公开(公告)号：US20090035957A1

公开(公告)日：2009-02-05

申请号：US12112805

申请日：2008-04-30

Applicant: Mark Garrison

Inventor： Mark Garrison

IPC: H05K3/36 ,  H01K3/10 ,  H01R12/00

CPC classification number: H05K3/4092 ,  H01L23/49861 ,  H01L24/97 ,  H01L2924/14 ,  H05K1/141 ,  H05K3/0052 ,  H05K3/42 ,  H05K3/4638 ,  H05K2201/09754 ,  H05K2201/1059 ,  H05K2201/10924 ,  H05K2203/063 ,  H05K2203/166 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A sub-component circuit board may be electrically and mechanically connected to a higher order circuit board using one or more leads extending from a lead frame embedded in the sub-component circuit board. The sub-component board is produced as a layered assembly with the embedded lead frame at the core. One or more dielectric layers and one or more circuitry layers are provided over the lead frame and then bonded using heat and pressure. Apertures in the dielectric and circuitry layers define a perimeter of the circuit board where the leads of the lead frame are exposed. The lead frame connects to the circuitry layer(s) using plated vias.

Abstract translation: 子部件电路板可以使用从嵌入在子部件电路板中的引线框架延伸的一个或多个引线电连接和机械地连接到高阶电路板。 子部件板作为分层组件制造，嵌入式引线框架在核心处。 一个或多个电介质层和一个或多个电路层设置在引线框架之上，然后使用热和压力进行接合。 电介质和电路层中的孔限定了电路板的周边，引线框架的引线被暴露。 引线框架使用电镀通孔连接到电路层。

公开(公告)号：US20070161269A1

公开(公告)日：2007-07-12

申请号：US11715392

申请日：2007-03-08

Applicant: Keiichi Sugimoto ,  Mitsuru Nakagawa

Inventor： Keiichi Sugimoto ,  Mitsuru Nakagawa

IPC: H05K1/00

CPC classification number: B29C45/14065 ,  B29C45/14639 ,  H05K3/284 ,  H05K3/3405 ,  H05K5/0034 ,  H05K5/065 ,  H05K2201/09754 ,  H05K2201/1034 ,  H05K2203/1316

Abstract: A casing of an electronic key transmitting and receiving apparatus is formed to seal entire bodies of circuit parts, a mounting face of a printed board, on which the circuit parts are mounted, and parts of terminals while the other parts of the terminals are exposed. A rear face of the printed board opposite from the mounting face provides a part of an outer surface of the casing. When the printed board is provided in the casing through an insert molding process, the printed board is held in a cavity of a molding die such that the rear face of the printed board closely contacts an inner face of the cavity. Accordingly, deformation of the printed board due to pressure caused when the resin is poured or when the resin hardens is inhibited.

Abstract translation: 电子钥匙收发装置的壳体形成为密封电路部件的整体，安装有电路部件的印刷电路板的安装面以及端子的其他部分露出的部分端子。 印刷电路板的与安装面相对的后表面提供了外壳的外表面的一部分。 当通过插入成型工艺将印刷板设置在壳体中时，印刷板被保持在成型模具的空腔中，使得印刷板的后表面紧密接触空腔的内表面。 因此，由于在树脂浇注时或当树脂硬化时引起的压力导致印刷基板的变形被抑制。

公开(公告)号：US07180171B1

公开(公告)日：2007-02-20

申请号：US10754807

申请日：2004-01-08

Applicant: Garnik Taheri

Inventor： Garnik Taheri

IPC: H01L23/12

CPC classification number: H01L23/49861 ,  H01L23/49822 ,  H01L25/16 ,  H01L2224/16 ,  H01L2924/15311 ,  H05K1/141 ,  H05K3/3421 ,  H05K3/4092 ,  H05K3/4641 ,  H05K2201/09754 ,  H05K2203/1572

Abstract: A multilayer printed circuit board (PCB) interface includes a top PCB layer, a middle PCB layer, and a bottom PCB layer. A top surface of the top PCB layer receives at least one top module. The middle PCB layer includes an electrically conductive layer disposed between two dielectric layers. The electrically conductive layer forms a plurality of connectors protruding horizontally from the sides of the multilayer PCB to couple the PCB interface to a main board. A bottom surface of the bottom PCB layer receives at least one bottom module.

Abstract translation: 多层印刷电路板（PCB）接口包括顶层PCB层，中间PCB层和底层PCB层。 顶层PCB层的顶表面接收至少一个顶部模块。 中间PCB层包括设置在两个电介质层之间的导电层。 导电层形成从多层PCB的侧面水平突出的多个连接器，以将PCB接口连接到主板。 底部PCB层的底表面接收至少一个底部模块。

公开(公告)号：US20050236178A1

公开(公告)日：2005-10-27

申请号：US10833711

申请日：2004-04-27

Applicant: Philip Lauriello

Inventor： Philip Lauriello

IPC: H05K1/03 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  H05K3/46 ,  H05K7/06

CPC classification number: H05K3/4092 ,  H05K3/328 ,  H05K3/4611 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2201/09145 ,  H05K2201/0919 ,  H05K2201/09754 ,  H05K2201/1034 ,  Y10T29/49126

Abstract: A signal processing module can be manufactured from a plurality of composite substrate layers, each substrate layer includes elements of multiple individual processing modules. Surfaces of the layers are selectively metalicized to form signal processing elements when the substrate layers are fusion bonded in a stacked arrangement. Prior to bonding, the substrate layers are milled to form gaps located at regions between the processing modules. Prior to bonding, the leads are positioned such that they extend from signal coupling points on said metalicized surfaces into the gap regions. The substrate layers are then fusion bonded to each other such that the plurality of substrate layers form signal processing modules with leads that extend from an interior of the modules into the gap areas. The individual modules may then be separated by milling the substrate layers to de-panel the modules.

Abstract translation: 信号处理模块可以由多个复合衬底层制造，每个衬底层包括多个单独的处理模块的元件。 当衬底层以堆叠布置融合时，这些层的表面被选择性地金属化以形成信号处理元件。 在接合之前，将衬底层研磨以形成位于处理模块之间的区域的间隙。 在接合之前，引线定位成使得它们从所述金属化表面上的信号耦合点延伸到间隙区域中。 然后将衬底层彼此熔合，使得多个衬底层形成具有从模块内部延伸到间隙区域中的引线的信号处理模块。 然后可以通过研磨衬底层来分离各个模块以使模块脱模。

公开(公告)号：US06285551B1

公开(公告)日：2001-09-04

申请号：US09692241

申请日：2000-10-20

Applicant: Scott David Brandenburg ,  Mark Anthony Koors ,  Jeffery Ralph Daanen

Inventor： Scott David Brandenburg ,  Mark Anthony Koors ,  Jeffery Ralph Daanen

IPC: H05K720

CPC classification number: H05K5/0034 ,  H05K3/0061 ,  H05K3/284 ,  H05K7/20854 ,  H05K2201/09754 ,  H05K2203/1327

Abstract: An overmolded electronic assembly (10) and method for forming the assembly (1) that entails enclosing a circuit board (12) having one or more circuit devices (16) mounted to its surface. The assembly (10) includes a heat-conductive member (18) in thermal contact with one or more of the circuit devices (16) mounted to the circuit board (12). An overmolded body (22) encloses the circuit board (12) and the circuit devices (16) with the heat-conductive member (18), such that the overmolded body (22) and heat-conductive member (18) form a moisture-impermeable seal around the circuit board (12) and circuit devices (16). The overmolded body (22) also includes a connector housing (28) integrally-formed in its outer surface. The method for manufacturing the overmolded electronic assembly (10) generally entails supporting the circuit board (12) with the heat-conductive member (18) such that the heat-conductive member (18) thermally contacts the circuit devices (16). An overmolded enclosure is then formed by molding a material over the surface of the circuit board (12) to form the overmolded body (22) that, with the heat-conductive member (18), encases the circuit board (12) and its circuit devices (16).

Abstract translation: 包覆成型的电子组件（10）和形成组件（1）的方法，该组件（1）包含封装具有安装在其表面上的一个或多个电路装置（16）的电路板（12）。 组件（10）包括与安装到电路板（12）上的一个或多个电路装置（16）热接触的导热构件（18）。 包覆成型体（22）将电路板（12）和电路装置（16）与导热构件（18）封闭，使得包覆成型体（22）和导热构件（18）形成水分 - 电路板（12）和电路装置（16）周围的不透气密封。 包覆成型体（22）还包括在其外表面上整体形成的连接器壳体（28）。 制造包覆成型的电子组件（10）的方法通常需要用导热构件（18）支撑电路板（12），使得导热构件（18）热接触电路装置（16）。 然后通过在电路板（12）的表面上模制材料形成包覆成型外壳，以形成包覆模制体（22），其与导热构件（18）一起封装电路板（12）及其电路 设备（16）。

公开(公告)号：US06180045B2

公开(公告)日：2001-01-30

申请号：US09081498

申请日：1998-05-20

Applicant: Scott David Brandenburg ,  Mark Anthony Koors ,  Jeffery Ralph Daanen

Inventor： Scott David Brandenburg ,  Mark Anthony Koors ,  Jeffery Ralph Daanen

IPC: B29C4514

CPC classification number: H05K5/0034 ,  H05K3/0061 ,  H05K3/284 ,  H05K7/20854 ,  H05K2201/09754 ,  H05K2203/1327

Abstract: An overmolded electronic assembly (10) and method for forming the assembly (1) that entails enclosing a circuit board (12) having one or more circuit devices (16) mounted to its surface. The assembly (10) includes a heat-conductive member (18) in thermal contact with one or more of the circuit devices (16) mounted to the circuit board (12). An overmolded body (22) encloses the circuit board (12) and the circuit devices (16) with the heat-conductive member (18), such that the overmolded body (22) and heat-conductive member (18) form a moisture-impermeable seal around the circuit board (12) and circuit devices (16). The overmolded body (22) also includes a connector housing (28) integrally-formed in its outer surface. The method for manufacturing the overmolded electronic assembly (10) generally entails supporting the circuit board (12) with the heat-conductive member (18) such that the heat-conductive member (18) thermally contacts the circuit devices (16). An overmolded enclosure is then formed by molding a material over the surface of the circuit board (12) to form the overmolded body (22) that, with the heat-conductive member (18), encases the circuit board (12) and its circuit devices (16).

Abstract translation: 包覆成型的电子组件（10）和形成组件（1）的方法，该组件（1）包含封装具有安装在其表面上的一个或多个电路装置（16）的电路板（12）。 组件（10）包括与安装到电路板（12）上的一个或多个电路装置（16）热接触的导热构件（18）。 包覆成型体（22）将电路板（12）和电路装置（16）与导热构件（18）封闭，使得包覆成型体（22）和导热构件（18）形成水分 - 电路板（12）和电路装置（16）周围的不透水密封。 包覆成型体（22）还包括在其外表面上整体形成的连接器壳体（28）。 制造包覆成型的电子组件（10）的方法通常需要用导热构件（18）支撑电路板（12），使得导热构件（18）热接触电路装置（16）。 然后通过在电路板（12）的表面上模制材料形成包覆成型外壳，以形成包覆模制体（22），其与导热构件（18）一起封装电路板（12）及其电路 设备（16）。

公开(公告)号：US5483100A

公开(公告)日：1996-01-09

申请号：US893518

申请日：1992-06-02

Applicant: Robert C. Marrs ,  Tadashi Hirakawa

Inventor： Robert C. Marrs ,  Tadashi Hirakawa

IPC: H01L23/538 ,  B23K26/06 ,  B23K26/38 ,  H01L21/48 ,  H01L23/498 ,  H05K3/00 ,  H05K3/40 ,  H01L23/053 ,  H01L23/12 ,  H01L23/495

CPC classification number: H05K3/0035 ,  B23K26/066 ,  B23K26/382 ,  B23K26/40 ,  B23K26/402 ,  H01L21/486 ,  H01L23/49827 ,  B23K2203/08 ,  B23K2203/12 ,  B23K2203/16 ,  B23K2203/172 ,  B23K2203/18 ,  B23K2203/30 ,  B23K2203/42 ,  B23K2203/50 ,  B23K2203/52 ,  H01L2224/05553 ,  H01L2224/48137 ,  H01L2224/48464 ,  H01L2224/49175 ,  H01L2924/09701 ,  H01L2924/30107 ,  H05K2201/09754 ,  H05K2201/10924 ,  H05K2203/056 ,  H05K2203/107 ,  H05K3/4092

Abstract: An integrated circuit package, and a method for forming the integrated circuit package, including a single layer or multilayer substrate in which interconnection vias are formed is described. Laser energy is swept across a surface of a mask in which holes have been formed. Laser energy passing through the holes of the mask forms vias in a substrate held in place below the mask. The laser energy is swept at such a speed and is maintained at such an energy level that the laser energy forms vias in the substrate, but does not penetrate a set of leads attached to the substrate. Vias may be formed in this way by either a mask imaging, contact mask or conformal mask technique. The laser energy is emitted from a non-thermal (e.g., excimer) laser. The substrate is formed of an organic (e.g., epoxy) resin. The resin may include reinforcing fibers (e.g., aramid fibers). Substrates may be formed on one or both sides of the set of leads. After formation in the substrate, the vias are coated with an electrically conductive material. The method of via formation is fast, inexpensive, achieves higher via density, and avoids overheating of the substrate.

Abstract translation: 描述了一种集成电路封装以及用于形成集成电路封装的方法，该集成电路封装包括其中形成有互连通孔的单层或多层基板。 激光能量扫过已经形成孔的掩模的表面。 通过掩模的孔的激光能量在保持在掩模下方的基底中形成通孔。 激光能量以这样的速度扫过并保持在激光能量在衬底中形成通孔但不穿透附着于衬底的一组引线的能级。 可以通过掩模成像，接触掩模或保形掩模技术以这种方式形成通孔。 激光能量从非热（例如准分子激光）发射。 基底由有机（例如环氧）树脂形成。 树脂可以包括增强纤维（例如芳族聚酰胺纤维）。 基板可以形成在该组引线的一侧或两侧上。 在衬底中形成之后，通孔用导电材料涂覆。 通孔形成方法快速，便宜，实现更高的通孔密度，并避免基板过热。

公开(公告)号：US5408052A

公开(公告)日：1995-04-18

申请号：US117150

申请日：1993-09-13

Applicant: Masaichi Inaba ,  Atsushi Miyagawa ,  Takeshi Iwayama

Inventor： Masaichi Inaba ,  Atsushi Miyagawa ,  Takeshi Iwayama

IPC: H01L21/60 ,  H01L23/14 ,  H01L23/495 ,  H01L23/50 ,  H01L23/538 ,  H05K1/00 ,  H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K3/28 ,  H05K3/40 ,  H05K3/46 ,  H05R1/02

CPC classification number: H05K3/4092 ,  H01L23/5387 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K2201/0391 ,  H05K2201/09754 ,  H05K3/281

Abstract: A flexible multi-layer circuit wiring board which is capable of constituting finger lead-like terminals that are little liable to be deformed even when the circuit conductors protruding like finger leads are finely formed and is capable of maintaining good flexibility at a bent portion. Circuit conductors 2 composed of an electrically conducting metal having a large Young's modulus are disposed at the ends of one surface of a flexible insulating base member 1 to form finger lead-like terminals 3, required circuit wiring conductors 4 composed of an electrically conducting metal rich in flexibility are disposed on the other surface of the flexible insulating base member 1 inclusive of a bent portion A of the circuit wiring board, and through-hole connection portions 5 are formed to electrically connect required portions of the circuit conductors 2 and the circuit wiring conductors 4.

Abstract translation: PCT No.PCT / JP93 / 00029 Sec。 371日期1993年9月13日 102（e）1993年9月13日PCT 1993年1月12日PCT PCT。 第WO93 / 15520BC号公报 日期：1993年8月5日。一种柔性多层电路布线板，其能够构成指状引线状端子，即使在电线导体如指状突起突出的情况下也很难变形，并且能够保持良好 弯曲部分的柔韧性。 具有大杨氏模量的导电金属构成的电路导体2设置在柔性绝缘基底构件1的一个表面的端部，以形成指状引线端子3，所需的电路布线导体4由导电金属富集 在柔性绝缘基底构件1的另一个表面（包括电路布线板的弯曲部分A）上设置柔性，并且形成通孔连接部分5以将电路导体2的所需部分和电路布线 导体4。

公开(公告)号：US5386626A

公开(公告)日：1995-02-07

申请号：US118715

申请日：1993-09-10

Applicant: Hing-Liang Cheng

Inventor： Hing-Liang Cheng

IPC: H05K3/00 ,  H05K3/30

CPC classification number: H05K3/301 ,  H05K3/303 ,  H05K2201/09754 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2203/0195 ,  H05K2203/0292 ,  H05K2203/063 ,  H05K2203/167 ,  H05K3/0064 ,  Y02P70/613 ,  Y10S29/046 ,  Y10T29/49149 ,  Y10T29/53174

Abstract: A method for manufacturing a circuit board with a plurality of conductive terminal pins includes the steps of: providing a bed with an array of receiving holes formed therein; providing the bed on a vibrating apparatus; placing a plurality of conductive terminal pins on the bed, each of the terminal pins having a shank and an enlarged head; operating the vibrating apparatus to permit insertion of the shank of each of the terminal pins into a respective one of the receiving holes, the enlarged heads of the terminal pins being sized to prevent extension thereof in the respective one of the receiving holes; providing a fiber glass reinforcing plate formed with an array of through-holes; providing a fiber glass circuit board body having a bottom side formed with an array of connectors; superimposing the reinforcing plate and the circuit board body on the bed such that each of the connectors of the circuit board body and the heads of the terminal pins extend in a corresponding one of the through-holes and abut against each other; and heating the bed, the reinforcing plate and the circuit board body under pressure so as to provide a firm bond between the reinforcing plate and the circuit board body and between each of the connectors and the head of a corresponding one of the terminal pins.

Abstract translation: 一种用于制造具有多个导电端子销的电路板的方法，包括以下步骤：提供具有形成在其中的接收孔阵列的床; 将床铺在振动装置上; 将多个导电端子销放置在床上，每个端子销具有柄和扩大的头部; 操作所述振动装置以允许将每个所述端子销的所述柄插入所述接收孔中的相应一个中，所述端子销的扩大头的尺寸被设计成防止在相应的一个所述接收孔中延伸。 提供形成有通孔阵列的玻璃纤维增​​强板; 提供具有形成有连接器阵列的底侧的玻璃纤维电路板主体; 将加强板和电路板主体叠加在床上，使得电路板主体的每个连接器和端子销的头部在对应的一个通孔中延伸并彼此抵靠; 以及在加压板上加热床，加强板和电路板本体，以便在加强板和电路板主体之间以及每个连接器和相应的一个端子销的头部之间提供牢固的结合。

公开(公告)号：US5378869A

公开(公告)日：1995-01-03

申请号：US37209

申请日：1993-03-26

Applicant: Robert C. Marrs ,  Tadashi Hirakawa

Inventor： Robert C. Marrs ,  Tadashi Hirakawa

IPC: H01L23/538 ,  B23K26/06 ,  B23K26/38 ,  H01L21/48 ,  H01L23/498 ,  H05K3/00 ,  H05K3/40 ,  B23K26/00

CPC classification number: H05K3/0035 ,  B23K26/066 ,  B23K26/382 ,  B23K26/40 ,  B23K26/402 ,  H01L21/486 ,  H01L23/49827 ,  B23K2203/08 ,  B23K2203/12 ,  B23K2203/16 ,  B23K2203/172 ,  B23K2203/18 ,  B23K2203/30 ,  B23K2203/42 ,  B23K2203/50 ,  B23K2203/52 ,  H01L2224/05553 ,  H01L2224/48137 ,  H01L2224/48464 ,  H01L2224/49175 ,  H01L2924/09701 ,  H01L2924/30107 ,  H05K2201/09754 ,  H05K2201/10924 ,  H05K2203/056 ,  H05K2203/107 ,  H05K3/4092

Abstract: An integrated circuit package, and a method for forming the integrated circuit package, including a single layer or multilayer substrate in which interconnection vias are formed is described. Laser energy is swept across a surface of a mask in which holes have been formed. Laser energy passing through the holes of the mask forms vias in a substrate held in place below the mask. The laser energy is swept at such a speed and is maintained at such an energy level that the laser energy forms vias in the substrate, but does not penetrate a set of leads attached to the substrate. Vias may be formed in this way by either a mask imaging, contact mask or conformal mask technique. The laser energy is emitted from a non-thermal (e.g., excimer) laser. The substrate is formed of an organic (e.g., epoxy) resin. The resin may include reinforcing fibers (e.g., aramid fibers). Substrates may be formed on one or both sides of the set of leads. After formation in the substrate, the vias are coated with an electrically conductive material. The method of via formation is fast, inexpensive, achieves higher via density, and avoids overheating of the substrate.

Abstract translation: 描述了一种集成电路封装以及用于形成集成电路封装的方法，该集成电路封装包括其中形成有互连通孔的单层或多层基板。 激光能量扫过已经形成孔的掩模的表面。 通过掩模的孔的激光能量在保持在掩模下方的基底中形成通孔。 激光能量以这样的速度扫过并保持在激光能量在衬底中形成通孔但不穿透附着于衬底的一组引线的能级。 可以通过掩模成像，接触掩模或保形掩模技术以这种方式形成通孔。 激光能量从非热（例如准分子激光）发射。 基底由有机（例如环氧）树脂形成。 树脂可以包括增强纤维（例如芳族聚酰胺纤维）。 基板可以形成在该组引线的一侧或两侧上。 在衬底中形成之后，通孔用导电材料涂覆。 通孔形成方法快速，便宜，实现更高的通孔密度，并避免基板过热。