镀时的空闲时间期间其流向阳极室。 本文还公开了在具有阳极和阴极室的电镀电池中将镍电镀到基底上的方法，其包括降低电解质溶液中的氧浓度，使电解质溶液流入阳极室并使其与镍阳极接触，以及电镀镍 从所述电解质溶液到所述阴极室中的衬底上，其中所述阴极室中的电解质溶液的pH保持在约3.5至4.5之间。

公开(公告)号：US20140374263A1

公开(公告)日：2014-12-25

申请号：US14235834

申请日：2012-08-02

申请人： Wenjun Cai ,  Christopher A. Schuh

发明人： Wenjun Cai ,  Christopher A. Schuh

IPC分类号： C25D21/12 ,  C25D5/10 ,  C25D3/56

CPC分类号： C25D21/12 ,  C25D3/56 ,  C25D3/66 ,  C25D3/665 ,  C25D5/10 ,  C25D5/18 ,  C25D17/10

摘要： Al—Mnx/Al—Mny multilayers with a wide range of structures ranging from microcrystalline to nanocrystalline and amorphous were electrodeposited using a single bath method under galvanostatic control from room temperature ionic liquid. By varying the Mn composition by −1-3 at. % between layers, the grain sizes in one material can be systematically modulated between two values. For example, one specimen alternates between grain sizes of about 21 and 52 nm, in an alloy of average composition of 10.3 at. % Mn. Nanoindentation testing revealed multilayers with finer grains and higher Mn content exhibited better resistance to plastic deformation. Other alloy systems also are expected to be electrodeposited under similar circumstances.

摘要翻译： 在室温离子液体的恒电流控制下，使用单浴法电沉积具有范围广泛的结构范围从微晶到纳米晶和无定形的Al-Mnx / Al-Mny多层。 通过将Mn组成改变为-13 at。 层之间的％，一种材料中的晶粒尺寸可以在两个值之间进行系统调制。 例如，一个样品在平均组成为10.3英寸的合金中在约21和52nm的晶粒尺寸之间交替。 ％Mn。 纳米压痕测试揭示了具有更细晶粒的多层膜，较高的Mn含量表现出更好的抗塑性变形能力。 预期其他合金系统也将在类似的情况下电沉积。

公开(公告)号：US20140367267A1

公开(公告)日：2014-12-18

申请号：US14066092

申请日：2013-10-29

申请人： APPLIED MATERIALS, INC.

发明人： Todd J. Egan ,  Edward W. Budiarto ,  Robert O. Miller ,  Abraham Ravid ,  Bridger E. Hoerner ,  Robert W. Batz, JR. ,  Daniel J. Woodruff

IPC分类号： C25D21/12 ,  C25D7/12

CPC分类号： C25D17/001 ,  C25D7/123 ,  C25D17/12 ,  C25D21/12 ,  G01B7/105 ,  G01N27/20 ,  G01R31/2653 ,  G01R31/2656 ,  H01L22/20

摘要： An electroplating reactor includes an electro-plating solution in a bath, a ring cathode in the bath and located to contact a workpiece such that only the front side of the workpiece is immersed in the solution, plural anodes immersed in the bath below the ring cathode, and plural anode voltage sources coupled to the plural anodes; plural thickness sensors at spatially separate locations on the back side of the workpiece with feedback control to the anode voltage sources.

摘要翻译： 电镀反应器包括镀槽中的电镀溶液，镀槽中的环形阴极，定位成与工件接触，使得仅将工件的前侧浸入溶液中，将多个阳极浸入阴极下方的阴极 以及耦合到所述多个阳极的多个阳极电压源; 多个厚度传感器在工件后侧的空间上分开的位置上，对阳极电压源进行反馈控制。

公开(公告)号：US20140312002A1

公开(公告)日：2014-10-23

申请号：US13865669

申请日：2013-04-18

申请人： International Business Machines Corporation

发明人： Hongbo Peng ,  Stephen M. Rossnagel ,  Ajay K. Royyuru ,  Gustavo A. Stolovitzky ,  Deqiang Wang

IPC分类号： C12Q1/68

CPC分类号： G01N33/48721 ,  C12Q1/6869 ,  C23C18/161 ,  C23C18/1644 ,  C23C18/1675 ,  C23C18/42 ,  C25D3/50 ,  C25D5/02 ,  C25D7/00 ,  C25D7/12 ,  C25D21/12

摘要： A mechanism is provided for forming a nanodevice. A reservoir is filled with a conductive fluid, and a membrane is formed to separate the reservoir in the nanodevice. The membrane includes an electrode layer having a tunneling junction formed therein. The membrane is formed to have a nanopore formed through one or more other layers of the membrane such that the nanopore is aligned with the tunneling junction of the electrode layer. The tunneling junction of the electrode layer is narrowed to a narrowed size by electroplating or electroless deposition. When a voltage is applied to the electrode layer, a tunneling current is generated by a base in the tunneling junction to be measured as a current signature for distinguishing the base. When an organic coating is formed on an inside surface of the tunneling junction, transient bonds are formed between the electrode layer and the base.

公开(公告)号：US20140293554A1

公开(公告)日：2014-10-02

申请号：US13984126

申请日：2012-02-07

申请人： Pavel Shashkov ,  Gennady Khomutov ,  Aleksey Yerokhin ,  Sergey Usov

发明人： Pavel Shashkov ,  Gennady Khomutov ,  Aleksey Yerokhin ,  Sergey Usov

IPC分类号： H05K1/18 ,  C25D5/18 ,  C25D11/02 ,  H05K1/11 ,  H05K1/02

CPC分类号： C25D5/18 ,  C25D11/00 ,  C25D11/005 ,  C25D11/02 ,  C25D11/024 ,  C25D11/026 ,  C25D11/04 ,  C25D11/06 ,  C25D11/26 ,  C25D11/30 ,  C25D11/32 ,  C25D13/02 ,  C25D15/00 ,  C25D21/12 ,  H01L23/142 ,  H01L23/3677 ,  H01L23/3735 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K1/021 ,  H05K1/053 ,  H05K1/115 ,  H05K1/18 ,  H05K2201/0116 ,  H05K2203/0315 ,  H05K2203/1147 ,  Y10T428/1317 ,  Y10T428/24917 ,  Y10T428/249969 ,  H01L2924/00

摘要： An insulated metal substrate (IMS) for supporting a device comprises a metallic substrate having a ceramic coating formed at least in part by oxidation of a portion of the surface of the metallic substrate. The ceramic coating has a dielectric strength of greater than 50 KV mm−1 and a thermal conductivity of greater than 5 Wm−1K−1.

摘要翻译： 用于支撑器件的绝缘金属衬底（IMS）包括具有至少部分地通过金属衬底的表面的一部分的氧化而形成的陶瓷涂层的金属衬底。 陶瓷涂层的介电强度大于50KV-1mm，导热率大于5Wm-1K-1。

公开(公告)号：US20140291158A1

公开(公告)日：2014-10-02

申请号：US14294608

申请日：2014-06-03

申请人： Dürr Systems GmbH

发明人： Alfred Pregenzer ,  Michael Dieterich

IPC分类号： C25D5/18 ,  C25D17/00

CPC分类号： C25D5/18 ,  C25D13/22 ,  C25D17/00 ,  C25D21/12

摘要： In order to provide a coating facility for coating workpieces, which includes a dip tank, into which the workpieces are introducible in order to coat them, a current conversion system for providing a coating current, which is feedable through the dip tank to coat the workpieces, and an electrode, which is configured to be arranged in the dip tank and which is electrically connected to the current conversion system, which coating facility is configured to be flexibly and reliably operated, it is proposed that the current conversion system comprises a current conversion unit, which includes a power switch and an isolating transformer, the power switch being connectable on the input side to a supply current source and being connected on the output side to the isolating transformer and the isolating transformer being connected on the input side to the power switch and on the output side to an electrode.

摘要翻译： 为了提供用于涂覆工件的涂覆设备，其包括浸渍罐，工件可以被引入其中以便涂覆它们，用于提供涂覆电流的电流转换系统，其可通过浸渍槽供给以涂覆工件 以及电极，其被构造成布置在浸渍槽中并且电连接到电流转换系统，该涂层设备被配置为可灵活和可靠地操作，建议电流转换系统包括电流转换 单元，其包括电源开关和隔离变压器，电源开关可在输入侧连接到电源电流源，并在输出侧连接到隔离变压器，隔离变压器在输入侧连接到电源 开关并在输出端连接到电极。

公开(公告)号：US08815062B2

公开(公告)日：2014-08-26

申请号：US12604925

申请日：2009-10-23

申请人： Tomohiro Asou ,  Seiya Kunioka ,  Hitoshi Muramatsu ,  Nobuyuki Suzuki ,  Naoyuki Suda ,  Akira Ishibashi ,  Minoru Imai ,  Manabu Suzuki ,  Masahiro Ogawa

发明人： Tomohiro Asou ,  Seiya Kunioka ,  Hitoshi Muramatsu ,  Nobuyuki Suzuki ,  Naoyuki Suda ,  Akira Ishibashi ,  Minoru Imai ,  Manabu Suzuki ,  Masahiro Ogawa

IPC分类号： C25D17/00 ,  C25D7/04 ,  C25D17/06 ,  C25D7/00 ,  C25F7/00 ,  C25D21/12 ,  C25D5/08 ,  C25D21/02

CPC分类号： C25F7/00 ,  C25D5/08 ,  C25D7/00 ,  C25D7/04 ,  C25D17/00 ,  C25D17/06 ,  C25D21/02 ,  C25D21/12

摘要： A plating pretreatment apparatus for a multi-cylinder block includes a plurality of cylinders that performs a plating pretreatment of a cylinder inner wall surface of each of the cylinders using an electrode disposed so as to oppose to the cylinder inner wall surface by sealing one end of the cylinder inner wall surface and introducing a treatment liquid to the cylinder inner wall surface. In such plating pretreatment apparatus, at least one of a power supply device that supplies electricity to the cylinder block and the electrode and a liquid feed pump that feeds the treatment liquid into a gap between the cylinder inner wall surface and the electrode is provided for each of the cylinders.

摘要翻译： 一种用于多气缸体的电镀预处理装置包括：多个气缸，其使用电极，其设置成与气缸内壁表面相对地进行对各气缸的气缸内壁表面的电镀预处理， 气缸内壁表面，并将处理液体引入气缸内壁表面。 在这种电镀预处理装置中，为每一个提供向气缸体和电极供电的供电装置中的至少一个以及将处理液供给到气缸内壁表面和电极之间的间隙中的液体供给泵 的气瓶。

公开(公告)号：US20140224661A1

公开(公告)日：2014-08-14

申请号：US13987311

申请日：2013-01-07

申请人： Novellus Systems, Inc.

发明人： Tighe A. Spurlin ,  Jian Zhou ,  Edward C. Opocensky ,  Jon Reid ,  Steven T. Mayer

IPC分类号： H01L21/768 ,  H01L21/67

CPC分类号： H01L21/76873 ,  C25D5/18 ,  C25D7/123 ,  C25D17/001 ,  C25D21/12 ,  H01L21/6723

摘要： In some method and apparatus disclosed herein, the profile of current delivered to the substrate provides a relatively uniform current density on the substrate surface during immersion. These methods include controlling the current density applied across a substrate's surface during immersion by dynamically controlling the current to account for the changing substrate surface area in contact with electrolyte during immersion. In some cases, current density pulses and/or steps are used during immersion, as well.

摘要翻译： 在本文公开的一些方法和装置中，输送到衬底的电流轮廓在浸入期间在衬底表面上提供相对均匀的电流密度。 这些方法包括通过动态地控制电流来控制在浸入过程中施加在衬底表面上的电流密度，以解决在浸入期间与电解质接触的衬底表面面积的变化。 在某些情况下，也可以在浸入过程中使用电流密度脉冲和/或步骤。