公开(公告)号：US20180287021A1

公开(公告)日：2018-10-04

申请号：US15823325

申请日：2017-11-27

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon Chae ,  Jong Min Jang ,  Won Young Roh ,  Dae Woong Suh ,  Min Woo Kang ,  Joon Sub Lee ,  Hyun A. Kim ,  Kyoung Wan Kim ,  Chang Yeon Kim

IPC: H01L33/50 ,  H01L33/46 ,  H01L33/38 ,  H01L33/40 ,  H01L33/62 ,  H01L33/20 ,  H01L33/44 ,  H01L33/32

CPC classification number: H01L33/508 ,  H01L33/20 ,  H01L33/32 ,  H01L33/385 ,  H01L33/405 ,  H01L33/44 ,  H01L33/46 ,  H01L33/502 ,  H01L33/62 ,  H01L2224/16 ,  H01L2933/0016

Abstract: An LED is provided to include: a first conductive type semiconductor layer; an active layer positioned over the first conductive type semiconductor layer; a second conductive type semiconductor layer positioned over the active layer; and a defect blocking layer comprising a masking region to cover at least a part of the top surface of the second conductive semiconductor layer and an opening region to partially expose the top surface of the second conductive type semiconductor layer, wherein the active layer and the second conductive type semiconductor layer are disposed to expose a part of the first conductive type semiconductor layer, and wherein the defect blocking layer comprises a first region and a second region surrounding the first region, and a ratio of the area of the opening region to the area of the masking region in the first region is different from a ratio of the area of the opening region to the area of the masking region in the second region.

公开(公告)号：US20180254423A1

公开(公告)日：2018-09-06

申请号：US15967410

申请日：2018-04-30

Applicant: Seoul Viosys Co., Ltd.

Inventor： Jong Min Jang ,  Jong Hyeon Chae ,  Dae Woong Suh

IPC: H01L51/50 ,  H01L51/44 ,  H01L33/46 ,  H01L33/44 ,  H01L33/00

CPC classification number: H01L51/504 ,  H01L33/0079 ,  H01L33/20 ,  H01L33/22 ,  H01L33/38 ,  H01L33/44 ,  H01L33/46 ,  H01L33/62 ,  H01L51/442

Abstract: A method of fabricating a light emitting device using a wafer level package process and a light emitting device fabricated by the same are disclosed. The light emitting device has improved heat dissipation to prevent damage by heat, thereby achieving improvement in reliability and luminous efficacy. In addition, the light emitting device has a small difference in coefficient of thermal expansion and thus can reduce stress applied to a light emitting structure to prevent damage to the light emitting structure, thereby achieving improvement in reliability and luminous efficacy.

公开(公告)号：US10069055B2

公开(公告)日：2018-09-04

申请号：US15667599

申请日：2017-08-02

Applicant: Seoul Viosys Co., Ltd.

Inventor： Jong Hyeon Chae ,  So Ra Lee ,  Kyung Hee Ye

IPC: H01L33/36 ,  H01L33/62

Abstract: A light emitting device includes a first bonding pad configured to be mounted to a substrate, a first electrode electrically connected to the first bonding pad, a first conductive type semiconductor layer having a middle area disposed between two, opposing end areas, a second conductive type semiconductor layer disposed on the first conductive type semiconductor layer and connected to the first electrode; and a first contact portion and a plurality of second contact portions disposed on the first conductive type semiconductor layer, in which the first contact portion is disposed adjacent one end area of the first conductive type semiconductor layer, the second contact portions are disposed in the middle area of the first conductive type semiconductor layer, and the first bonding pad exposes at least one of the second contact portion.

公开(公告)号：US10069040B2

公开(公告)日：2018-09-04

申请号：US15470836

申请日：2017-03-27

Applicant: Seoul Viosys Co., Ltd.

Inventor： Jong Hyeon Chae

IPC: H01L33/46 ,  H01L33/40 ,  H01L33/38 ,  H01L33/42 ,  H01L33/54 ,  H01L33/56 ,  H01L33/20

Abstract: Exemplary embodiments provide a light emitting diode that includes: at least one lower electrode providing a passage for electric current; a light emitting structure placed over the at least one lower electrode to be electrically connected to the lower electrode, the light emitting structure is disposed to form at least one via-hole; a reflective electrode layer placed between the at least one lower electrode and the light emitting structure; and an electrode pattern formed around the light emitting structure and electrically connecting the lower electrode to the light emitting structure through the via-hole.

公开(公告)号：US10062810B2

公开(公告)日：2018-08-28

申请号：US15860599

申请日：2018-01-02

Applicant: Seoul Viosys Co., Ltd.

Inventor： Jong Hyeon Chae ,  Joon Sup Lee ,  Daewoong Suh ,  Won Young Roh ,  Min Woo Kang ,  Jong Min Jang

IPC: H01L27/15 ,  H01L29/22 ,  H01L21/00 ,  H01L33/24 ,  H01L33/46 ,  H01L33/50 ,  H01L33/60 ,  H01L33/40

CPC classification number: H01L33/24 ,  H01L25/167 ,  H01L27/156 ,  H01L33/0075 ,  H01L33/14 ,  H01L33/38 ,  H01L33/405 ,  H01L33/44 ,  H01L33/46 ,  H01L33/50 ,  H01L33/505 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16 ,  H01L2933/0016 ,  H01L2933/0025

Abstract: Described are a light emitting diode and a light emitting diode module. The light emitting diode module includes a printed circuit board and a light emitting diode joined thereto through a solder paste. The light emitting diode includes a first electrode pad electrically connected to a first conductive type semiconductor layer and a second electrode pad connected to a second conductive type semiconductor layer, wherein each of the first electrode pad and the second electrode pad includes at least five pairs of Ti/Ni layers or at least five pairs of Ti/Cr layers and the uppermost layer of Au. Thus a metal element such as Sn in the solder paste is prevented from diffusion so as to provide a reliable light emitting diode module.

公开(公告)号：US20180233645A1

公开(公告)日：2018-08-16

申请号：US15954465

申请日：2018-04-16

Applicant: Seoul Viosys Co., Ltd.

Inventor： Jong Hyeon Chae ,  Chang Yeon Kim ,  Sung Su Son ,  Dae Woong Suh

IPC: H01L33/62 ,  H01L33/46 ,  H01L33/38

CPC classification number: H01L33/62 ,  H01L33/38 ,  H01L33/44 ,  H01L33/46 ,  H01L2224/48091 ,  H01L2224/73104 ,  H01L2924/00014

Abstract: Disclosed herein is a light emitting device manufactured by separating a growth substrate in a wafer level. The light emitting device includes: a base; a light emitting structure disposed on the base; and a plurality of second contact electrodes disposed between the base and the light emitting structure, wherein the base includes at least two bulk electrodes electrically connected to the light emitting structure and an insulation support disposed between the bulk electrodes and enclosing the bulk electrodes, the insulation support and the bulk electrodes each including concave parts and convex parts engaged with each other on surfaces facing each other, and the convex parts including a section in which a width thereof is changed in a protrusion direction.

公开(公告)号：US09997673B2

公开(公告)日：2018-06-12

申请号：US15685888

申请日：2017-08-24

Applicant: Seoul Viosys Co., Ltd.

Inventor： Jong Hyeon Chae ,  Jong Min Jang ,  Won Young Roh ,  Dae Woong Suh ,  Min Woo Kang ,  Joon Sub Lee ,  Hyun A Kim

IPC: H01L33/40 ,  H01L33/38 ,  H01L33/32 ,  H01L33/00 ,  H01L33/06 ,  H01L33/12 ,  H01L33/62 ,  H01L33/60 ,  H01L33/48 ,  H01L33/46 ,  H01L33/44 ,  H01L33/20

CPC classification number: H01L33/405 ,  H01L33/005 ,  H01L33/007 ,  H01L33/06 ,  H01L33/12 ,  H01L33/20 ,  H01L33/32 ,  H01L33/38 ,  H01L33/382 ,  H01L33/40 ,  H01L33/44 ,  H01L33/46 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A light emitting diode (LED) includes a substrate, a first semiconductor layer disposed on the substrate, an active layer disposed on the first semiconductor layer, a second semiconductor layer disposed on the active layer, a first conductive layer disposed on a portion of the second semiconductor layer, a second conductive layer disposed on the second semiconductor layer, and an insulation layer including a first insulating layer and a second insulating layer disposed on the first insulating layer, and overlapping the first semiconductor layer, the second semiconductor layer, and the second conductive layer, in which the insulation layer has a first region having different thicknesses and a second region having a substantially constant thickness.

公开(公告)号：US09768367B2

公开(公告)日：2017-09-19

申请号：US15140155

申请日：2016-04-27

Applicant: Seoul Viosys Co., Ltd.

Inventor： Jong Hyeon Chae ,  So Ra Lee ,  Kyung Hee Ye

IPC: H01L33/38 ,  H01L33/62 ,  H01L33/08

CPC classification number: H01L33/62 ,  H01L33/08 ,  H01L33/36 ,  H01L33/38

Abstract: A light emitting device in which a bonding pad is soldered to a mounting substrate, wherein the bonding pad may be formed in various shapes that can minimize the occurrence of voids during soldering or heat fusion.

公开(公告)号：US20170200864A1

公开(公告)日：2017-07-13

申请号：US15470811

申请日：2017-03-27

Applicant: Seoul Viosys Co., Ltd.

Inventor： Jong Hyeon Chae ,  Joon Sup Lee ,  Won Young Roh ,  Min Woo Kang ,  Jong Min Jang ,  Hyun A. Kim ,  Daewoong Suh

IPC: H01L33/44 ,  H01L33/20 ,  H01L33/08 ,  H01L33/10 ,  H01L33/38 ,  H01L33/24 ,  H01L33/40

CPC classification number: H01L33/44 ,  H01L24/24 ,  H01L25/0753 ,  H01L27/153 ,  H01L33/08 ,  H01L33/10 ,  H01L33/14 ,  H01L33/20 ,  H01L33/24 ,  H01L33/38 ,  H01L33/405 ,  H01L33/54 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/00

Abstract: A light-emitting diode is provided to include: a transparent substrate having a first surface, a second surface, and a side surface; a first conductive semiconductor layer positioned on the first surface of the transparent substrate; a second conductive semiconductor layer positioned on the first conductive semiconductor layer; an active layer positioned between the first conductive semiconductor layer and the second conductive semiconductor layer; a first pad electrically connected to the first conductive semiconductor layer; and a second pad electrically connected to the second conductive semiconductor layer, wherein the transparent substrate is configured to discharge light generated by the active layer through the second surface of the transparent substrate, and the light-emitting diode has a beam angle of at least 140 degrees or more. Accordingly, a light-emitting diode suitable for a backlight unit or a surface lighting apparatus can be provided.

公开(公告)号：US09590144B2

公开(公告)日：2017-03-07

申请号：US15139875

申请日：2016-04-27

Applicant: Seoul Viosys Co., Ltd.

Inventor： Jong Hyeon Chae ,  Chung Hoon Lee ,  Daewoong Suh ,  Jong Min Jang ,  Joon Sup Lee ,  Won Young Roh ,  Min Woo Kang ,  Hyun A Kim ,  Seon Min Bae

IPC: H01L27/15 ,  H01L31/12 ,  H01L33/00 ,  H01L33/44 ,  H01L33/08 ,  H01L33/20 ,  H01L33/38 ,  H01L33/40

CPC classification number: H01L33/44 ,  H01L27/153 ,  H01L33/005 ,  H01L33/007 ,  H01L33/08 ,  H01L33/20 ,  H01L33/387 ,  H01L33/405 ,  H01L2933/0025

Abstract: A light emitting device including a light emitting structure disposed on one surface of a substrate and a transflective portion disposed on the other surface of the substrate. The transflective portion and the substrate have different indexes of refraction from one another.

Abstract translation: 一种发光器件，包括设置在衬底的一个表面上的发光结构和设置在衬底的另一表面上的半透反射部分。 半透反射部分和基底具有不同的折射率。