公开(公告)号：US20150348945A1

公开(公告)日：2015-12-03

申请号：US14821683

申请日：2015-08-07

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach ,  Brian Cronquist ,  Deepak C. Sekar ,  Zeev Wurman ,  Israel Beinglass

IPC: H01L25/065 ,  H01L23/532 ,  H01L29/45 ,  H01L27/088 ,  H01L27/06 ,  H01L23/544 ,  H01L23/522

CPC classification number: H01L21/6835 ,  G11C8/16 ,  H01L21/743 ,  H01L21/76254 ,  H01L21/76898 ,  H01L21/8221 ,  H01L21/823828 ,  H01L21/84 ,  H01L23/3677 ,  H01L23/481 ,  H01L23/5252 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L27/0207 ,  H01L27/0688 ,  H01L27/088 ,  H01L27/092 ,  H01L27/10 ,  H01L27/105 ,  H01L27/10802 ,  H01L27/10873 ,  H01L27/10876 ,  H01L27/10894 ,  H01L27/10897 ,  H01L27/11 ,  H01L27/1108 ,  H01L27/112 ,  H01L27/11206 ,  H01L27/11526 ,  H01L27/11529 ,  H01L27/11551 ,  H01L27/11573 ,  H01L27/11578 ,  H01L27/11807 ,  H01L27/11898 ,  H01L27/1203 ,  H01L27/1214 ,  H01L27/1266 ,  H01L29/4236 ,  H01L29/66272 ,  H01L29/66621 ,  H01L29/66825 ,  H01L29/66833 ,  H01L29/66901 ,  H01L29/78 ,  H01L29/7841 ,  H01L29/7843 ,  H01L29/7881 ,  H01L29/792 ,  H01L2221/68368 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83894 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01066 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12033 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/80001

Abstract: A 3D semiconductor device, including: a first layer including first transistors; a first interconnection layer interconnecting the first transistors and overlying the first layer; and a second layer including second transistors, where the second layer thickness is less than 2 microns and greater than 5 nm, where the second layer is overlying the first interconnection layer, and where the second layer includes dice lines formed by an etch step.

Abstract translation: 一种3D半导体器件，包括：包括第一晶体管的第一层; 互连第一晶体管并覆盖第一层的第一互连层; 以及包括第二晶体管的第二层，其中所述第二层厚度小于2微米且大于5nm，其中所述第二层覆盖所述第一互连层，并且其中所述第二层包括通过蚀刻步骤形成的管芯线。

公开(公告)号：US20150249053A1

公开(公告)日：2015-09-03

申请号：US14626563

申请日：2015-02-19

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach ,  Deepak C. Sekar ,  Brian Cronquist

IPC: H01L23/538 ,  H01L27/088 ,  H01L27/06

CPC classification number: H01L23/5386 ,  H01L27/0688 ,  H01L27/085 ,  H01L27/0886 ,  H01L27/092 ,  H01L27/10802 ,  H01L27/1108 ,  H01L27/11524 ,  H01L27/11551 ,  H01L27/228 ,  H01L27/2436 ,  H01L27/249 ,  H01L45/04 ,  H01L45/06 ,  H01L45/085 ,  H01L45/1226 ,  H01L45/1233 ,  H01L45/145 ,  H01L45/146 ,  H01L45/1675 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/00

Abstract: A semiconductor device including: a first layer including first transistors including at least one first monocrystalline silicon transistor channel; a second layer including second transistors including at least one second monocrystalline non-silicon transistor channel; a plurality of connection paths extending from the second transistors to the first transistors, where at least one of the connection paths includes at least one through layer via with a diameter of less than 200 nm.

Abstract translation: 一种半导体器件，包括：包括第一晶体管的第一层，所述第一晶体管包括至少一个第一单晶硅晶体管沟道; 第二层，包括包括至少一个第二单晶非硅晶体管沟道的第二晶体管; 从第二晶体管延伸到第一晶体管的多个连接路径，其中至少一个连接路径包括直径小于200nm的至少一个贯穿层通孔。

公开(公告)号：US09099526B2

公开(公告)日：2015-08-04

申请号：US13251269

申请日：2011-10-02

Applicant: Zvi Or-Bach ,  Deepak C. Sekar ,  Brian Cronquist

Inventor： Zvi Or-Bach ,  Deepak C. Sekar ,  Brian Cronquist

IPC: H01L23/02 ,  H01L21/762 ,  H01L21/683 ,  H01L21/822 ,  H01L21/84 ,  H01L23/48 ,  H01L23/498 ,  H01L23/544 ,  H01L25/065 ,  H01L27/02 ,  H01L27/06 ,  H01L27/12 ,  H01L23/36 ,  H01L23/00

CPC classification number: H01L21/76232 ,  H01L21/6835 ,  H01L21/76254 ,  H01L21/8221 ,  H01L21/84 ,  H01L21/845 ,  H01L23/36 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/544 ,  H01L24/16 ,  H01L24/80 ,  H01L24/94 ,  H01L25/0657 ,  H01L27/0207 ,  H01L27/0688 ,  H01L27/1203 ,  H01L27/1211 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2223/54426 ,  H01L2224/80006 ,  H01L2224/80009 ,  H01L2224/80047 ,  H01L2224/802 ,  H01L2224/80896 ,  H01L2224/9202 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01066 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/00

Abstract: A device, including: an integrated circuit chip, where the integrated circuit chip includes: a first layer including a plurality of first transistors including a mono-crystal channel; at least one metal layer overlying the first layer, the at least one metal layer including aluminum or copper and providing interconnection between the first transistors; a second layer overlying the at least one metal layer, the second layer including second horizontally oriented transistors including a second mono-crystal channel; and a through the second layer via of diameter less than 150 nm, where the second horizontally oriented transistors are interconnected to form logic circuits.

Abstract translation: 一种器件，包括：集成电路芯片，其中所述集成电路芯片包括：包括多个第一晶体管的第一层，所述第一晶体管包括单晶通道; 覆盖在第一层上的至少一个金属层，所述至少一个金属层包括铝或铜并提供第一晶体管之间的互连; 覆盖所述至少一个金属层的第二层，所述第二层包括包括第二单晶通道的第二水平取向晶体管; 以及通过直径小于150nm的第二层通孔，其中第二水平取向晶体管互连以形成逻辑电路。

公开(公告)号：US20150205903A1

公开(公告)日：2015-07-23

申请号：US14672202

申请日：2015-03-29

Applicant: MONOLITHIC 3D INC.

Inventor： Zvi Or-Bach ,  Zeev Wurman

IPC: G06F17/50

CPC classification number: G06F17/5072 ,  G06F17/5077

Abstract: A method of designing a 3D Integrated Circuit, the method including: performing partitioning to at least a first strata and a second strata; then performing a first placement of the first strata using a 2D placer executed by a computer, where the 2D placer is a Computer Aided Design (CAD) tool currently used in the industry for two-dimensional devices; and performing a second placement of the second strata based on the first placement, where the partitioning includes a partition between logic and memory, and where the logic includes at least one decoder representation for the memory.

Abstract translation: 一种设计3D集成电路的方法，所述方法包括：对至少第一层和第二层进行划分; 然后使用由计算机执行的2D放样器来执行第一层的第一放置，其中2D贴片是当前在工业中用于二维器件的计算机辅助设计（CAD）工具; 以及基于所述第一布置执行所述第二层的第二布置，其中所述分区包括逻辑和存储器之间的分区，以及所述逻辑包括用于所述存储器的至少一个解码器表示。

公开(公告)号：US09030858B2

公开(公告)日：2015-05-12

申请号：US13624968

申请日：2012-09-23

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach ,  Deepak Sekar ,  Brian Cronquist ,  Paul Lim

IPC: G11C11/34 ,  H01L27/108 ,  G11C5/02 ,  G11C5/06 ,  H01L27/06 ,  H01L29/78 ,  G11C11/406 ,  H01L23/00 ,  H01L27/02

CPC classification number: H01L27/10873 ,  G11C5/025 ,  G11C5/063 ,  G11C11/406 ,  G11C2211/4016 ,  H01L24/16 ,  H01L24/94 ,  H01L27/0203 ,  H01L27/0688 ,  H01L27/10802 ,  H01L27/10894 ,  H01L27/10897 ,  H01L29/7841 ,  H01L29/785 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/12033 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2224/81 ,  H01L2924/00

Abstract: A semiconductor device, including: a first semiconductor layer including first transistors, wherein the first transistors are interconnected by at least one metal layer including aluminum or copper; and a second mono-crystallized semiconductor layer including second transistors and overlaying the at least one metal layer, wherein the at least one metal layer is in-between the first semiconductor layer and the second mono-crystallized semiconductor layer, wherein the second mono-crystallized semiconductor layer is less than 100 nm in thickness, and wherein the second transistors include horizontally oriented transistors.

Abstract translation: 一种半导体器件，包括：包括第一晶体管的第一半导体层，其中所述第一晶体管通过包括铝或铜的至少一个金属层互连; 以及包括第二晶体管并覆盖所述至少一个金属层的第二单结晶半导体层，其中所述至少一个金属层位于所述第一半导体层和所述第二单结晶半导体层之间，其中所述第二单结晶半导体层 半导体层的厚度小于100nm，其中第二晶体管包括水平取向的晶体管。

公开(公告)号：US09021414B1

公开(公告)日：2015-04-28

申请号：US13862537

申请日：2013-04-15

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach ,  Zeev Wurman

IPC: G06F17/50

CPC classification number: G06F17/5072 ,  G06F17/5077

Abstract: A method of designing a 3D Integrated Circuit, the method including: performing placement using a 2D placer, performing placement for at least a first strata and a second strata, and then performing routing and completing the physical design of said 3D Integrated Circuit.

Abstract translation: 一种设计3D集成电路的方法，所述方法包括：使用2D放置器执行放置，执行至少第一层和第二层的放置，然后执行路由并完成所述3D集成电路的物理设计。

公开(公告)号：US08993385B1

公开(公告)日：2015-03-31

申请号：US14491489

申请日：2014-09-19

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach ,  Zeev Wurman

IPC: H01L21/84 ,  H01L23/482 ,  H01L21/302 ,  H01L21/268 ,  H01L21/8238 ,  H01L21/8232

CPC classification number: H01L23/4827 ,  H01L21/268 ,  H01L21/302 ,  H01L21/76232 ,  H01L21/76254 ,  H01L21/8221 ,  H01L21/8232 ,  H01L21/8238 ,  H01L21/84 ,  H01L23/481 ,  H01L23/49827 ,  H01L27/0207 ,  H01L27/0688 ,  H01L27/11807 ,  H01L27/1203 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00013 ,  H01L2924/01066 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

Abstract: A method to construct a semiconductor device, the method including: forming a first layer including mono-crystallized semiconductor and first logic circuits; forming a second layer including a mono-crystallized semiconductor layer, the second layer overlying the first logic circuits; forming transistors on the second layer; forming connection paths from the second transistors to the first transistors, where the connection paths include a through layer via of less than 200 nm diameter; and connecting the first logic circuits to an external device using input/output (I/O) circuits, the input/output (I/O) circuits are constructed on the second mono-crystallized semiconductor layer.

Abstract translation: 一种构造半导体器件的方法，所述方法包括：形成包括单结晶半导体的第一层和第一逻辑电路; 形成包括单结晶半导体层的第二层，所述第二层覆盖所述第一逻辑电路; 在第二层上形成晶体管; 形成从第二晶体管到第一晶体管的连接路径，其中连接路径包括直径小于200nm的贯穿层通孔; 并且使用输入/输出（I / O）电路将第一逻辑电路连接到外部设备，所述输入/输出（I / O）电路构造在第二单结晶半导体层上。

公开(公告)号：US08912052B2

公开(公告)日：2014-12-16

申请号：US13355369

申请日：2012-01-20

Applicant: Zvi Or-Bach

Inventor： Zvi Or-Bach

IPC: H01L21/82 ,  H01L21/8226 ,  G11C17/14 ,  H01L21/762 ,  H01L21/822 ,  H01L21/84 ,  H01L23/525 ,  H01L23/544 ,  H01L25/065 ,  H01L25/18 ,  H01L27/02 ,  H01L27/06 ,  H01L27/092 ,  H01L27/105 ,  H01L27/108 ,  H01L27/11 ,  H01L27/112 ,  H01L27/118 ,  H03K17/687 ,  H03K19/0948 ,  H03K19/177 ,  H01L23/00

CPC classification number: H01L27/088 ,  G11C17/14 ,  H01L21/76254 ,  H01L21/8221 ,  H01L21/8226 ,  H01L21/84 ,  H01L23/481 ,  H01L23/5252 ,  H01L23/528 ,  H01L23/53214 ,  H01L23/53228 ,  H01L23/544 ,  H01L24/14 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/18 ,  H01L27/0207 ,  H01L27/0688 ,  H01L27/0694 ,  H01L27/092 ,  H01L27/105 ,  H01L27/10873 ,  H01L27/10876 ,  H01L27/10897 ,  H01L27/11 ,  H01L27/1108 ,  H01L27/112 ,  H01L27/11206 ,  H01L27/11803 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01066 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03K17/687 ,  H03K19/0948 ,  H03K19/177 ,  H01L2924/00 ,  H01L2224/80001 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A semiconductor device, including: a first layer including monocrystalline material and first transistors, the first transistors overlaid by a first isolation layer; a second layer including second transistors and overlaying the first isolation layer, the second transistors including a monocrystalline material; at least one contact to the second transistors, where the at least one contact is aligned to the first transistors with less than about 40 nm alignment error, a first set of external connections underlying the first layer to connect the device to external devices; and a second set of external connections overlying the second layer to connect the device to external devices.

Abstract translation: 一种半导体器件，包括：第一层，包括单晶材料和第一晶体管，所述第一晶体管由第一隔离层覆盖; 包括第二晶体管并覆盖第一隔离层的第二层，第二晶体管包括单晶材料; 至少一个接触到所述第二晶体管，其中所述至少一个触点与所述第一晶体管对准，具有小于约40nm的对准误差;第一组外部连接，位于所述第一层下面以将所述器件连接到外部器件; 以及覆盖第二层以将设备连接到外部设备的第二组外部连接。

公开(公告)号：US08703597B1

公开(公告)日：2014-04-22

申请号：US13869963

申请日：2013-04-25

Applicant: Monolithic 3D Inc.

Inventor： Deepak Sekar ,  Zvi Or-Bach ,  Brian Cronquist

IPC: H01L21/44 ,  H01L21/82 ,  H01L21/822

CPC classification number: H01L21/76898 ,  H01L21/268 ,  H01L21/76254 ,  H01L21/84 ,  H01L23/481 ,  H01L24/05 ,  H01L27/0623 ,  H01L27/0688 ,  H01L27/082 ,  H01L27/088 ,  H01L27/092 ,  H01L27/1203 ,  H01L29/0673 ,  H01L29/66545 ,  H01L29/785 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/15788 ,  H01L2924/16152 ,  H01L2924/351 ,  H01L2924/00

Abstract: A method for fabricating a device, the method including: providing a first layer including first transistors, where the first transistors include a mono-crystalline semiconductor; overlaying a second semiconductor layer over the first layer; fabricating a plurality of memory cell control lines where the control lines include a portion of the second layer; where the second layer includes second transistors, where the second transistors include a mono-crystalline semiconductor, and where the second transistors are configured to be memory cells.

Abstract translation: 一种制造器件的方法，所述方法包括：提供包括第一晶体管的第一层，其中所述第一晶体管包括单晶半导体; 在第一层上覆盖第二半导体层; 制造多个存储单元控制线，其中控制线包括第二层的一部分; 其中第二层包括第二晶体管，其中第二晶体管包括单晶半导体，并且其中第二晶体管被配置为存储单元。

公开(公告)号：US08664042B2

公开(公告)日：2014-03-04

申请号：US13471009

申请日：2012-05-14

Applicant: Zvi Or-Bach ,  Deepak C. Sekar ,  Brian Cronquist ,  Israel Beinglass ,  Jan Lodewijk de Jong

Inventor： Zvi Or-Bach ,  Deepak C. Sekar ,  Brian Cronquist ,  Israel Beinglass ,  Jan Lodewijk de Jong

IPC: H01L21/00

CPC classification number: H01L21/76254 ,  H01L21/8221 ,  H01L21/84 ,  H01L23/36 ,  H01L23/481 ,  H01L24/48 ,  H01L25/0657 ,  H01L27/0688 ,  H01L27/092 ,  H01L27/105 ,  H01L27/11 ,  H01L27/1104 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01066 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3011 ,  H03K19/177 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method to construct configurable systems, the method including: providing a first configurable system including a first die and a second die, where the connections between the first die and the second die include through-silicon-via (“TSV”), where the first die is diced from a first wafer using first dice lines; providing a second configurable system including a third die and a fourth die, where the connections between the third die and the fourth die include through-silicon-via (“TSV”), where the third die is diced from a third wafer using third dice lines; and processing the first wafer and the third wafer utilizing at least 20 masks that are the same; where the first dice lines are substantially different than the third dice lines, and where the second die includes a configurable I/O to connect the first configurable system to external devices.

Abstract translation: 一种构建可配置系统的方法，所述方法包括：提供包括第一管芯和第二管芯的第一可配置系统，其中第一管芯和第二管芯之间的连接包括穿硅通孔（“TSV”），其中 使用第一骰子线从第一晶片切下第一芯片; 提供包括第三管芯和第四管芯的第二可配置系统，其中第三管芯和第四管芯之间的连接包括穿硅通孔（“TSV”），其中使用第三管芯从第三晶片切割第三管芯 线条 以及使用相同的至少20个掩模来处理所述第一晶片和所述第三晶片; 其中第一骰子线与第三骰子线基本上不同，并且其中第二骰子包括用于将第一可配置系统连接到外部装置的可配置I / O。