公开(公告)号：US09332559B2

公开(公告)日：2016-05-03

申请号：US13963379

申请日：2013-08-09

Applicant: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED ,  LITE-ON TECHNOLOGY CORP.

Inventor： Chih-Li Pan ,  Shiou-Yu Lee ,  Chih-Yen Wu

IPC: H04W72/08 ,  H04W72/02 ,  H04L1/18 ,  H04W84/12 ,  H04W84/18 ,  H04L5/00 ,  H04L27/00

CPC classification number: H04W72/085 ,  H04L1/1867 ,  H04L5/0062 ,  H04L27/0006 ,  H04W72/02 ,  H04W84/12 ,  H04W84/18

Abstract: In a method for selecting an operation channel, a wireless network connecting apparatus is configured to: identify at least one preoccupied channel; determine a plurality of available channels; evaluate a channel quality of each of the available channels; select one of the available channels based on the channel quality thereof as the operation channel, and to switch to the operation channel; transmit an evaluation packet through the operation channel; determine whether the operation channel needs to be replaced, based on a number of data retransmissions; and exclude the operation channel from the available channels when the determination is affirmative.

Abstract translation: 在选择操作信道的方法中，无线网络连接装置被配置为：识别至少一个专用信道; 确定多个可用信道; 评估每个可用频道的频道质量; 基于其通道质量作为操作信道选择一个可用信道，并切换到操作信道; 通过操作信道发送评估报文; 基于数据重传确定是否需要更换操作通道; 并且当确定是肯定的时候从可用信道中排除操作信道。

公开(公告)号：US20160094147A1

公开(公告)日：2016-03-31

申请号：US14960603

申请日：2015-12-07

Applicant: LITE-ON TECHNOLOGY CORP. ,  LITE-ON ELECTRONICS (GUANGZHOU) LIMITED

Inventor： WEI-CHENG YU ,  CHI-CHE WU ,  LIANG-HONG WANG

IPC: H02M7/217 ,  H05K1/11 ,  H02M1/14 ,  H05K1/18 ,  H02M1/34 ,  H02M1/08 ,  H02M3/335 ,  H05K1/09

CPC classification number: H02M7/217 ,  H02M1/08 ,  H02M1/14 ,  H02M1/34 ,  H02M3/335 ,  H02M3/33507 ,  H02M3/33592 ,  H02M2001/0048 ,  H02M2001/348 ,  H05K1/0203 ,  H05K1/092 ,  H05K1/111 ,  H05K1/117 ,  H05K1/141 ,  H05K1/181 ,  H05K2201/0355 ,  H05K2201/10166 ,  Y02B70/1475

Abstract: A power supply device includes a main unit and a power switching module. The main unit includes a primary circuit board, a transformer including a primary and a secondary coil, a primary-side circuit and a secondary-side circuit. The power switching module includes a separate PCB formed with at least two connection pads and two conductive tracks, and at least one power switching element disposed on the PCB and having two terminals respectively connected to the two connection pads through the two conductive tracks . The power switching module is in the form of a separate PCB that is electrically connected to the primary- or secondary-side circuits through the two connection pads.

Abstract translation: 电源装置包括主单元和电源开关模块。 主单元包括主电路板，包括初级和次级线圈的变压器，初级侧电路和次级侧电路。 电源开关模块包括形成有至少两个连接焊盘和两个导电轨道的单独PCB，以及设置在PCB上的至少一个电源开关元件，并且具有通过两个导电轨道分别连接到两个连接焊盘的两个端子。 电源开关模块是单独的PCB的形式，其通过两个连接焊盘电连接到初级或次级侧电路。

公开(公告)号：US20160071830A1

公开(公告)日：2016-03-10

申请号：US14715895

申请日：2015-05-19

Applicant: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD. ,  LITE-ON TECHNOLOGY CORP.

Inventor： CHEN-HSIU LIN

IPC: H01L25/16 ,  H01L33/48 ,  H01L33/52 ,  H01L33/62 ,  H01L25/075 ,  H01L29/866

CPC classification number: H01L25/167 ,  F21K9/00 ,  H01L25/0753 ,  H01L25/165 ,  H01L29/866 ,  H01L33/62 ,  H01L2224/48137

Abstract: A light emitting device includes a substrate having a top surface, upper and lower metal layers, multiple LED chips, at least one Zener diode, multiple conductive wires and an encapsulant. The top surface includes a central region bounded by an imaginary boundary with a profile conforming to an outline of a circle stacked with a polygon. The central region has a die bonding area corresponding to the circle, and at least one polygonal extension area formed outside the die bonding area. The upper metal layer includes multiple conducting pads surrounding the central region. The LED chips are disposed on the die bonding area. The Zener diode is disposed on the polygonal extension area. The encapsulant is disposed on the substrate and covers the LED chips.

Abstract translation: 发光器件包括具有顶表面，上金属层和下金属层，多个LED芯片，至少一个齐纳二极管，多个导线和密封剂的基板。 顶表面包括由虚拟边界限定的中心区域，其中具有符合与多边形堆叠的圆的轮廓的轮廓。 中心区域具有与圆形相对应的芯片接合区域，以及形成在芯片接合区域外部的至少一个多边形延伸区域。 上金属层包括围绕中心区域的多个导电垫。 LED芯片设置在芯片接合区域上。 齐纳二极管设置在多边形延伸区域上。 密封剂设置在基板上并覆盖LED芯片。

公开(公告)号：US20160042519A1

公开(公告)日：2016-02-11

申请号：US14748386

申请日：2015-06-24

Applicant: NATIONAL TAIWAN UNIVERSITY ,  LITE-ON TECHNOLOGY CORP.

Inventor： JIUN-HUEI PROTY WU ,  CHING-FENG CHENG

IPC: G06T7/00

CPC classification number: G06T7/50 ,  G06T2207/10016 ,  G06T2207/10024

Abstract: In a method for generating image depth maps for image frames included in a video, an image processing device is configured to: acquire a full depth map of an nth image frame of the video; find a to-be-processed region of an (n+m)th image frame of the video, the to-be-processed region differing from a corresponding region of the nth image frame of the video; process the to-be-processed region of the (n+m)th image frame of the video for generating a partial depth map that corresponds to the to-be-processed region; and generate a full depth map of the (n+m)th image frame of the video by using the partial depth map to replace a part of the full depth map of the nth image frame of the video that corresponds in position to the partial depth map.

Abstract translation: 在用于生成包括在视频中的图像帧的图像深度图的方法中，图像处理装置被配置为：获取视频的第n个图像帧的全景图; 找到视频的第（n + m）个图像帧的待处理区域，待处理区域与视频的第n个图像帧的相应区域不同; 处理视频的第（n + m）个图像帧的待处理区域，以生成对应于待处理区域的部分深度图; 并且通过使用部分深度图来生成视频的第（n + m）个图像帧的全景图，以将位置上对应的视频的第n个图像帧的全部深度图的一部分替换为部分深度 地图。

公开(公告)号：US09204470B2

公开(公告)日：2015-12-01

申请号：US13958752

申请日：2013-08-05

Applicant: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED ,  LITE-ON TECHNOLOGY CORP.

Inventor： Chih-Li Pan ,  Heng-Yi Lin ,  Chih-Yen Wu

IPC: H04L1/00 ,  H04W76/02 ,  H04W84/18

CPC classification number: H04W76/10 ,  H04W84/18

Abstract: A method is for allowing a wireless target device to automatically connect to a target network. The method is to be implemented by a wireless executing device in a wireless network system. In the method, the wireless executing device is configured to establish an ad-hoc wireless network with the wireless target device, and to transmit an access setting to the wireless target device over the ad-hoc wireless network. The access setting enables the wireless target device to connect to the target network automatically.

Abstract translation: 一种方法是允许无线目标设备自动连接到目标网络。 该方法由无线网络系统中的无线执行装置实现。 在该方法中，无线执行装置被配置为与无线目标设备建立自组织无线网络，并且通过自组织无线网络向无线目标设备发送访问设置。 访问设置使无线目标设备能够自动连接到目标网络。

公开(公告)号：US20150294959A1

公开(公告)日：2015-10-15

申请号：US14590263

申请日：2015-01-06

Applicant: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD. ,  LITE-ON TECHNOLOGY CORP.

Inventor： HOU-TE LEE ,  TSUNG-KANG YING ,  ERH-CHAN HSU

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/58 ,  H01L33/48 ,  H01L33/54

CPC classification number: H01L25/0753 ,  H01L33/486 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00012

Abstract: An LED package structure includes: an insulating substrate that has a front bonding pad assembly; a dark-colored die-attach adhesive; blue and green LED chips mounted on the front bonding pad assembly via the dark-colored die-attach adhesive; and a dark-colored and light-transmissible encapsulant that is disposed on the insulating substrate and that encapsulates the blue and green LED chips. The encapsulant has a light transmittance that ranges from 7% to 28% for the blue light and has a light transmittance that ranges from 9% to 30% for the green light.

Abstract translation: 一种LED封装结构，包括：具有前焊盘组件的绝缘衬底; 暗色的贴片胶; 蓝色和绿色LED芯片通过暗色的芯片附着粘合剂安装在前焊盘组件上; 以及深色和透光的密封剂，其设置在绝缘基板上并且封装蓝色和绿色LED芯片。 密封剂对于蓝色光具有7％至28％的透光率，对于绿色光具有9％至30％的透光率。

公开(公告)号：US20150171664A1

公开(公告)日：2015-06-18

申请号：US14289963

申请日：2014-05-29

Applicant: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED ,  LITE-ON TECHNOLOGY CORP.

Inventor： YU-SHUN LIU ,  SHI-EN WANG

IPC: H02J9/06 ,  H02J7/00

CPC classification number: H02J9/061 ,  G01R27/2605 ,  H02J7/0063 ,  H02J7/345 ,  H02J2007/0067 ,  H02M2001/0096 ,  Y10T307/615

Abstract: A control method for implementation in a power supply system includes steps (A), (B), and (C). In step (A), while the power supply system is providing electricity to a load, a control circuit determines, an estimated capacitance value related to an output capacitor. In step (B), while the output capacitor is providing electricity to the load, the control circuit determines an average power value related to the electricity provided by the output capacitor to the load. In step (C), the control circuit determines an estimated hold-up time value related to the power supply system based on a predetermined target voltage value, a predetermined minimum voltage value, the average power value and the estimated capacitance value.

Abstract translation: 在电源系统中实现的控制方法包括步骤（A），（B）和（C）。 在步骤（A）中，当供电系统向负载供电时，控制电路确定与输出电容器相关的估计电容值。 在步骤（B）中，当输出电容器向负载供电时，控制电路确定与输出电容器对负载提供的电力相关的平均功率值。 在步骤（C）中，控制电路基于预定的目标电压值，预定的最小电压值，平均功率值和估计的电容值来确定与电源系统相关的估计的保持时间值。

公开(公告)号：US09029905B2

公开(公告)日：2015-05-12

申请号：US14308956

申请日：2014-06-19

Applicant: Lite-On Opto Technology (Changzhou) Co., Ltd. ,  Lite-On Technology Corp.

Inventor： Chen-Hsiu Lin ,  Kuo-Ming Chiu

IPC: H01L33/00 ,  H01L33/52 ,  H01L23/00 ,  H01L25/075 ,  H01L33/60

CPC classification number: H01L33/52 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2933/005 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A light emitting diode (LED) device includes: a substrate having a central portion; an LED chip unit formed on the central portion of the substrate; a circuit pattern having a positive electrode and a negative electrode that are formed on the substrate, each of the positive electrode and the negative electrode including an arc portion and at least one extending portion that extends from the arc portion toward the central portion; a wire unit connecting the LED chip unit to the extending portions; a glass layer disposed on the substrate, covering the arc portions and including an opening unit that is aligned with the central portion of the substrate; a dam structure formed on the glass layer and extending along the arc portions; and an encapsulated body disposed substantially within the dam structure to cover the extending portions, the wire unit and the LED chip unit.

Abstract translation: 发光二极管（LED）装置包括：具有中心部分的基板; 形成在基板的中心部分上的LED芯片单元; 形成在基板上的具有正极和负极的电路图案，所述正极和所述负极中的每一个包括弧形部分和从所述弧形部分朝向所述中心部分延伸的至少一个延伸部分; 将所述LED芯片单元连接到所述延伸部的线单元; 设置在所述基板上的玻璃层，其覆盖所述圆弧部并且包括与所述基板的中心部对准的开口单元; 形成在玻璃层上并沿着圆弧部分延伸的坝结构; 以及基本上设置在坝结构内以覆盖延伸部分，线单元和LED芯片单元的封装体。

公开(公告)号：US20150044889A1

公开(公告)日：2015-02-12

申请号：US14318851

申请日：2014-06-30

Applicant: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED ,  LITE-ON TECHNOLOGY CORP.

Inventor： CHUNG-FU WANG ,  NIEN-HUNG YAO ,  HSIN-YU YANG ,  YU-SHAN KAO

IPC: H01R4/02 ,  H05K1/11 ,  H01R12/57

CPC classification number: H01R4/02 ,  H01R12/57 ,  H01R12/585 ,  H01R12/707 ,  H01R12/716 ,  H05K1/11 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/10856 ,  H05K2201/10878

Abstract: An electrical connector includes an insulating body having a bottom surface, a receiving groove formed in the bottom surface, and at least one support block projecting downwardly from the bottom surface for connection with a circuit board and cooperating with the bottom surface to define a venting space that communicates with the receiving groove and a solder hole in the circuit board. A conductive terminal includes a first positioning portion extending into and positioned in the receiving groove, and a second positioning portion connected to the first positioning portion and extending through the venting space and adapted to be positioned in the solder hole.

Abstract translation: 电连接器包括具有底表面的绝缘体，形成在底表面中的接收槽，以及从底表面向下伸出的至少一个支撑块，用于与电路板连接并与底表面配合以形成通气空间 其与电路板中的接收槽和焊接孔连通。 导电端子包括延伸到接收槽中并定位在接收槽中的第一定位部分和连接到第一定位部分并延伸穿过通气空间并适于定位在焊料孔中的第二定位部分。

公开(公告)号：US20150034986A1

公开(公告)日：2015-02-05

申请号：US14327643

申请日：2014-07-10

Applicant: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD. ,  LITE-ON TECHNOLOGY CORP.

Inventor： YI-FEI LEE ,  TSAN-YU HO ,  SHIH-CHANG HSU ,  CHEN-HSIU LIN

IPC: H01L33/50 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L33/60 ,  H01L33/56

CPC classification number: H01L33/641 ,  F21V19/001 ,  H01L27/15 ,  H01L33/486 ,  H01L33/50 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2924/10157 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2933/0091

Abstract: An LED package includes a chip carrier, an adhesive layer, one high-voltage LED die, and an encapsulating member. The chip carrier defines a receiving space. The adhesive layer is disposed in the receiving space and has a thermal conductivity of larger than or equal to 1 W/mK. The high-voltage LED die is attached to the adhesive layer to be received in the reflective space and has a top surface formed with a trench. The trench of the high-voltage LED die is disposed at an optical center of the receiving space. The encapsulating member encapsulates the high-voltage LED die and includes a plurality of diffusers. The trench is embedded with the encapsulating member and has a width ranging from 1 μm to 10 μm and a depth of less than or equal to 50 μm.

Abstract translation: LED封装包括芯片载体，粘合剂层，一个高压LED管芯和封装构件。 芯片载体定义了接收空间。 粘合剂层设置在容纳空间中并具有大于或等于1W / mK的热导率。 高压LED管芯附着在粘合剂层上以被接收在反射空间中，并且具有形成有沟槽的顶表面。 高压LED管芯的沟槽设置在接收空间的光学中心。 封装构件封装高压LED管芯并且包括多个扩散器。 沟槽嵌入封装构件，其宽度范围为1μm至10μm，深度小于或等于50μm。