Package structure for edge-emitting laser

    公开(公告)号:US10992101B2

    公开(公告)日:2021-04-27

    申请号:US16675616

    申请日:2019-11-06

    Abstract: A package structure includes a carrier, a housing, an edge-emitting laser, first and second reflective members and a diffractive optical element. The housing disposed on a mounting surface of the carrier has a receiving space and a top surface, which has an opening and a center line perpendicular to the top surface and the mounting surface. The edge-emitting laser disposed in the receiving space and on the mounting surface has a light-emitting surface emitting a laser beam. The first reflective member is disposed in the receiving space and spaced apart from the light-emitting surface. The second reflective member is disposed in the receiving space and located on the center line above the edge-emitting laser. The diffractive optical element is disposed on the top surface. The laser beam reflected by the first and second reflective members passes through the diffractive optical element to emit out of the housing.

    STRUCTURED WAFER AND OPTOELECTRONIC COMPONENT PRODUCED THEREWITH

    公开(公告)号:US20250070528A1

    公开(公告)日:2025-02-27

    申请号:US18726213

    申请日:2022-12-09

    Applicant: Schott AG

    Abstract: The invention relates to an encapsulated optoelectronic component having a housing and at least one optoelectronic component, which is arranged in a cavity which is formed by a main element and is covered on an upper side by a cover element, and therefore the optoelectronic component is arranged between the cover element and the main elements and the main element forms side walls which laterally enclose the cavity. A one-part plate element with at least one tongue-shaped deflecting element is arranged between the cover element and the main element in such a way that, in the cavity, the deflecting element is arranged with at least one optical surface by which electromagnetic radiation emitted or received by the optoelectronic component can be deflected. The invention also relates to at least one wafer with deflecting elements, to a composite assembly of encapsulated optoelectronic components and to a method for the production thereof.

    LIGHT-EMITTING DEVICE, LIGHT-EMITTING MODULE, AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE

    公开(公告)号:US20250015556A1

    公开(公告)日:2025-01-09

    申请号:US18761643

    申请日:2024-07-02

    Inventor: Takuya HASHIMOTO

    Abstract: A light-emitting device includes a package, a light-emitting element, a first spacer, an optical member, and a first bonding portion. The package includes a lid body having an upper surface. The light-emitting element is disposed in an internal space of the package. The first spacer is disposed on the upper surface of the lid body and has an upper surface. The optical member is disposed above the lid body and has an upper surface and a lower surface. The first bonding portion bonds the lid body and the optical member. The first bonding portion is arranged between the upper surface of the lid body and the lower surface of the optical member and between the upper surface of the first spacer and the lower surface of the optical member.

    OPTOELECTRONIC COMPONENT AND METHOD FOR THE PRODUCTION THEREOF

    公开(公告)号:US20240405507A1

    公开(公告)日:2024-12-05

    申请号:US18710405

    申请日:2022-11-17

    Abstract: The invention relates to an optoelectronic component including an electrically conductive first contact layer located on a carrier substrate, an electrically conductive platform that is located on the first contact layer and is formed integrally therewith, at least one laser diode that is located on the platform and is electrically connected thereto, and an electrically conductive second contact layer which is electrically coupled to the at least one laser diode. The height of the platform is such that the laser facet of the at least one laser diode is at such a vertical distance from the carrier substrate that a light cone emitted by the laser diode through the laser facet does not strike the carrier substrate within a predefined horizontal distance from the laser facet.

    Laser device with an edge emitting source surface-mounted for emission and electronic device

    公开(公告)号:US12095223B1

    公开(公告)日:2024-09-17

    申请号:US18605578

    申请日:2024-03-14

    Applicant: Lijian Sun

    Inventor: Lijian Sun

    Abstract: This application provides a laser device with an edge emitting source surface-mounted for emission and an electronic device. The laser device includes parts involved in the following: A bottom plate of a housing covers a bottom end of a housing body, and the bottom plate includes a first conductive region and a second conductive region apart from each other. An inner cavity of the housing body and the bottom plate form a mounting cavity with a light outlet opposite the bottom plate, and the mounting cavity is provided in a light source assembly. A side surface of the light source chip facing the light outlet is a light-emitting surface, and light is projected from the front of the light outlet. The technical solution provided by this application is to attach an edge emitting source chip onto the mounting side surface of the support member, so as to achieve frontward projecting.

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