公开(公告)号：US20240257863A1

公开(公告)日：2024-08-01

申请号：US18584371

申请日：2024-02-22

Applicant: Rambus Inc.

Inventor： Frederick A. Ware ,  Ely K. Tsern ,  John E. Linstadt ,  Thomas A. Giovannini ,  Scott C. Best ,  Kenneth L. Wright

IPC: G11C11/4093 ,  G11C5/02 ,  G11C5/06 ,  G11C7/10 ,  G11C8/12 ,  G11C11/4076 ,  G11C11/408 ,  G11C11/4096 ,  G11C29/00 ,  H01L23/00 ,  H01L25/065 ,  H01L25/10 ,  H01L25/18

CPC classification number: G11C11/4093 ,  G11C5/025 ,  G11C5/063 ,  G11C11/4076 ,  G11C11/408 ,  G11C11/4096 ,  G11C29/824 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/18 ,  G11C7/10 ,  G11C7/1012 ,  G11C7/1066 ,  G11C7/1093 ,  G11C8/12 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1436 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181

Abstract: A memory system includes dynamic random-access memory (DRAM) components that include interconnected and redundant component data interfaces. The redundant interfaces facilitate memory interconnect topologies that accommodate considerably more DRAM components per memory channel than do traditional memory systems, and thus offer considerably more memory capacity per channel, without concomitant reductions in signaling speeds. Each DRAM component includes multiplexers that allow either of the data interfaces to write data to or read data from a common set of memory banks, and to selectively relay write and read data to and from other components, bypassing the local banks. Delay elements can impose selected read/write delays to align read and write transactions from and to disparate DRAM components.

公开(公告)号：US11990177B2

公开(公告)日：2024-05-21

申请号：US18195877

申请日：2023-05-10

Applicant: Rambus Inc.

Inventor： Scott C. Best ,  Ming Li

IPC: G11C5/02 ,  G11C5/04 ,  G11C11/406 ,  G11C11/4093 ,  G11C11/4096 ,  H01L23/48 ,  H01L25/065 ,  H01L25/10 ,  H01L25/18 ,  H01L23/00

CPC classification number: G11C11/4093 ,  G11C5/02 ,  G11C5/025 ,  G11C5/04 ,  G11C11/406 ,  G11C11/4096 ,  H01L23/481 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/18 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01055 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/3011 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/15311 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/0401 ,  H01L2924/00011 ,  H01L2224/0401

Abstract: A memory is disclosed that includes a logic die having first and second memory interface circuits. A first memory die is stacked with the logic die, and includes first and second memory arrays. The first memory array couples to the first memory interface circuit. The second memory array couples to the second interface circuit. A second memory die is stacked with the logic die and the first memory die. The second memory die includes third and fourth memory arrays. The third memory array couples to the first memory interface circuit. The fourth memory array couples to the second memory interface circuit. Accesses to the first and third memory arrays are carried out independently from accesses to the second and fourth memory arrays.

公开(公告)号：US20240144992A1

公开(公告)日：2024-05-02

申请号：US18511747

申请日：2023-11-16

Applicant: Rambus Inc.

Inventor： Frederick A Ware ,  Suresh Rajan ,  Scott C. Best

IPC: G11C11/408 ,  G06F12/06 ,  G06F13/16 ,  G11C5/04 ,  G11C7/10 ,  G11C11/4093

CPC classification number: G11C11/4082 ,  G06F12/06 ,  G06F13/1673 ,  G06F13/1684 ,  G11C5/04 ,  G11C7/1051 ,  G11C7/1078 ,  G11C11/4093 ,  G11C7/22

Abstract: The embodiments described herein describe technologies for using the memory modules in different modes of operation, such as in a standard multi-drop mode or as in a dynamic point-to-point (DPP) mode (also referred to herein as an enhanced mode). The memory modules can also be inserted in the sockets of the memory system in different configurations.

公开(公告)号：US11953981B2

公开(公告)日：2024-04-09

申请号：US18092556

申请日：2023-01-03

Applicant: Rambus Inc.

Inventor： Thomas J. Giovannini ,  Catherine Chen ,  Scott C. Best ,  John Eric Linstadt ,  Frederick A. Ware

IPC: G06F11/07 ,  G06F13/00 ,  G11C5/04 ,  G11C7/20 ,  G11C8/12 ,  G11C29/26 ,  G11C29/44

CPC classification number: G06F11/079 ,  G06F11/073 ,  G06F11/0772 ,  G06F13/00 ,  G11C5/04 ,  G11C7/20 ,  G11C8/12 ,  G11C29/26 ,  G11C29/44

Abstract: During system initialization, each data buffer device and/or memory device on a memory module is configured with a unique (at least to the module) device identification number. In order to access a single device (rather than multiple buffers and/or memory devices), a target identification number is written to all of the devices using a command bus connected to all of the data buffer devices or memory devices, respectively. The devices whose respective device identification numbers do not match the target identification number are configured to ignore future command bus transactions (at least until the debug mode is turned off.) The selected device that is configured with a device identification number matching the target identification number is configured to respond to command bus transactions.

公开(公告)号：US20240104037A1

公开(公告)日：2024-03-28

申请号：US18216543

申请日：2023-06-29

Applicant: Rambus Inc.

Inventor： Scott C. Best

IPC: G06F13/362 ,  G06F13/40 ,  G11C11/408 ,  G11C11/409 ,  G11C11/4096 ,  G11C14/00 ,  G11C16/10 ,  G11C16/26 ,  H01L23/00 ,  H01L23/48 ,  H01L23/50 ,  H01L23/60 ,  H01L25/065 ,  H01L27/02

CPC classification number: G06F13/362 ,  G06F13/4068 ,  G11C11/408 ,  G11C11/409 ,  G11C11/4096 ,  G11C14/0018 ,  G11C16/10 ,  G11C16/26 ,  H01L23/481 ,  H01L23/50 ,  H01L23/60 ,  H01L24/09 ,  H01L25/0652 ,  H01L25/0657 ,  H01L27/0248 ,  H01L23/48 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/08145 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06503 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/1436 ,  H01L2924/15311

Abstract: This application is directed to a stacked semiconductor device assembly including a plurality of identical stacked integrated circuit (IC) devices. Each IC device further includes a master interface, a channel master circuit, a slave interface, a channel slave circuit, a memory core, and a modal pad configured to receive a selection signal for the IC device to communicate data using one of its channel master circuit or its channel slave circuit. In some implementations, the IC devices include a first IC device and one or more second IC devices. In accordance with the selection signal, the first IC device is configured to communicate read/write data via the channel master circuit of the first IC device, and each of the one or more second IC devices is configured to communicate respective read/write data via the channel slave circuit of the respective second IC device.

公开(公告)号：US11875870B2

公开(公告)日：2024-01-16

申请号：US17668606

申请日：2022-02-10

Applicant: Rambus Inc.

Inventor： Scott C. Best ,  John W. Poulton

IPC: G11C5/06 ,  G11C5/14 ,  H04L25/02 ,  G06F13/40 ,  H04L1/20 ,  H04L25/08 ,  G06F11/07

CPC classification number: G11C5/144 ,  G06F11/076 ,  G06F11/0727 ,  G06F11/0793 ,  G06F13/4072 ,  G11C5/145 ,  H04L1/203 ,  H04L25/0264 ,  H04L25/08

Abstract: In a data transmission system, one or more signal supply voltages for generating the signaling voltage of a signal to be transmitted are generated in a first circuit and forwarded from the first circuit to a second circuit. The second circuit may use the forwarded signal supply voltages to generate another signal to be transmitted back from the second circuit to the first circuit, thereby obviating the need to generate signal supply voltages separately in the second circuit. The first circuit may also adjust the signal supply voltages based on the signal transmitted back from the second circuit to the first circuit. The data transmission system may employ a single-ended signaling system in which the signaling voltage is referenced to a reference voltage that is a power supply voltage such as ground, shared by the first circuit and the second circuit.

公开(公告)号：US11568919B2

公开(公告)日：2023-01-31

申请号：US17334170

申请日：2021-05-28

Applicant: Rambus Inc.

Inventor： Frederick A. Ware ,  Suresh Rajan ,  Scott C. Best

IPC: G11C11/408 ,  G11C5/04 ,  G11C11/4093 ,  G06F12/06 ,  G06F13/16 ,  G11C7/10 ,  G11C7/22 ,  G11C11/4076

Abstract: The embodiments described herein describe technologies for using the memory modules in different modes of operation, such as in a standard multi-drop mode or as in a dynamic point-to-point (DPP) mode (also referred to herein as an enhanced mode). The memory modules can also be inserted in the sockets of the memory system in different configurations.

公开(公告)号：US11527302B2

公开(公告)日：2022-12-13

申请号：US17368018

申请日：2021-07-06

Applicant: Rambus Inc.

Inventor： Scott C. Best ,  John Eric Linstadt ,  Paul William Roukema

IPC: G11C29/00 ,  G11C29/44 ,  G11C5/04 ,  G11C11/401 ,  G11C29/02 ,  G11C29/52

Abstract: A buffer circuit is disclosed. The buffer circuit includes a command address (C/A) interface to receive an incoming activate (ACT) command and an incoming column address strobe (CAS) command. A first match circuit includes first storage to store failure row address information associated with the memory, and first compare logic. The first compare logic is responsive to the ACT command, to compare incoming row address information to the stored failure row address information. A second match circuit includes second storage to store failure column address information associated with the memory, and second compare logic. The second compare logic is responsive to the CAS command, to compare the incoming column address information to the stored failure column address information. Gating logic maintains a state of a matching row address identified by the first compare logic during the comparison carried out by the second compare logic.

公开(公告)号：US20220318172A1

公开(公告)日：2022-10-06

申请号：US17718168

申请日：2022-04-11

Applicant: Rambus Inc.

Inventor： Scott C. Best

IPC: G06F13/362 ,  H01L23/48 ,  H01L23/60 ,  H01L25/065 ,  G11C11/408 ,  G11C11/409 ,  H01L23/50 ,  H01L23/00 ,  G06F13/40 ,  G11C11/4096 ,  G11C14/00 ,  G11C16/10 ,  G11C16/26 ,  H01L27/02

Abstract: This application is directed to a stacked semiconductor device assembly including a plurality of identical stacked integrated circuit (IC) devices. Each IC device further includes a master interface, a channel master circuit, a slave interface, a channel slave circuit, a memory core, and a modal pad configured to receive a selection signal for the IC device to communicate data using one of its channel master circuit or its channel slave circuit. In some implementations, the IC devices include a first IC device and one or more second IC devices. In accordance with the selection signal, the first IC device is configured to communicate read/write data via the channel master circuit of the first IC device, and each of the one or more second IC devices is configured to communicate respective read/write data via the channel slave circuit of the respective second IC device.

公开(公告)号：US11282549B2

公开(公告)日：2022-03-22

申请号：US17068505

申请日：2020-10-12

Applicant: Rambus Inc.

Inventor： Scott C. Best ,  John W. Poulton

IPC: G11C5/06 ,  G11C5/14 ,  H04L25/02 ,  G06F13/40 ,  H04L1/20 ,  H04L25/08 ,  G06F11/07

Abstract: In a data transmission system, one or more signal supply voltages for generating the signaling voltage of a signal to be transmitted are generated in a first circuit and forwarded from the first circuit to a second circuit. The second circuit may use the forwarded signal supply voltages to generate another signal to be transmitted back from the second circuit to the first circuit, thereby obviating the need to generate signal supply voltages separately in the second circuit. The first circuit may also adjust the signal supply voltages based on the signal transmitted back from the second circuit to the first circuit. The data transmission system may employ a single-ended signaling system in which the signaling voltage is referenced to a reference voltage that is a power supply voltage such as ground, shared by the first circuit and the second circuit.