公开(公告)号：US20090025967A1

公开(公告)日：2009-01-29

申请号：US12175375

申请日：2008-07-17

申请人： Monnir Boureghda ,  Nitin Desai ,  Anna Lifton ,  Oscar Khaselev ,  Michael T. Marczi ,  Bawa Singh

发明人： Monnir Boureghda ,  Nitin Desai ,  Anna Lifton ,  Oscar Khaselev ,  Michael T. Marczi ,  Bawa Singh

IPC分类号： H05K1/09 ,  H05K1/16 ,  H01B1/22 ,  B32B3/10 ,  B05D5/12

CPC分类号： H05K13/0465 ,  B22F1/0062 ,  H01L23/373 ,  H01L24/03 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/0381 ,  H01L2224/2731 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27416 ,  H01L2224/2745 ,  H01L2224/27452 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/2949 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/83075 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83204 ,  H01L2224/8321 ,  H01L2224/83211 ,  H01L2224/83438 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/83907 ,  H01L2224/8393 ,  H01L2224/83931 ,  H01L2224/8584 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/203 ,  H01L2924/3512 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49155 ,  Y10T428/24893 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/00012 ,  H01L2924/01014

摘要： Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.

摘要翻译： 公开了附着方法和使用这些方法制造的装置。 在某些实施例中，该方法包括在衬底上设置封盖的纳米材料，在设置的封盖的纳米材料上设置管芯，干燥所设置的封盖的纳米材料和所设置的管芯，并在300℃的温度下烧结经干燥的设置的管芯和干燥的封盖的纳米材料 ℃以下以将管芯附着到基板上。 还描述了使用这些方法生产的装置。

公开(公告)号：US20080064144A1

公开(公告)日：2008-03-13

申请号：US11935597

申请日：2007-11-06

申请人： Ashay Dani ,  Saikumar Jayaraman ,  Mitesh Patel ,  Vijay Wakharkar

发明人： Ashay Dani ,  Saikumar Jayaraman ,  Mitesh Patel ,  Vijay Wakharkar

IPC分类号： H01L21/64 ,  B22F1/00 ,  B22F3/12 ,  B22F7/08

CPC分类号： H01L23/3737 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29486 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/05599

摘要： A chip package includes a thermal interface material disposed between a die backside and a heat sink. The thermal interface material includes a first metal particle that is covered by a dielectric film. The dielectric film is selected from an inorganic compound of the first metal or an inorganic compound coating of a second metal. The dielectric film diminishes overall heat transfer from the first metal particle in the thermal interface material by a small fraction of total possible heat transfer without the dielectric film. A method of operating the chip includes biasing the chip with the dielectric film in place.

摘要翻译： 芯片封装包括设置在模具背面和散热器之间的热界面材料。 热界面材料包括由电介质膜覆盖的第一金属颗粒。 电介质膜选自第一金属的无机化合物或第二金属的无机化合物涂层。 电介质膜减少热界面材料中的第一金属颗粒的总传热量，而不需要电介质膜的总可能传热的一小部分。 一种操作该芯片的方法包括：将该电介质膜的芯片偏压就位。

公开(公告)号：US20070158823A1

公开(公告)日：2007-07-12

申请号：US11323512

申请日：2005-12-30

申请人： Ashay Dani ,  Anna Prakash ,  Saikumar Jayaraman ,  Mitesh Patel ,  Vijay Wakharkar

发明人： Ashay Dani ,  Anna Prakash ,  Saikumar Jayaraman ,  Mitesh Patel ,  Vijay Wakharkar

IPC分类号： H01L23/34

CPC分类号： H01L23/3737 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29486 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/05599

摘要： A chip package includes a thermal interface material disposed between a die backside and a heat sink. The thermal interface material includes a first metal particle that is covered by a dielectric film. The dielectric film is selected from an inorganic compound of the first metal or an inorganic compound coating of a second metal. The dielectric film diminishes overall heat transfer from the first metal particle in the thermal interface material by a small fraction of total possible heat transfer without the dielectric film. A method of operating the chip includes biasing the chip with the dielectric film in place.

摘要翻译： 芯片封装包括设置在模具背面和散热器之间的热界面材料。 热界面材料包括由电介质膜覆盖的第一金属颗粒。 电介质膜选自第一金属的无机化合物或第二金属的无机化合物涂层。 电介质膜减少热界面材料中的第一金属颗粒的总传热量，而不需要电介质膜的总可能传热的一小部分。 一种操作该芯片的方法包括：将该电介质膜的芯片偏压就位。

公开(公告)号：US20060194425A1

公开(公告)日：2006-08-31

申请号：US11337000

申请日：2006-01-23

申请人： Daijiro Takano ,  Hikaru Fujita

发明人： Daijiro Takano ,  Hikaru Fujita

IPC分类号： H01L21/4763 ,  H01L23/48 ,  H01L21/324

CPC分类号： H05K3/323 ,  C09J9/02 ,  G02F1/13452 ,  H01B1/22 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/293 ,  H01L2224/29355 ,  H01L2224/29399 ,  H01L2224/2949 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/30105 ,  H01R4/04 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0224 ,  H01L2924/00014 ,  H01L2924/00

摘要： Anisotropic conductive adhesive has conductive particles dispersed in adhesive and includes hard particles having conductivity, a resin layer that coats the hard particles and a conductive layer that coats the resin layer. A connection structure electrically connects electrodes to each other with the anisotropic conductive adhesive. A connection method includes the steps of causing the anisotropic conductive to intervene between electrodes, applying pressure to the anisotropic conductive adhesive and allowing the adhesive to be solidified.

公开(公告)号：US20050155706A1

公开(公告)日：2005-07-21

申请号：US11064122

申请日：2005-02-23

申请人： Kazuto Nishida ,  Hidenobu Nishikawa ,  Yoshinori Wada ,  Hiroyuki Otani

发明人： Kazuto Nishida ,  Hidenobu Nishikawa ,  Yoshinori Wada ,  Hiroyuki Otani

IPC分类号： H01L21/60 ,  H05K3/32 ,  C09J5/00 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/31 ,  H01L21/563 ,  H01L23/295 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48624 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/78301 ,  H01L2224/81048 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/81903 ,  H01L2224/83048 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2224/9211 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K3/323 ,  Y10T29/4913 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is connected, the bumps are compressed, and the insulating resin is hardened.

摘要翻译： 芯片通过在位置凸块与板电极之间对准而在电路板上粘合，在芯片和电路板之间插入各向异性导电层。 各向异性导电层是绝缘树脂，导电颗粒和无机填料的混合物。 利用工具，以每个凸起不小于20gf的压力将芯片压在板上，同时连接芯片和板的翘曲，凸起被压缩，绝缘树脂硬化。

公开(公告)号：US5586892A

公开(公告)日：1996-12-24

申请号：US397919

申请日：1995-03-03

申请人： Minoru Sato

发明人： Minoru Sato

IPC分类号： C09J9/02 ,  C09J11/04 ,  H01B1/00 ,  H01B1/20 ,  H01B5/16 ,  H01R4/04 ,  H01R11/01 ,  H05K3/32

CPC分类号： H01R4/04 ,  H05K3/323 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29399 ,  H01L2224/2949 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/07811 ,  H05K2201/0129 ,  H05K2201/0224 ,  H05K2201/0272 ,  H05K2201/10674

摘要： An electrically connecting structure including a first electronic part having a first connecting terminal, a second electronic part having a second connecting terminal which is arranged to face the first connecting terminal of the first electronic part, and an anisotropic conductive adhesive arranged between the first connecting terminal and the second connecting terminal. The anisotropic conductive adhesive includes an insulating adhesive, a plurality of first conductive particles which are covered with an insulating layer, and a plurality of second conductive particles which are not covered with any material. The first conductive particles and the second conductive particles have substantially the same size. Portions of the insulating layer covering the first conductive particles are brought into contact with the first connecting terminal and the second connecting terminal, and are broken away, under a force which is applied to the first connecting terminal and the second connecting terminal, so that the first conductive particles are brought into contact with the first connecting terminal and the second connecting terminal. The second conductive particles are brought into contact with the first connecting terminal and the second connecting terminal under the force which is applied to the first connecting terminal and the second connecting terminal, and the first connecting terminal and the second connecting terminal are electrically connected to each other through the first conductive particles and the second conductive particles.

摘要翻译： 一种电连接结构，包括具有第一连接端子的第一电子部件，具有与第一电子部件的第一连接端子相对的第二连接端子的第二电子部件和布置在第一连接端子之间的各向异性导电粘合剂 和第二连接端子。 各向异性导电粘合剂包括绝缘粘合剂，被绝缘层覆盖的多个第一导电颗粒以及未被任何材料覆盖的多个第二导电颗粒。 第一导电颗粒和第二导电颗粒具有基本上相同的尺寸。 覆盖第一导电颗粒的绝缘层的部分与第一连接端子和第二连接端子接触，并且在施加到第一连接端子和第二连接端子的力的作用下被分离，使得 第一导电粒子与第一连接端子和第二连接端子接触。 在施加到第一连接端子和第二连接端子的力下，第二导电粒子与第一连接端子和第二连接端子接触，第一连接端子和第二连接端子电连接到每个 另一个通过第一导电颗粒和第二导电颗粒。