公开(公告)号：US09887336B2

公开(公告)日：2018-02-06

申请号：US15525759

申请日：2015-10-26

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Frank Singer

IPC: H01L33/62 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/505 ,  H01L33/54 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An optoelectronic semiconductor component includes a carrier having a carrier top side and an opposing carrier underside, wherein the carrier top sides each have a larger area than the associated carrier undersides, the carrier parts fixedly connect to one another via at least one potting body and the potting body together with the carrier parts represents a bearing component of the semiconductor component so that all carrier undersides end flush with the potting body, the light-emitting semiconductor chips electrically connect in series, the metal layer on the carrier top side is structured into conductor tracks and into electrical connection surfaces, and the electrical connection surfaces on the carrier top side are electrically insulated from the associated carrier underside so that the carrier underside of the carrier part the semiconductor chips are arranged on is potential-free and is completely covered with the metal layer.

公开(公告)号：US09698326B2

公开(公告)日：2017-07-04

申请号：US15058667

申请日：2016-03-02

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias Sabathil ,  Stefan Illek ,  Thomas Schwarz

IPC: H01L33/54 ,  H01L33/60 ,  H01L31/00 ,  H01L51/52 ,  H01L31/0232 ,  H01L25/075 ,  H01L33/48 ,  H01L33/56 ,  H01L25/16 ,  H01L25/00 ,  H01L33/46

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L25/167 ,  H01L25/50 ,  H01L31/00 ,  H01L31/02322 ,  H01L33/46 ,  H01L33/486 ,  H01L33/54 ,  H01L33/56 ,  H01L51/5271 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/00

Abstract: An optoelectronic semiconductor component including an optoelectronic semiconductor chip having a first surface, wherein the first surface is a radiation emission surface of the optoelectronic semiconductor chip, the semiconductor chip is embedded in a mold body, the first surface is elevated with respect to a top side of the mold body, and a reflective layer is arranged on the top side of the mold body.

公开(公告)号：US09673136B2

公开(公告)日：2017-06-06

申请号：US14424539

申请日：2013-08-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Tobias Gebuhr ,  Thomas Schwarz

IPC: H01L21/56 ,  H01L23/495 ,  H01L33/48 ,  H01L21/48 ,  H01L23/31 ,  H01L25/075

CPC classification number: H01L23/49541 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3157 ,  H01L23/49503 ,  H01L25/0753 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2933/0033 ,  Y10T29/49158 ,  H01L2924/00

Abstract: A housing arrangement includes a plurality of interconnected housings for electronic components, each housing including a leadframe section of a leadframe, wherein the leadframe section is formed from an electrically conductive material and has a receiving region that receives the electronic component and/or a contact region that contacts the electronic component, a molding material into which the leadframe section is embedded and which has at least one receiving opening in which the receiving region and/or the contact region are exposed, and at least one stress reduction opening formed in the molding material and free of the receiving region and/or the contact region, wherein the housings connect to one another via the leadframe and the molding material, the stress reduction openings are formed at transitions from in each case one of the housings to another of the housings.

公开(公告)号：US09608172B2

公开(公告)日：2017-03-28

申请号：US14441458

申请日：2013-11-04

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Matthias Sabathil

IPC: H01L33/50 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62 ,  H05K1/02 ,  H01L25/075 ,  H01L33/64

CPC classification number: H01L33/483 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/021 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014

Abstract: In at least one embodiment, the optoelectronic semiconductor component contains at least one chip support having electrical contact devices and also at least one optoelectronic semiconductor chip that is set up to produce radiation and that is mechanically and electrically mounted on the chip support. A component support is attached to the chip support. The semiconductor chip is situated in a recess in the component support. The component support is electrically insulated from the chip support and from the semiconductor chip. The component support is formed from a metal or from a metal alloy. On a top that is remote from the chip support, the component support is provided with a reflective coating.

公开(公告)号：US20160276545A1

公开(公告)日：2016-09-22

申请号：US15033157

申请日：2014-10-16

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Johannes Mueller ,  Christoph Koller ,  Thomas Schwarz ,  Frank Singer

IPC: H01L33/48 ,  H01L33/00 ,  H01L33/60 ,  H01L33/54 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L24/24 ,  H01L33/005 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: In various embodiments, a method for producing an electronic component is provided. The method includes applying an adhesive layer to a carrier, initially curing the adhesive layer applied to the carrier, providing a chip, wherein the chip has a substrate and a layer sequence arranged on the substrate, laying the chip onto the initially cured adhesive layer by way of a top side of the layer sequence, embedding the chip into a shaped body, wherein the top side of the layer sequence and a first side of the shaped body lie substantially in a plane, separating the embedded chip from the adhesive layer and the carrier, and applying an electrically conductive structure to the first side of the shaped body, the shaped body forming a vertical electrical insulation between the electrically conductive structure and the substrate.

Abstract translation: 在各种实施例中，提供了一种用于制造电子部件的方法。 该方法包括将粘合剂层施加到载体上，最初固化施加到载体上的粘合剂层，提供芯片，其中芯片具有衬底和布置在衬底上的层序列，将芯片铺设在初始固化的粘合剂层上 层序列的顶侧的方式，将芯片嵌入成形体中，其中层序列的顶侧和成形体的第一侧基本上位于平面中，将嵌入的芯片与粘合剂层分离，并且 载体，并且将导电结构施加到成形体的第一侧，成形体在导电结构和基板之间形成垂直的电绝缘。

公开(公告)号：US20160218261A1

公开(公告)日：2016-07-28

申请号：US15021091

申请日：2014-08-25

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Jürgen Moosburger ,  Ion Stoll ,  Thomas Schwarz ,  Frank Singer ,  Georg Dirscherl ,  Lutz Höppel

IPC: H01L33/60 ,  H01L33/56

CPC classification number: H01L33/60 ,  H01L24/24 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0091 ,  H01L2924/00

Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip including a light-transmissive carrier, a semiconductor layer sequence on the light-transmissive carrier and electrical connection points on a bottom portion remote from the light-transmissive carrier of the semiconductor layer sequence, a light-transmissive encapsulating material enclosing the optoelectronic semiconductor chip in places, and particles of a light-scattering and/or light-reflecting material, wherein the bottom of the semiconductor layer sequence is at least in places free of the light-transmissive encapsulating material, and the particles cover the bottom of the semiconductor layer sequence and an outer face of the encapsulating material in places.

Abstract translation: 光电子半导体部件包括：光电子半导体芯片，其包含透光性载体，透光性载体上的半导体层序列和远离半导体层序列的透光性载体的底部的电连接点; 封装光电子半导体芯片的透射性封装材料，以及光散射和/或光反射材料的颗粒，其中半导体层序列的底部至少在没有透光封装材料的位置，并且 颗粒在位置覆盖半导体层序列的底部和封装材料的外表面。

公开(公告)号：US20160204574A1

公开(公告)日：2016-07-14

申请号：US14916660

申请日：2014-08-14

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Thomas Schwarz ,  Thomas Dobbertin

IPC: H01S5/022

CPC classification number: H01S5/02272 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49107 ,  H01L2224/49111 ,  H01S5/022 ,  H01S5/02212 ,  H01S5/02276 ,  H01S5/4018 ,  H01S5/4031 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An optoelectronic component includes a housing including a base having an upper side and a lower side, and a cap, and a laser chip arranged between the upper side of the base and the cap, wherein a first solder contact pad and a second solder contact pad are formed on the lower side of the base, the laser chip includes a second electrical contact pad, and the second electrical contact pad electrically conductively connects to a section of the base electrically conductively connected to the second solder contact pad by a second bonding wire.

Abstract translation: 一种光电子部件包括：壳体，包括具有上侧和下侧的基座和盖;以及激光芯片，布置在基座的上侧和盖之间，其中第一焊料接触焊盘和第二焊接接触焊盘 形成在基座的下侧，激光芯片包括第二电接触焊盘，第二电接触焊盘通过第二接合线导电地连接到与第二焊接接触焊盘导电连接的基座的一部分。

公开(公告)号：US20160005936A1

公开(公告)日：2016-01-07

申请号：US14769198

申请日：2014-01-15

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Stefan Illek ,  Hans-Jürgen Lugauer ,  Jürgen Moosburger ,  Thomas Schwarz ,  Tansen Varghese

IPC: H01L33/54 ,  H01L33/62 ,  H01L33/50 ,  H01L33/00

CPC classification number: H01L33/54 ,  H01L33/005 ,  H01L33/0095 ,  H01L33/50 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A method can be used for for producing an optoelectronic component. An optoelectronic semiconductor chip has a front face and a rear face. A sacrificial layer is applied to the rear face. A molded body is formed the optoelectronic semiconductor chip being at least partially embedded in the molded body. The sacrificial layer is removed.

Abstract translation: 一种方法可用于制造光电子元件。 光电子半导体芯片具有正面和背面。 将牺牲层施加到后表面。 模制体形成为至少部分地嵌入模制体中的光电子半导体芯片。 牺牲层被去除。

公开(公告)号：US20150249070A1

公开(公告)日：2015-09-03

申请号：US14430215

申请日：2013-09-06

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Stefan Illek ,  Thomas Schwarz ,  Jürgen Moosburger ,  Walter Wegleiter

IPC: H01L25/075 ,  H01L33/52 ,  H01L33/64 ,  H01L33/50 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L33/505 ,  H01L33/52 ,  H01L33/62 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01L2924/00

Abstract: An optoelectronic semiconductor component and a method for making an optoelectronic semiconductor component are disclosed. In an embodiment the component includes a carrier including at least one conversion-medium body and a potting body, the potting body surrounding the conversion-medium body at least in places, as seen in plan view, electrical contact structures fitted at least indirectly to the carrier and a plurality of optoelectronic semiconductor chips fitted to a main face of the carrier, the optoelectronic semiconductor chips configured to generate radiation, wherein the conversion-medium body is shaped as a plate, wherein the semiconductor chips are directly mechanically connected to the conversion-medium body, and wherein the conversion-medium body is free of cutouts for the electrical contact structures and is not penetrated by the electrical contact structure.

Abstract translation: 公开了一种光电子半导体部件和制造光电半导体部件的方法。 在一个实施例中，部件包括载体，该载体包括至少一个转化介质体和灌封体，灌封体至少在一些地方围绕转化介质体，如平面图所示，电接触结构至少间接地安装在 载体和安装在载体的主面上的多个光电半导体芯片，所述光电子半导体芯片被配置为产生辐射，其中所述转换介质体被成形为板，其中所述半导体芯片直接机械地连接到所述转换 - 中间体，并且其中所述转换介质主体没有用于所述电接触结构的切口并且不被所述电接触结构穿透。

公开(公告)号：US20150228873A1

公开(公告)日：2015-08-13

申请号：US14426072

申请日：2013-08-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Tobias Gebuhr ,  Matthias Knörr ,  Klaus Müller ,  Thomas Schwarz ,  Frank Singer ,  Michael Zitzlsperger

IPC: H01L33/62 ,  H01L21/56 ,  H01L21/48 ,  H01L51/56 ,  H01L51/52

CPC classification number: H01L33/483 ,  H01L21/4828 ,  H01L21/565 ,  H01L23/49861 ,  H01L24/32 ,  H01L25/0753 ,  H01L33/62 ,  H01L51/5237 ,  H01L51/5246 ,  H01L51/5296 ,  H01L51/56 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/92247 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/0066 ,  Y10T29/49121 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A housing for an optical component is provided in various embodiments. The housing has a leadframe section and a mold compound. The leadframe section is formed from an electrically conductive material and has a first side and a second side facing away from the first side. On the first side, the leadframe section has at least one first receiving region for receiving the optical component and/or at least one contact region for electrically contacting the optical component. The leadframe section has at least one trench which is formed in the leadframe section on the first side thereof alongside the receiving region and/or the contact region. The leadframe section is embedded in the mold compound. The mold compound has at least one receiving recess in which the first receiving region and/or the contact region and the trench are arranged.

Abstract translation: 在各种实施例中提供了用于光学部件的壳体。 壳体具有引线框架部分和模具复合体。 引线框架部分由导电材料形成，并且具有背离第一侧的第一侧和第二侧。 在第一侧，引线框架部分具有用于接收光学部件的至少一个第一接收区域和/或用于电接触光学部件的至少一个接触区域。 引线框架部分具有沿着接收区域和/或接触区域在其第一侧上的引线框架部分中形成的至少一个沟槽。 引线框架部分嵌入模具化合物中。 模具化合物具有至少一个容纳凹槽，其中布置有第一接收区域和/或接触区域和沟槽。