公开(公告)号：US10032943B2

公开(公告)日：2018-07-24

申请号：US14974643

申请日：2015-12-18

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Steven Lorenz Wright ,  Cornelia Tsang Yang

IPC: H01L31/024 ,  H01L31/18

Abstract: A semiconductor structure includes a thin-film device layer, an optoelectronic device disposed in the thin-film device layer, and a surrogate substrate permanently attached to the thin film device layer. The surrogate substrate is optically transparent and has a thermal conductivity of at least 300 W/m-K. The optoelectronic device excitable by visible light transmitted through the surrogate substrate. A method of fabricating the semiconductor structure includes fabricating the optoelectronic device in a device layer thin-film of SiC on a silicon wafer of a first diameter, transferring the device layer thin-film of SiC from the silicon wafer, and permanently bonding the device layer thin-film to a SiC surrogate substrate of a second diameter.

公开(公告)号：US20180174882A1

公开(公告)日：2018-06-21

申请号：US15900178

申请日：2018-02-20

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Bing Dang ,  Jeffrey D. Gelorme ,  John U. Knickerbocker

IPC: H01L21/683 ,  C09J171/12 ,  C08K3/04 ,  C08L63/00 ,  C09J9/00 ,  C09J163/00 ,  C09J171/00 ,  H01L21/02 ,  C08G59/06

CPC classification number: H01L21/6835 ,  C08G59/063 ,  C08G2650/56 ,  C08K3/04 ,  C08L63/00 ,  C08L71/00 ,  C09J9/00 ,  C09J163/00 ,  C09J171/00 ,  H01L21/02057 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.

公开(公告)号：US20180107090A1

公开(公告)日：2018-04-19

申请号：US15845032

申请日：2017-12-18

Applicant: International Business Machines Corporation

Inventor： Michael S. Gordon ,  John U. Knickerbocker ,  Minhua Lu ,  Robert Polastre

IPC: G02F1/29 ,  G02F1/137 ,  G02F1/1343 ,  G02B3/12

CPC classification number: G02F1/29 ,  G02B3/12 ,  G02F1/13439 ,  G02F1/137

Abstract: A lens structure includes a transparent cell containing a liquid crystal material. The cell is thicker in a center region thereof than at peripheral regions. The structure further includes transparent electrically conductive electrodes coupled with opposing top and bottom surfaces of the cell and configured to establish an electric field through the cell that is strongest at the peripheral regions where the cell is thinner relative to the center region so that a value of the index of refraction of the liquid crystal material changes across the cell from the center region towards the peripheral regions to change an effective focal length of the lens structure. In some embodiments the top surface of the cell has a first curvature C1 and the bottom surface of the cell has a second curvature C2 that differs from the first curvature.

公开(公告)号：US20180103848A1

公开(公告)日：2018-04-19

申请号：US15293267

申请日：2016-10-13

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Emily R. Kinser ,  John U. Knickerbocker ,  Roy R. Yu

IPC: A61B5/00

Abstract: Surface enhanced Raman spectroscopy is employed to obtain chemical data with respect to body tissue and cells. The chemical environments of stimulation implants and drug-delivery catheters are spectroscopically monitored in real time using an implantable probe. The probe includes a surface enhancer that facilitates surface enhanced Raman spectroscopy in opposing relation to an array of optical fibers. Light emitted by the optical fibers can be employed for chemical detection and/or tissue stimulation. Wavelength and optical power are selected based on whether the probe is employed for such detection or stimulation. Fabrication of a probe assembly that enables surface enhanced Raman spectroscopy is further disclosed.

公开(公告)号：US20180103847A1

公开(公告)日：2018-04-19

申请号：US15293261

申请日：2016-10-13

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Emily R. Kinser ,  John U. Knickerbocker ,  Roy R. Yu

IPC: A61B5/00

CPC classification number: A61B5/0075 ,  A61B5/0084 ,  A61B2560/0443

Abstract: Surface enhanced Raman spectroscopy is employed to obtain chemical data with respect to body tissue and cells. The chemical environments of stimulation implants and drug-delivery catheters are spectroscopically monitored in real time using an implantable probe. The probe includes a surface enhancer that facilitates surface enhanced Raman spectroscopy in opposing relation to an array of optical fibers. Light emitted by the optical fibers can be employed for chemical detection and/or tissue stimulation. Wavelength and optical power are selected based on whether the probe is employed for such detection or stimulation.

公开(公告)号：US09941788B2

公开(公告)日：2018-04-10

申请号：US15584513

申请日：2017-05-02

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Leland Chang ,  Evan G. Colgan ,  John U. Knickerbocker ,  Bucknell C. Webb ,  Robert Wisnieff

IPC: H03K3/00 ,  H02M3/156 ,  G06F1/26 ,  H01L25/065 ,  H01L23/64 ,  G05F3/02

CPC classification number: H02M3/156 ,  G05F3/02 ,  G06F1/26 ,  G06F1/263 ,  G06F1/266 ,  H01L23/5286 ,  H01L23/64 ,  H01L23/642 ,  H01L23/645 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L25/065 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19103 ,  H02M1/08 ,  H05K1/00 ,  Y10T29/49117 ,  H01L2224/11 ,  H01L2924/014

Abstract: A switching power supply in an integrated circuit, an integrated circuit comprising a switching power supply, and a method of assembling a switching power supply in an integrated circuit are disclosed. In one embodiment, the invention provides a three-dimensional switching power supply in an integrated circuit comprising a device layer. The switching power supply comprises three distinct strata arranged in series with the device layer, the three distinct strata including a switching layer including switching circuits, a capacitor layer including banks of capacitors, and an inductor layer including inductors. This switching power supply further comprises a multitude of connectors electrically and mechanically connecting together the device layer, the switching layer, the capacitor layer, and the inductor layer. The switching circuits, the capacitors and the inductors form a switching power supply for supplying power to the device layer.

公开(公告)号：US20180069202A1

公开(公告)日：2018-03-08

申请号：US15811231

申请日：2017-11-13

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Bing Dang ,  John U. Knickerbocker ,  Yang Liu ,  Jae-Woong Nah ,  Adinath Narasgond ,  Bucknell C. Webb

IPC: H01M2/02 ,  H01M2/10

CPC classification number: H01M2/0207 ,  H01M2/1061 ,  H01M6/40 ,  H01M10/0436 ,  H01M2220/30

Abstract: A micro-battery is provided in which a metallic sealing layer is used to provide a hermetic seal between an anode side of the micro-battery and the cathode side of the micro-battery. In accordance with the present application, the metallic sealing layer is formed around a perimeter of each metallic anode structure located on the anode side and then the metallic sealing layer is bonded to a solderable metal layer of a wall structure present on the cathode side. The wall structure contains a cavity that exposes a metallic current collector structure, the cavity is filled with battery materials.

公开(公告)号：US09865569B2

公开(公告)日：2018-01-09

申请号：US15137123

申请日：2016-04-25

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Yang Liu ,  Yu Luo ,  Steven L. Wright

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31 ,  H01L21/683 ,  H01L23/50 ,  H01L23/13 ,  H01L21/66 ,  H01L23/48

CPC classification number: H01L25/0657 ,  H01L21/563 ,  H01L21/6835 ,  H01L22/14 ,  H01L22/20 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/3157 ,  H01L23/3178 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49894 ,  H01L23/50 ,  H01L24/11 ,  H01L24/17 ,  H01L24/81 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/11334 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/1701 ,  H01L2224/17104 ,  H01L2224/1712 ,  H01L2224/1751 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06565

Abstract: A structure includes an electrical interconnection between a first substrate including a plurality of protrusions and a second substrate including a plurality of solder bumps, the plurality of protrusions includes sharp tips that penetrate the plurality of solder bumps, and a permanent electrical interconnection is established by physical contact between the plurality of protrusions and the plurality of solder bumps including a metallurgical joint.

公开(公告)号：US09851379B2

公开(公告)日：2017-12-26

申请号：US15469497

申请日：2017-03-25

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Jae-Woong Nah ,  Robert E. Trzcinski ,  Cornelia Kang-I Tsang

IPC: H01L21/8242 ,  G01R3/00 ,  G01R1/04 ,  G01R1/067 ,  H01L21/66

CPC classification number: G01R1/0408 ,  G01R1/06761 ,  G01R3/00 ,  H01L22/30 ,  H01L22/34 ,  H01L23/49838 ,  H01L2224/0401 ,  H01L2224/32145 ,  H01L2224/73265 ,  H01L2924/014

Abstract: A test probe structure having a planar surface and contact locations matched to test hardware is provided. The fabrication of the test probe structure addresses problems related to the possible deformation of base substrates during manufacture. Positional accuracy of contact locations and planarity of base substrates is achieved using dielectric layers, laser ablation, injection molded solder or redistribution layer wiring, and planarization techniques.

公开(公告)号：US09820395B2

公开(公告)日：2017-11-14

申请号：US15212330

申请日：2016-07-18

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Minhua Lu ,  Jae-Woong Nah ,  Robert John Polastre

IPC: H01L23/15 ,  H05K5/00 ,  H05K5/02 ,  H05K5/04

CPC classification number: H05K5/0095 ,  H01L21/486 ,  H01L23/15 ,  H01L23/3121 ,  H05K5/0247 ,  H05K5/04

Abstract: A hermetically sealed electronic device and method of fabrication are provided. A base layer of a wafer is created using a substrate formed from ultra-thin glass or ceramic using panel or roll to roll processing. One or more layers are bonded to the base layer. The wafer is singulated into a plurality of electronic devices having a top surface and a plurality of sides. A hermetic sealant is applied to each electronic device to completely encase the top surface and the sides while bonding to the base layer. At least one of the layers is a metallization layer formed by metal deposition. Full metallization may be applied over the entire wafer and a pattern subsequently transferred to the full metallization by one of laser and chemical etching. The electronic device may further include at least one electronic component attached to one of the layers and encased by the hermetic sealant.