公开(公告)号：US07829190B2

公开(公告)日：2010-11-09

申请号：US11212071

申请日：2005-08-25

Applicant: Chad A. Cobbley ,  Steve W. Heppler

Inventor： Chad A. Cobbley ,  Steve W. Heppler

IPC: B32B9/00

CPC classification number: H05K3/323 ,  C08K7/16 ,  C08K9/00 ,  C09J5/00 ,  C09J9/02 ,  C09J11/08 ,  C09J2205/11 ,  H01R4/04 ,  H05K3/321 ,  H05K2201/0224 ,  H05K2203/0278 ,  H05K2203/1163 ,  Y10T428/25 ,  Y10T428/263 ,  Y10T428/2982 ,  Y10T428/2989 ,  Y10T428/2991 ,  Y10T428/2998

Abstract: An anisotropic electrically conducting interconnect is disclosed in which an adhesive comprising particles having a breakable coating of at least one electrically nonconductive material is compressed between a first contact and a second contact. Compression to two contacts breaks the breakable coating exposing an electrically conducting material which makes contact with the first and second contacts. The electrically conducting material may be a metal conductor or a two-part reactive conductive resin/catalyst system. Also disclosed are processes for making such electrical interconnects and adhesives for use in making electrical interconnect.

Abstract translation: 公开了一种各向异性导电互连件，其中包含具有至少一种非导电材料的可破坏涂层的颗粒的粘合剂在第一接触和第二接触之间被压缩。 对两个触点的压缩使可破坏的涂层暴露出与第一和第二触点接触的导电材料。 导电材料可以是金属导体或两部分反应性导电树脂/催化剂体系。 还公开了用于制造用于制造电互连的这种电互连和粘合剂的方法。

公开(公告)号：US07655304B2

公开(公告)日：2010-02-02

申请号：US12191710

申请日：2008-08-14

Applicant: Sanyogita Arora ,  Gerard R. Minogue

Inventor： Sanyogita Arora ,  Gerard R. Minogue

IPC: B32B5/16

CPC classification number: B22F1/0062 ,  B22F1/0059 ,  B22F2998/00 ,  B23K35/34 ,  H05K3/3484 ,  H05K2201/0224 ,  H05K2203/0425 ,  H05K2203/105 ,  Y10T428/2991 ,  Y10T428/2998

Abstract: A method for preparing particles to retain a charge such that the particles are rendered electrostatically or electrokinetically mobile. The method involves coating the particles with a coating medium which facilitates attachment of a charge director material, and contacting the particles with the coating medium thereon with a charge director medium to impart a positive or negative charge thereto and thereby render the particles electrostatically or electrokinetically mobile. Electrostatically and electrokinetically mobile particles for use in an electrostatic or electrokinetic deposition process. The particles include a coating medium and a charge director on particle bodies.

Abstract translation: 一种制备颗粒以保持电荷使得颗粒呈静电或电动移动的方法。 该方法包括用涂覆介质涂覆颗粒，该涂层介质有助于附着电荷导向材料，并且使用电荷导向介质将颗粒与涂层介质接触，以向其施加正电荷或负电荷，从而使颗粒静电或电动移动 。 用于静电或电动沉积过程的静电和电动移动颗粒。 颗粒包括涂层介质和颗粒体上的电荷导向器。

公开(公告)号：US20100009179A1

公开(公告)日：2010-01-14

申请号：US12558049

申请日：2009-09-11

Applicant: Takahiro MATSUMOTO ,  Toshiaki Yamada ,  Hirotaka Tsuruya

Inventor： Takahiro MATSUMOTO ,  Toshiaki Yamada ,  Hirotaka Tsuruya

IPC: B32B33/00 ,  B32B5/22 ,  B32B27/04

CPC classification number: H05K1/162 ,  B82Y30/00 ,  C01P2004/64 ,  C01P2006/12 ,  C01P2006/40 ,  C04B35/628 ,  C04B35/62821 ,  C04B2235/3293 ,  C09C1/00 ,  H01B1/08 ,  H01B3/006 ,  H01B3/02 ,  H01B3/10 ,  H01G4/206 ,  H05K2201/0215 ,  H05K2201/0224 ,  H05K2201/0257 ,  Y10T428/268 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2998

Abstract: There are disclosed insulated ultrafine powder comprising electroconductive ultrafine powder which is in the form of sphere, spheroid or acicular each having a minor axis in the range of 1 to 100 nm and an insulating film applied thereto; a process for producing the same which is capable of covering the surfaces of the insulated ultrafine powder with the insulating film having a thickness in the range of 0.3 to 100 nm without causing any clearance or vacancy; and a resin composite material which uses the same. A high dielectric constant of the material is assured by adding a small amount of insulated ultrafine powder wherein an insulating film is applied to the electroconductive ultrafine powder, while maintaining the processability and moldability that are the characteristics inherent in a resin material.

Abstract translation: 公开了包含导电性超细粉末的绝缘超细粉末，其为球状，球状或针状，各具有1〜100nm的短轴和施加于其上的绝缘膜; 其制造方法能够利用厚度在0.3〜100nm范围内的绝缘膜覆盖绝缘超细粉末的表面，而不会产生任何间隙或空位; 和使用该树脂复合材料的树脂复合材料。 通过在保持作为树脂材料中固有的特性的加工性和成型性的同时，通过添加少量绝缘超细粉末来确保材料的高介电常数，其中绝缘膜被施加到导电超细粉末。

公开(公告)号：US07635862B2

公开(公告)日：2009-12-22

申请号：US11337000

申请日：2006-01-23

Applicant: Daijiro Takano ,  Hikaru Fujita

Inventor： Daijiro Takano ,  Hikaru Fujita

IPC: H01L29/04 ,  H01L31/20 ,  H01L31/036 ,  H01L31/0376 ,  H01L31/12

CPC classification number: H05K3/323 ,  C09J9/02 ,  G02F1/13452 ,  H01B1/22 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/293 ,  H01L2224/29355 ,  H01L2224/29399 ,  H01L2224/2949 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/30105 ,  H01R4/04 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0224 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Anisotropic conductive adhesive has conductive particles dispersed in adhesive and includes hard particles having conductivity, a resin layer that coats the hard particles and a conductive layer that coats the resin layer. A connection structure electrically connects electrodes to each other with the anisotropic conductive adhesive. A connection method includes the steps of causing the anisotropic conductive to intervene between electrodes, applying pressure to the anisotropic conductive adhesive and allowing the adhesive to be solidified.

Abstract translation: 各向异性导电粘合剂具有分散在粘合剂中的导电颗粒，并且包括具有导电性的硬颗粒，涂覆硬颗粒的树脂层和涂覆树脂层的导电层。 连接结构通过各向异性导电粘合剂将电极彼此电连接。 连接方法包括使各向异性导电体介于电极之间，向各向异性导电粘合剂施加压力并使粘合剂固化的步骤。

公开(公告)号：US20090250667A1

公开(公告)日：2009-10-08

申请号：US12457484

申请日：2009-06-12

Applicant: Masahiro Furusawa ,  Rumi Shinagawa ,  Toshimi Fukui ,  Junko Nakamoto ,  Kuninori Obata

Inventor： Masahiro Furusawa ,  Rumi Shinagawa ,  Toshimi Fukui ,  Junko Nakamoto ,  Kuninori Obata

IPC: H01B1/02

CPC classification number: H01B1/22 ,  C09D5/24 ,  C23C24/08 ,  C23C26/00 ,  H05K1/097 ,  H05K2201/0224 ,  H05K2203/122 ,  H05K2203/124 ,  Y10T428/31678

Abstract: A metal particle dispersion liquid comprises: a compound including a sulfur atom; metal particles whose diameter ranges from 1 to 100 nm and made of a material including a precious metal material; and a dispersion medium. The metal particles is covered by the compound.

公开(公告)号：US20090176013A1

公开(公告)日：2009-07-09

申请号：US12314853

申请日：2008-12-17

Applicant: Jung-Ho Park ,  Joon-Hyung Kim

Inventor： Jung-Ho Park ,  Joon-Hyung Kim

IPC: B05D5/12 ,  B05D5/00 ,  C08K5/05 ,  C08K5/17

CPC classification number: H01B1/22 ,  C08K3/08 ,  C08K3/22 ,  C08K9/08 ,  C09D7/62 ,  C09D11/322 ,  C09D11/36 ,  C09D11/52 ,  H05K1/097 ,  H05K2201/0224

Abstract: The present invention relates to a metal ink that comprises metal nano particles that are capped by a capping material; and an organic solvent that has a solubility parameter for swelling the capping material. In addition, the present invention relates to a method for producing a metal wire, which comprises the steps of jetting the metal ink by using an ink-jet nozzle, drying the metal ink, and firing the metal ink.

Abstract translation: 本发明涉及一种金属墨水，其包含被封盖材料覆盖的金属纳米颗粒; 以及具有使封盖材料膨胀的溶解度参数的有机溶剂。 另外，本发明涉及一种金属丝的制造方法，其特征在于，包括以下步骤：使用喷墨喷嘴喷射金属油墨，干燥金属油墨，并对金属油墨进行烧制。

公开(公告)号：US07413452B2

公开(公告)日：2008-08-19

申请号：US10969845

申请日：2004-10-22

Applicant: Young-Chul Jeong ,  Eun-Gon Kim ,  Ki-Jung Kim

Inventor： Young-Chul Jeong ,  Eun-Gon Kim ,  Ki-Jung Kim

IPC: H01R4/58

CPC classification number: H01R12/62 ,  H01J2211/46 ,  H01R4/04 ,  H05K1/147 ,  H05K3/305 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/0367 ,  H05K2201/10977 ,  H05K2203/1189

Abstract: A plasma display device may include a plasma display panel, a driving circuit portion for driving the plasma display panel, a connecter for electrically connecting electrodes of the plasma display panel with the driving circuit portion, and an interconnecter for electrically connecting the connecter with the plasma display panel. The interconnecter may include an adhesive layer, a plurality of conductive pellets, and a plurality of non-conductive pellets dispersed in the adhesive layer. The conductive pellets may be positioned substantially within a first region where the wiring of the connecter overlaps the electrodes of the plasma display panel. The non-conductive pellets may be positioned substantially at least at a second region other than the first region in the adhesive layer.

Abstract translation: 等离子体显示装置可以包括等离子体显示面板，用于驱动等离子体显示面板的驱动电路部分，用于将等离子体显示面板的电极与驱动电路部分电连接的连接器和用于将连接器与等离子体电连接的互连器 显示面板。 互连器可以包括粘合剂层，多个导电颗粒和分散在粘合剂层中的多个非导电颗粒。 导电颗粒可以位于第一区域中，其中连接器的布线与等离子体显示面板的电极重叠。 非导电性颗粒可以基本上至少位于粘合剂层中除了第一区域之外的第二区域。

公开(公告)号：US20080160183A1

公开(公告)日：2008-07-03

申请号：US11965810

申请日：2007-12-28

Applicant: Eiichi Ide ,  Toshiaki Morita ,  Yusuke Yasuda ,  Hiroshi Hozoji

Inventor： Eiichi Ide ,  Toshiaki Morita ,  Yusuke Yasuda ,  Hiroshi Hozoji

IPC: H01B1/08 ,  B05D5/12 ,  B22F7/04

CPC classification number: H01B1/02 ,  B22F7/04 ,  H01B1/08 ,  H01L23/3735 ,  H01L23/3737 ,  H01L24/29 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/27334 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29369 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/8484 ,  H01L2224/85205 ,  H01L2224/8584 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/2076 ,  H05K1/097 ,  H05K3/321 ,  H05K2201/0224 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/83205 ,  H01L2924/00012

Abstract: There is provided a conductive sintered layer forming composition and a conductive sintered layer forming method that can lower heating temperature and shorten heating time for a process of accelerating sintering or bonding by sintering of metal nano-particles coated with an organic substance. The conductive sintered layer forming composition may be obtained by utilizing a phenomenon that particles may be sintered at low temperature by mixing silver oxide with metal particles coated with the organic substance and having a grain size of 1 nm to 5 μm as compared to sintering each simple substance. The conductive sintered layer forming composition of the invention is characterized in that it contains the metal particles whose surface is coated with the organic substance and whose grain size is 1 nm to 5 μm and the silver oxide particles.

Abstract translation: 提供一种导电烧结层形成组合物和导电烧结层形成方法，其可以通过烧结具有有机物质的金属纳米颗粒的烧结来加速烧结或接合的过程，从而降低加热温度并缩短加热时间。 形成导电烧结层的组合物可以通过利用颗粒可以通过将氧化银与涂覆有机物质的金属颗粒混合并且与烧结相比具有1nm至5μm的颗粒尺寸而在低温下烧结的现象获得 物质。 本发明的导电性烧结层形成用组合物的特征在于，其含有表面被有机物质覆盖，粒径为1nm〜5μm的金属粒子和氧化银粒子。

公开(公告)号：US07326316B2

公开(公告)日：2008-02-05

申请号：US10873552

申请日：2004-06-22

Applicant: Chad A. Cobbley ,  Steve W. Heppler

Inventor： Chad A. Cobbley ,  Steve W. Heppler

IPC: C09J163/00

CPC classification number: H05K3/323 ,  C08K7/16 ,  C08K9/00 ,  C09J5/00 ,  C09J9/02 ,  C09J11/08 ,  C09J2205/11 ,  H01R4/04 ,  H05K3/321 ,  H05K2201/0224 ,  H05K2203/0278 ,  H05K2203/1163 ,  Y10T428/25 ,  Y10T428/263 ,  Y10T428/2982 ,  Y10T428/2989 ,  Y10T428/2991 ,  Y10T428/2998

Abstract: An anisotropic electrically conducting interconnect is disclosed in which an adhesive comprising particles having a breakable coating of at feast one electrically nonconductive material is compressed between a first contact and a second contact. Compression to two contacts breaks the breakable coating exposing an electrically conducting material which makes contact with the first and second contacts. The electrically conducting material may be a metal conductor or a two-part reactive conductive resin/catalyst system. Also disclosed are processes for making such electrical interconnects and adhesives for use in making electrical interconnect.

Abstract translation: 公开了一种各向异性导电互连件，其中包含具有至少一种非导电材料的可破坏涂层的颗粒的粘合剂在第一接触和第二接触之间被压缩。 对两个触点的压缩使可破坏的涂层暴露出与第一和第二触点接触的导电材料。 导电材料可以是金属导体或两部分反应性导电树脂/催化剂体系。 还公开了用于制造用于制造电互连的这种电互连和粘合剂的方法。

公开(公告)号：US07220785B2

公开(公告)日：2007-05-22

申请号：US10812037

申请日：2004-03-30

Applicant: Atsushi Saito

Inventor： Atsushi Saito

IPC: B01F3/12 ,  B32B5/16 ,  B32B7/12 ,  B32B15/04

CPC classification number: H01L24/83 ,  C08G59/18 ,  C08L63/00 ,  C09J9/02 ,  H01L24/29 ,  H01L2224/04026 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29494 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/323 ,  H05K2201/0224 ,  H05K2201/10674 ,  H05K2203/1163 ,  Y10T428/256 ,  Y10T428/2857 ,  Y10T428/2984 ,  Y10T428/2985 ,  Y10T428/2998 ,  H01L2924/00 ,  H01L2224/05599

Abstract: This invention provides a mounting method for reliably connecting mounting components electrically. Specifically, an anisotropically conductive adhesive can be composed of crushable microcapsules and a second liquid in which the microcapsules are dispersed. Each microcapsule encloses a first liquid and a conductive particle. The first liquid can react with the second liquid at normal temperatures to cure the second liquid. This anisotropically conductive adhesive can be applied on a flexible printed circuit (FPC). Then, a drive IC is mounted and pressed on the FPC to crush the microcapsules between electrode pads provided on the drive IC and electrode pads provided on the FPC, thereby bonding the electrode pads. Subsequently, the anisotropically conductive adhesive is heated to plasticize a capsule wall of each microcapsule, thereby bonding the drive IC and the FPC.

Abstract translation: 本发明提供一种用于可靠地连接安装部件的安装方法。 具体地，各向异性导电粘合剂可以由可压碎的微胶囊和微胶囊分散在其中的第二液体组成。 每个微胶囊包围第一液体和导电颗粒。 第一液体可以在常温下与第二液体反应以固化第二液体。 这种各向异性导电粘合剂可以应用在柔性印刷电路（FPC）上。 然后，将驱动IC安装并按压在FPC上以粉碎设置在驱动IC上的电极焊盘和设置在FPC上的电极焊盘之间的微胶囊，从而接合电极焊盘。 随后，各向异性导电粘合剂被加热以使每个微胶囊的胶囊壁塑化，由此粘接驱动IC和FPC。