公开(公告)号：US20140162870A1

公开(公告)日：2014-06-12

申请号：US14118891

申请日：2012-06-04

Applicant: Joseph Wang ,  Wei Gao ,  Sirilak Sattayasamitsathit

Inventor： Joseph Wang ,  Wei Gao ,  Sirilak Sattayasamitsathit

IPC: C25D1/02

CPC classification number: C25D1/02 ,  A61K9/70 ,  A61K47/02 ,  A61K47/34 ,  B01J20/22 ,  B01J23/42 ,  B01J23/8906 ,  B01J23/8913 ,  B01J23/892 ,  B01J31/06 ,  B01J35/0006 ,  B01J35/0033 ,  B01J35/02 ,  B01J37/0215 ,  B01J37/0244 ,  B01J2231/005 ,  B01J2531/005 ,  B82Y15/00 ,  B82Y30/00 ,  C25D1/006 ,  C25D1/20 ,  C25D3/12 ,  F03H99/00 ,  G01N33/48707

Abstract: Methods, structures, devices and systems are disclosed for fabrication of microtube engines using membrane template electrodeposition. Such nanomotors operate based on bubble-induced propulsion in biological fluids and salt-rich environments. In one aspect, fabricating microengines includes depositing a polymer layer on a membrane template, depositing a conductive metal layer on the polymer layer, and dissolving the membrane template to release the multilayer microtubes.

Abstract translation: 公开了使用膜模板电沉积制造微管引擎的方法，结构，装置和系统。 这种纳米电动机基于生物流体和富含盐的环境中的气泡诱导推进而运行。 一方面，制造微引线包括在膜模板上沉积聚合物层，在聚合物层上沉积导电金属层，以及溶解膜模板以释放多层微管。

公开(公告)号：US08696877B2

公开(公告)日：2014-04-15

申请号：US13151520

申请日：2011-06-02

Applicant: Nedeljko Krstajic ,  Vladimir Jovic ,  Antonio Lorenzo Antozzi

Inventor： Nedeljko Krstajic ,  Vladimir Jovic ,  Antonio Lorenzo Antozzi

IPC: C25B11/06 ,  C25B11/04 ,  C25D3/12 ,  C25B9/16

CPC classification number: C25B11/0478 ,  C25D3/12 ,  C25D15/02 ,  Y02E60/366

Abstract: The invention relates to a cathode for hydrogen evolution in electrolysis cells, for instance chlor-alkali cells or cells for producing chlorate or hypochlorite, obtained starting from a substrate of nickel or other conductive material galvanically coated with nickel co-deposited with an amorphous molybdenum oxide.

Abstract translation: 本发明涉及一种用于在电解槽中析氢的阴极，例如用于生产氯酸盐或次氯酸盐的氯碱电池或细胞，其从镍或其它用非晶态氧化钼共沉积的镍电镀的其它导电材料 。

公开(公告)号：US08691397B2

公开(公告)日：2014-04-08

申请号：US13665052

申请日：2012-10-31

Applicant: Integran Technologies, Inc.

Inventor： Diana Facchini ,  Francisco Gonzalez ,  Jonathan McCrea ,  Mike Uetz ,  Gino Palumbo ,  Klaus Tomantschger

IPC: B32B15/04 ,  C22C19/07

CPC classification number: C25D3/562 ,  C25D3/12 ,  C25D3/26 ,  C25D5/18 ,  C25D5/50 ,  C25D15/00 ,  Y10T428/12049 ,  Y10T428/12493 ,  Y10T428/12861 ,  Y10T428/12937 ,  Y10T428/12993 ,  Y10T428/13 ,  Y10T428/24942 ,  Y10T428/24967 ,  Y10T428/26 ,  Y10T428/263 ,  Y10T428/264 ,  Y10T428/265

Abstract: Free standing articles or articles at least partially coated with substantially porosity free, fine-grained and/or amorphous Co-bearing metallic materials optionally containing solid particulates dispersed therein, are disclosed. The electrodeposited metallic layers and/or patches comprising Co provide, enhance or restore strength, wear and/or lubricity of substrates without reducing the fatigue performance. The fine-grained and/or amorphous metallic coatings comprising Co are particularly suited for articles exposed to thermal cycling, fatigue and other stresses and/or in applications requiring anti-microbial properties.

Abstract translation: 公开了至少部分地涂覆有基本上无孔隙的细颗粒和/或无定形的含Co金属材料的任选地含有分散在其中的固体颗粒的独立制品或制品。 包含Co的电沉积金属层和/或贴剂提供，增强或恢复基底的强度，磨损和/或润滑性，而不降低疲劳性能。 包含Co的细粒和/或无定形金属涂层特别适用于暴露于热循环，疲劳和其它应力和/或需要抗微生物性能的应用中的制品。

公开(公告)号：US08673445B2

公开(公告)日：2014-03-18

申请号：US12460394

申请日：2009-07-17

Applicant: Tomoyuki Sato

Inventor： Tomoyuki Sato

IPC: B32B9/00

CPC classification number: C25D15/02 ,  C25D3/12

Abstract: A composite-plated article has a metallic material and a plating film coated on the metallic material in a nickel-plating bath containing carbon nanocomposite fibers. Each of the carbon nanocomposite fibers is formed of a carbon nanofiber core and microparticles that react with carbon to form a compound bonded to a surface of the carbon nanofiber core.

Abstract translation: 复合电镀制品在含有碳纳米复合纤维的镀镍浴中具有金属材料和涂覆在金属材料上的镀膜。 每个碳纳米复合纤维由碳纳米纤维芯和与碳反应形成与碳纳米纤维芯的表面结合的化合物的微粒形成。

公开(公告)号：US08629189B1

公开(公告)日：2014-01-14

申请号：US13722613

申请日：2012-12-20

Applicant: Chester Wilson ,  John McDonald ,  Joshua Brown

Inventor： Chester Wilson ,  John McDonald ,  Joshua Brown

IPC: C07C27/00

CPC classification number: C01C1/0411 ,  B01J12/007 ,  B01J19/006 ,  B01J19/24 ,  B01J19/249 ,  B01J23/462 ,  B01J23/745 ,  B01J23/75 ,  B01J35/006 ,  B01J37/341 ,  B01J37/348 ,  B01J2219/00063 ,  B01J2219/0009 ,  B01J2219/00162 ,  B01J2219/00777 ,  B01J2219/2479 ,  B01J2219/248 ,  C07C1/0455 ,  C10G2/33 ,  C10G2/332 ,  C25D3/12 ,  C25D5/006 ,  C25D5/18 ,  C25D11/045 ,  C25D11/08 ,  C25D11/12 ,  C25D11/20 ,  H01M10/052 ,  H01M12/08 ,  Y02E60/128

Abstract: A Fischer-Tropsch process including the steps of providing a reactor having a substrate element with a surface and a plurality of elongated micro-structures of catalyst material attached to the substrate surface The catalyst material includes at least one of cobalt, iron, or ruthenium and the micro-structures have a width of less than about 1 um and a length at least five times the width. A carbon compound and hydrogen are injected into the reactor such that at least a portion of the carbon compound and hydrogen contact the catalyst material. The carbon compound and hydrogen are reacted with the catalyst at a temperature between about 150° F. and about 400° F.

Abstract translation: 一种费 - 托方法，包括提供具有基底元件的反应器的步骤，所述反应器具有附着到基底表面的表面和多个细长的催化剂材料微结构。催化剂材料包括钴，铁或钌中的至少一种，以及 微结构具有小于约1μm的宽度和至少五倍宽度的长度。 将碳化合物和氢气注入反应器，使得至少一部分碳化合物和氢气与催化剂材料接触。 碳化合物和氢气在约150°F至约400°F的温度下与催化剂反应。

公开(公告)号：US20130333436A1

公开(公告)日：2013-12-19

申请号：US13991055

申请日：2011-11-30

Applicant: Seiji Nakajima ,  Tatsuya Miyoshi ,  Hiroki Nakamaru

Inventor： Seiji Nakajima ,  Tatsuya Miyoshi ,  Hiroki Nakamaru

IPC: B21D22/02

CPC classification number: B21D22/022 ,  B32B15/013 ,  B32B15/015 ,  C21D1/673 ,  C21D9/46 ,  C22C18/00 ,  C22C38/001 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/12 ,  C22C38/14 ,  C23C2/06 ,  C23C2/28 ,  C25D3/12 ,  C25D3/565 ,  C25D5/12 ,  C25D5/14 ,  C25D5/50 ,  C25D7/0614 ,  G01N19/02

Abstract: The invention provides methods for manufacturing warm press-formed members which can ensure post-coating corrosion resistance. A method for manufacturing warm press-formed members includes heating a steel sheet to a temperature in the range from 200 to 800° C. and warm press-forming the steel sheet at a temperature in the above range of temperatures, the steel sheet having a Zn—Ni alloy coating layer on its surface, the coating layer including 10 to 25 mass % Ni and the balance being Zn and inevitable impurities and having a coating weight of 10 to 90 g/m2.

Abstract translation: 本发明提供了制造能够确保涂层后耐腐蚀性的热压成型件的方法。 一种制造暖压成形构件的方法包括将钢板加热到200-800℃的温度，并在上述温度范围内的温度下对钢板进行热压成形，该钢板具有 Zn-Ni合金涂层表面，涂层含有10〜25质量％的Ni，余量为Zn和不可避免的杂质，涂层重量为10〜90g / m2。

公开(公告)号：US20130299353A1

公开(公告)日：2013-11-14

申请号：US13470300

申请日：2012-05-12

Applicant: SHAO-KANG HU ,  FENG-JU LAI ,  HWAI-SHAN CHEN

Inventor： SHAO-KANG HU ,  FENG-JU LAI ,  HWAI-SHAN CHEN

IPC: B32B15/04 ,  C25D5/48 ,  C25D5/44

CPC classification number: B32B15/04 ,  C25D3/12 ,  C25D5/02 ,  C25D11/08 ,  C25D11/16 ,  C25D11/20 ,  C25D11/24 ,  C25D11/246

Abstract: A method of forming an interference film on an aluminum alloy substrate includes the following steps: providing an aluminum alloy substrate; cleaning the aluminum alloy substrate through a pre-treatment process; performing an anodic treatment on the aluminum alloy substrate for a predetermined amount of time till an oxidized film having a plurality of cellular tubes is formed on the surface thereof; expanding the holes of the oxidized membrane of the aluminum alloy substrate with an acidic solution to enlarge the diameter of the cellular tubes; enlarging the bottom of the cellular tubes to form a deposition area through an electrical enlarging process; depositing a metal material on the deposition area of the cellular tubes to form an interference structure; sealing the cellular tubes with a sealing agent; and removing dirt. Furthermore, an interference film structure is formed on the aluminum alloy substrate using the aforementioned method.

Abstract translation: 在铝合金基板上形成干涉膜的方法包括以下步骤：提供铝合金基板; 通过预处理过程清洁铝合金基板; 对铝合金基板进行阳极处理预定的时间，直到在其表面上形成具有多个多孔管的氧化膜; 用酸性溶液膨胀铝合金基板的氧化膜的孔，以扩大多孔管的直径; 扩大细胞管的底部，通过电扩大过程形成沉积区; 在所述细胞管的沉积区域上沉积金属材料以形成干涉结构; 用密封剂密封细胞管; 并清除污垢。 此外，使用上述方法在铝合金基板上形成干涉膜结构。

公开(公告)号：US20130237105A1

公开(公告)日：2013-09-12

申请号：US13785549

申请日：2013-03-05

Applicant: KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL, LTD.)

Inventor： Masahiro Tsuru ,  Ryoichi Ozaki ,  Koichi Taira

IPC: H01R13/03

CPC classification number: H01R13/03 ,  B32B15/01 ,  C22C9/02 ,  C22C9/06 ,  C22F1/08 ,  C25D3/12 ,  C25D3/30 ,  C25D3/38 ,  C25D5/12 ,  C25D5/505 ,  C25D7/00 ,  Y10T428/12715

Abstract: A copper alloy sheet with a Sn coating layer comprises a base material made of Cu—Ni—Si system copper alloy. Formed on the base material is a Ni coating layer having an average thickness of 0.1 to 0.8 μm. Formed on the Ni coating layer is a Cu—Sn alloy coating layer having an average thickness of 0.4 to 1.0 μm. Formed on the Cu—Sn alloy coating layer is an Sn coating layer having average thickness of 0.1 to 0.8 μm. A material surface is subject to reflow treatment and has arithmetic mean roughness Ra of 0.03 μm or more and less than 0.15 μm in both a direction parallel to the rolling direction and a direction perpendicular to the rolling direction. An exposure rate of the Cu—Sn alloy coating layer to the material surface is 10 to 50%. A fitting type connection terminal requiring low insertion force can be obtained at a low cost.

Abstract translation: 具有Sn涂层的铜合金板包括由Cu-Ni-Si系铜合金制成的基材。 在基材上形成平均厚度为0.1〜0.8μm的Ni被覆层。 在Ni涂层上形成平均厚度为0.4〜1.0μm的Cu-Sn合金被覆层。 在Cu-Sn合金涂层上形成平均厚度为0.1〜0.8μm的Sn被覆层。 材料表面进行回流处理，并且在平行于轧制方向的方向和垂直于轧制方向的方向上的算术平均粗糙度Ra为0.03μm以上且小于0.15μm。 Cu-Sn合金被覆层与材料表面的接触率为10〜50％。 可以以低成本获得需要低插入力的装配型连接端子。

公开(公告)号：US08524068B2

公开(公告)日：2013-09-03

申请号：US13221726

申请日：2011-08-30

Applicant: Jose A. Medina ,  Tiffany Yun Wen Jiang ,  Ming Jiang

Inventor： Jose A. Medina ,  Tiffany Yun Wen Jiang ,  Ming Jiang

IPC: C25F3/00 ,  C25F3/02

CPC classification number: C25D5/36 ,  C25D3/12 ,  C25D3/20 ,  C25D5/40 ,  C25F1/02 ,  C25F3/02

Abstract: Embodiments of the present invention include systems and methods for low-rate electrochemical (wet) etch that use a net cathodic current or potential. In particular, some embodiments achieve controlled etch rates of less than 0.1 nm/s by applying a small net cathodic current to a substrate as the substrate is submerged in an aqueous electrolyte. Depending on the embodiment, the aqueous electrolyte utilized may comprise the same type of cations as the material being etched from the substrate. Some embodiments are useful in etching thin film metals and alloys and fabrication of magnetic head transducer wafers.

Abstract translation: 本发明的实施例包括使用净阴极电流或电位的低速电化学（湿）蚀刻的系统和方法。 特别地，一些实施例通过在衬底被浸没在含水电解质中时将小的净阴极电流施加到衬底上来实现小于0.1nm / s的受控蚀刻速率。 根据实施例，所使用的水性电解质可以包括与从衬底上蚀刻的材料相同类型的阳离子。 一些实施例在蚀刻薄膜金属和合金以及制造磁头换能器晶片方面是有用的。

公开(公告)号：US20130216855A1

公开(公告)日：2013-08-22

申请号：US13823349

申请日：2012-08-30

Applicant: Tomota Nagaura ,  Kazuhiko Sakaguchi

Inventor： Tomota Nagaura ,  Kazuhiko Sakaguchi

IPC: H05K1/09

CPC classification number: H05K1/09 ,  B32B15/01 ,  C23C18/165 ,  C23C18/31 ,  C23C28/023 ,  C25D1/04 ,  C25D3/04 ,  C25D3/12 ,  C25D3/14 ,  C25D3/16 ,  C25D3/38 ,  C25D3/562 ,  C25D3/565 ,  C25D3/58 ,  C25D5/14 ,  C25D7/0614 ,  C25D9/08 ,  C25D11/38 ,  H05K3/025 ,  H05K2201/0317 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2203/0307 ,  Y10T428/12438 ,  Y10T428/12493 ,  Y10T428/12514 ,  Y10T428/12611 ,  Y10T428/12667 ,  Y10T428/12861 ,  Y10T428/12882 ,  Y10T428/1291 ,  Y10T428/12931 ,  Y10T428/12944 ,  Y10T428/12958 ,  Y10T428/24917

Abstract: The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 μg/dm2 of Ni and said Cr layer containing 10-100 μg/dm2 of Cr is provided.

Abstract translation: 本发明提供一种载体附着铜箔，其中在层压到绝缘基板之前，超薄铜箔不从载体剥离，而是可以在与绝缘基板层合之后从载体上剥离。 一种载体附着铜箔，包括铜箔载体，层压在所述铜箔载体上的中间层和层压在所述中间层上的超薄铜层，其中所述中间箔配置有与所述中间层的界面接触的Ni层 铜箔载体和与超薄铜层的界面接触的Cr层，所述Ni层含有1,000-40,000mug / dm 2的Ni，所述Cr层含有10-100mug / dm 2的Cr。