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101.发明授权公开(公告)号：US08427183B2
公开(公告)日：2013-04-23
申请号：US13092709
申请日：2011-04-22
IPC分类号： G01R31/00
CPC分类号： G01R1/07307 , G01R3/00
摘要： A planarizer for a probe card assembly. A planarizer includes a first control member extending from a substrate in a probe card assembly. The first control member extends through at least one substrate in the probe card assembly and is accessible from an exposed side of an exterior substrate in the probe card assembly. Actuating the first control member causes a deflection of the substrate connected to the first control member.
摘要翻译： 用于探针卡组件的平面化器。 平面化器包括从探针卡组件中的衬底延伸的第一控制构件。 第一控制构件延伸穿过探针卡组件中的至少一个衬底，并且可从探针卡组件中的外部衬底的暴露侧进入。 驱动第一控制构件导致连接到第一控制构件的衬底的偏转。
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公开(公告)号：US08373428B2
公开(公告)日：2013-02-12
申请号：US12535070
申请日：2009-08-04
IPC分类号： G01R31/00
CPC分类号： B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/07342 , G01R1/07378 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/1134 , H01L2224/13099 , H01L2224/16145 , H01L2224/45144 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1532 , H01L2924/15787 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4015 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10T29/49155 , Y10T29/49222 , H01L2924/00
摘要： A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the probe elements can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described.
摘要翻译： 探针卡组件包括探针卡，具有弹性接触结构（探针元件）的空间变换器，其直接安装到（即，不需要额外的连接线等）并且从其表面上的端子延伸，并且设置有插入器 空间变压器和探针卡之间。 空间变换器和插入器被堆叠，使得可以调节空间变换器的取向，从而可以调节探针元件的尖端的取向而不改变探针卡的取向。 公开了用于调整空间变换器的取向以及用于确定进行什么调整的适当机构。 插入器具有从其顶表面和底表面延伸的弹性接触结构，并且确保通过插入件的固有顺应性，在整个空间变压器的调节范围内在空间变压器和探针卡之间保持电连接。 使用所公开的技术容易地探测半导体晶片上的多个裸片位置，并且可以布置探针元件以优化整个晶片的探测。 作为弹性接触结构的描述，具有由相对硬的外壳覆盖的相对软的芯的复合互连元件。
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公开(公告)号：US08033838B2
公开(公告)日：2011-10-11
申请号：US12577444
申请日：2009-10-12
IPC分类号： H05K1/00
CPC分类号： G01R1/06727 , G01R1/06738 , H01L21/6835 , H01L2221/68359 , H01L2224/11003 , H01L2224/111 , H01L2224/11826 , H01L2224/13017 , H01L2224/13018 , H01L2224/13019 , H01L2224/13565 , H01L2224/13582 , H01L2224/819 , H01L2924/01019 , H01L2924/01074 , H01L2924/01078 , H01L2924/14 , H01L2924/1433 , H01L2924/3011 , H01L2924/3025
摘要： Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the sacrificial substrate. Each spring contact element has a base end portion, a contact end portion, and a central body portion. The contact end portion is offset in the z-axis (at a different height) than the central body portion. The base end portion is preferably offset in an opposite direction along the z-axis from the central body portion. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the sacrificial substrate. The spring contact elements are suitably mounted by their base end portions to corresponding terminals on an electronic component, such as a space transformer or a semiconductor device, whereupon the sacrificial substrate is removed so that the contact ends of the spring contact elements extend above the surface of the electronic component. In an exemplary use, the spring contact elements are thereby disposed on a space transformer component of a probe card assembly so that their contact ends effect pressure connections to corresponding terminals on another electronic component, for the purpose of probing the electronic component.
摘要翻译： 通过将至少一层金属材料沉积到限定在牺牲衬底上的开口中来制造弹簧接触元件。 开口可以在衬底的表面内，或者在沉积在牺牲衬底的表面上的一个或多个层中。 每个弹簧接触元件具有基端部分，接触端部分和中心体部分。 接触端部在与中心体部分相同的z轴（不同高度）偏移。 基端部优选地沿着与中心主体部分的z轴相反的方向偏移。 以这种方式，在牺牲基板上以规定的空间关系制造多个弹簧接触元件。 弹簧接触元件通过它们的基端部适当地安装在诸如空间变压器或半导体器件的电子部件上的对应端子上，从而去除牺牲基板，使得弹簧接触元件的接触端部在表面上方延伸 的电子元件。 在示例性用途中，弹簧接触元件因此被布置在探针卡组件的空间变换器部件上，使得它们的接触端在另一电子部件上实现与相应端子的压力连接，以便探测电子部件。
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公开(公告)号：US20110189564A1
公开(公告)日：2011-08-04
申请号：US13015848
申请日：2011-01-28
摘要： A fuel cell comprises an anode, a cathode, and a proton exchange membrane. The anode and cathode can include a catalyst layer which includes a plurality of generally aligned carbon nanotubes. Methods of making a fuel cell are also disclosed.
摘要翻译： 燃料电池包括阳极，阴极和质子交换膜。 阳极和阴极可以包括包括多个大致排列的碳纳米管的催化剂层。 还公开了制造燃料电池的方法。
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公开(公告)号：US07898242B2
公开(公告)日：2011-03-01
申请号：US12396661
申请日：2009-03-03
IPC分类号： G01R31/28
CPC分类号： G01R31/2889 , G01R31/31905
摘要： A probe card assembly can include an insert holder configured to hold a probe insert, which can include probes disposed in a particular configuration for probing a device to be tested. The probe card assembly can provide an electrical interface to a tester that can control testing of the device, and while attached to the probe card assembly, the insert holder can hold the probe insert such that the probe insert is electrically connected to electrical paths within the probe card assembly that are part of the interface to the tester. The insert holder can be detached from the probe card assembly. The probe insert of the probe card assembly can be replaced by detaching the insert holder, replacing the probe insert with a new probe insert, and then reattaching the insert holder to the probe card assembly. The probe insert and holder can be integrally formed and comprise a single structure that can be detached from a probe card assembly and replaced with a different probe insert and holder.
摘要翻译： 探针卡组件可以包括构造成保持探针插入件的插入物保持器，其可以包括设置在特定构造中的探针，用于探测要测试的装置。 探针卡组件可以向测试器提供电接口，该接口可以控制设备的测试，并且在附接到探针卡组件时，插入物保持器可以保持探针插入件，使得探针插件电连接到内部的电路径 探针卡组件是测试仪接口的一部分。 插入架可以从探针卡组件拆下。 探针卡组件的探针插入可以通过拆卸插入物夹持器，用新的探针插入物代替探针插入物，然后将插入物夹持器重新连接到探针卡组件来代替。 探针插入物和保持器可以一体地形成并且包括可以从探针卡组件分离并且用不同的探针插入物和保持器代替的单个结构。
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公开(公告)号：US20100323551A1
公开(公告)日：2010-12-23
申请号：US12852337
申请日：2010-08-06
IPC分类号： H01R11/20
CPC分类号： H01R13/2407 , G01R1/06711 , G01R1/06727 , H01R4/26 , H01R9/091 , H01R12/57 , H01R13/2442 , H01R2201/20 , Y10T29/49004 , Y10T29/49128 , Y10T29/49165
摘要： An apparatus and method providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surface of the tip structure such that the length of the blade is substantially parallel to the direction of horizontal movement of the tip structure as the tip structure deflects across the terminal of an electronic component. In this manner, the sharpened substantially parallel oriented blade slices cleanly through any non-conductive layer(s) on the surface of the terminal and provides a reliable electrical connection between the interconnection element and the terminal of the electrical component.
摘要翻译： 描述了提供改进的互连元件和尖端结构以实现电子部件的端子之间的压力连接的装置和方法。 本发明的尖端结构具有尖端结构的上表面上定向的锋利的叶片，使得叶片的长度基本上平行于尖端结构的水平移动方向，因为尖端结构偏转穿过端部 电子元件 以这种方式，锋利的基本上平行的定向叶片切片通过终端表面上的任何非导电层清洁，并且在互连元件和电气部件的端子之间提供可靠的电连接。
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公开(公告)号：US07852094B2
公开(公告)日：2010-12-14
申请号：US11567705
申请日：2006-12-06
IPC分类号： G01R31/02
CPC分类号： G01R31/31926 , G01R31/318511
摘要： Probes in a plurality of DUT probe groups can be connected in parallel to a single tester channel. In one aspect, digital potentiometers can be used to effectively switch the tester channel from a probe in one DUT probe group to a probe in another DUT probe group. In another aspect, switches in parallel with a resistor can accomplish such switching. In yet another aspect, a chip select terminal on each DUT can be used to effectively connect and disconnect internal DUT circuitry to the tester channel. Multiple DUT probe groups so connected can be used to create different patterns of DUT probe groups for testing different patterns of DUTs and thus facilitate sharing tester channels.
摘要翻译： 多个DUT探针组中的探针可以并联连接到单个测试仪通道。 在一个方面，数字电位器可用于有效地将测试仪通道从一个DUT探针组中的探头切换到另一个DUT探针组中的探针。 另一方面，与电阻并联的开关可以实现这种切换。 在另一方面，每个DUT上的芯片选择端可用于有效地连接和断开内部DUT电路到测试器通道。 如此连接的多个DUT探针组可用于创建不同的DUT探针组，以测试DUT的不同图案，从而便于共享测试仪通道。
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公开(公告)号：US07845072B2
公开(公告)日：2010-12-07
申请号：US12343260
申请日：2008-12-23
申请人： Eric D. Hobbs , Benjamin N. Eldridge , Lunyu Ma , Gaetan L. Mathieu , Steven T. Murphy , Makarand S. Shinde , Alexander H. Slocum
发明人： Eric D. Hobbs , Benjamin N. Eldridge , Lunyu Ma , Gaetan L. Mathieu , Steven T. Murphy , Makarand S. Shinde , Alexander H. Slocum
IPC分类号： H05K3/30
CPC分类号： G01R31/2886 , G01R1/073 , G01R31/31905 , Y10T29/49128 , Y10T29/4913 , Y10T29/49133 , Y10T29/49147 , Y10T29/49208 , Y10T29/49222
摘要： A probe card assembly comprises multiple probe substrates attached to a mounting assembly. Each probe substrate includes a set of probes, and together, the sets of probes on each probe substrate compose an array of probes for contacting a device to be tested. Adjustment mechanisms are configured to impart forces to each probe substrate to move individually each substrate with respect to the mounting assembly. The adjustment mechanisms may translate each probe substrate in an “x,” “y,” and/or “z” direction and may further rotate each probe substrate about any one or more of the forgoing directions. The adjustment mechanisms may further change a shape of one or more of the probe substrates. The probes can thus be aligned and/or planarized with respect to contacts on the device to be tested.
摘要翻译： 探针卡组件包括附接到安装组件的多个探针基板。 每个探针衬底包括一组探针，并且每个探针衬底上的探针组合在一起组成一组探针，用于接触待测试的器件。 调整机构构造成赋予每个探针基板以相对于安装组件分别移动每个基板的力。 调节机构可以将每个探针基板转换成“x”，“y”和/或“z”方向，并且可以进一步围绕前述方向上的任何一个或多个旋转每个探针基板。 调节机构可以进一步改变一个或多个探针基板的形状。 因此，探针可以相对于要测试的装置上的触点对准和/或平坦化。
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公开(公告)号：US07841863B2
公开(公告)日：2010-11-30
申请号：US12495405
申请日：2009-06-30
IPC分类号： H01R12/00
CPC分类号： G01R3/00 , G01R1/06727 , G01R1/06761 , H01L2924/0002 , H01L2924/01005 , H01L2924/14 , H05K3/326 , H05K3/4092 , H01L2924/00
摘要： An interconnection element of a spring (body) including a first resilient element with a first contact region and a second contact region and a first securing region and a second resilient element, with a third contact region and a second securing region. The second resilient element is coupled to the first resilient element through respective securing regions and positioned such that upon sufficient displacement of the first contact region toward the second resilient element, the second contact region will contact the third contact region. The interconnection, in one aspect, is of a size suitable for directly contacting a semiconductor device. A large substrate with a plurality of such interconnection elements can be used as a wafer-level contactor. The interconnection element, in another aspect, is of a size suitable for contacting a packaged semiconductor device, such as in an LGA package.
摘要翻译： 包括具有第一接触区域和第二接触区域的第一弹性元件和具有第三接触区域和第二固定区域的第一固定区域和第二弹性元件的弹簧（主体）的互连元件。 第二弹性元件通过相应的固定区域联接到第一弹性元件，并且定位成使得在第一接触区域朝着第二弹性元件充分移位时，第二接触区域将接触第三接触区域。 在一个方面，互连具有适于直接接触半导体器件的尺寸。 可以使用具有多个这种互连元件的大型衬底作为晶片级接触器。 在另一方面，互连元件的尺寸适合于例如LGA封装中的封装半导体器件的接触。
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110.发明申请ELECTRICAL CONTACTOR, ESPECIALLY WAFER LEVEL CONTACTOR, USING FLUID PRESSURE 有权电动接触器，特别是水平接触器，使用流体压力公开(公告)号：US20100297863A1
公开(公告)日：2010-11-25
申请号：US12783379
申请日：2010-05-19
申请人： Benjamin N. Eldridge
发明人： Benjamin N. Eldridge
IPC分类号： H01R4/64
CPC分类号： G01R31/2887 , G01R1/0735 , G01R31/2886
摘要： An electrical interconnect assembly and methods for making an electrical interconnect assembly. In one embodiment, an interconnect assembly includes a flexible wiring layer having a plurality of first contact elements and a fluid containing structure which is coupled to the flexible wiring layer. The fluid, when contained in the fluid containing structure, presses the flexible wiring layer towards a device under test to form electrical interconnections between the first contact elements and corresponding second contact elements on the device under test. In a further embodiment, an interconnect assembly includes a flexible wiring layer having a plurality of first contact terminals and a semiconductor substrate which includes a plurality of second contact terminals. A plurality of freestanding, resilient contact elements, in one embodiment, are mechanically coupled to one of the flexible wiring layers or the semiconductor substrate and make electrical contacts between corresponding ones of the first contact terminals and the second contact terminals. In another embodiment, a method of making electrical interconnections includes joining a flexible wiring layer and a substrate together in proximity and causing a pressure differential between a first side and a second side of the flexible wiring layer. The pressure differential deforms the flexible wiring layer and causes a plurality of first contact terminals on the flexible wiring layer to electrically connect with a corresponding plurality of second contact terminals on the substrate.
摘要翻译： 电互连组件和用于制造电互连组件的方法。 在一个实施例中，互连组件包括具有多个第一接触元件和耦合到柔性布线层的流体容纳结构的柔性布线层。 当容纳在流体容纳结构中时，流体将柔性布线层压向被测器件，以在被测器件上的第一接触元件和对应的第二接触元件之间形成电互连。 在另一实施例中，互连组件包括具有多个第一接触端子的柔性布线层和包括多个第二接触端子的半导体衬底。 在一个实施例中，多个独立的弹性接触元件机械耦合到柔性布线层或半导体衬底中的一个，并且在对应的第一接触端子和第二接触端子之间形成电接触。 在另一个实施例中，制造电互连的方法包括将柔性布线层和基板接合在一起并在柔性布线层的第一侧和第二侧之间形成压差。 压差使柔性布线层变形，使柔性布线层上的多个第一接触端子与基板上的对应的多个第二接触端子电连接。
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