公开(公告)号：US08703597B1

公开(公告)日：2014-04-22

申请号：US13869963

申请日：2013-04-25

Applicant: Monolithic 3D Inc.

Inventor： Deepak Sekar ,  Zvi Or-Bach ,  Brian Cronquist

IPC: H01L21/44 ,  H01L21/82 ,  H01L21/822

CPC classification number: H01L21/76898 ,  H01L21/268 ,  H01L21/76254 ,  H01L21/84 ,  H01L23/481 ,  H01L24/05 ,  H01L27/0623 ,  H01L27/0688 ,  H01L27/082 ,  H01L27/088 ,  H01L27/092 ,  H01L27/1203 ,  H01L29/0673 ,  H01L29/66545 ,  H01L29/785 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/15788 ,  H01L2924/16152 ,  H01L2924/351 ,  H01L2924/00

Abstract: A method for fabricating a device, the method including: providing a first layer including first transistors, where the first transistors include a mono-crystalline semiconductor; overlaying a second semiconductor layer over the first layer; fabricating a plurality of memory cell control lines where the control lines include a portion of the second layer; where the second layer includes second transistors, where the second transistors include a mono-crystalline semiconductor, and where the second transistors are configured to be memory cells.

Abstract translation: 一种制造器件的方法，所述方法包括：提供包括第一晶体管的第一层，其中所述第一晶体管包括单晶半导体; 在第一层上覆盖第二半导体层; 制造多个存储单元控制线，其中控制线包括第二层的一部分; 其中第二层包括第二晶体管，其中第二晶体管包括单晶半导体，并且其中第二晶体管被配置为存储单元。

公开(公告)号：US08664042B2

公开(公告)日：2014-03-04

申请号：US13471009

申请日：2012-05-14

Applicant: Zvi Or-Bach ,  Deepak C. Sekar ,  Brian Cronquist ,  Israel Beinglass ,  Jan Lodewijk de Jong

Inventor： Zvi Or-Bach ,  Deepak C. Sekar ,  Brian Cronquist ,  Israel Beinglass ,  Jan Lodewijk de Jong

IPC: H01L21/00

CPC classification number: H01L21/76254 ,  H01L21/8221 ,  H01L21/84 ,  H01L23/36 ,  H01L23/481 ,  H01L24/48 ,  H01L25/0657 ,  H01L27/0688 ,  H01L27/092 ,  H01L27/105 ,  H01L27/11 ,  H01L27/1104 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01066 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3011 ,  H03K19/177 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method to construct configurable systems, the method including: providing a first configurable system including a first die and a second die, where the connections between the first die and the second die include through-silicon-via (“TSV”), where the first die is diced from a first wafer using first dice lines; providing a second configurable system including a third die and a fourth die, where the connections between the third die and the fourth die include through-silicon-via (“TSV”), where the third die is diced from a third wafer using third dice lines; and processing the first wafer and the third wafer utilizing at least 20 masks that are the same; where the first dice lines are substantially different than the third dice lines, and where the second die includes a configurable I/O to connect the first configurable system to external devices.

Abstract translation: 一种构建可配置系统的方法，所述方法包括：提供包括第一管芯和第二管芯的第一可配置系统，其中第一管芯和第二管芯之间的连接包括穿硅通孔（“TSV”），其中 使用第一骰子线从第一晶片切下第一芯片; 提供包括第三管芯和第四管芯的第二可配置系统，其中第三管芯和第四管芯之间的连接包括穿硅通孔（“TSV”），其中使用第三管芯从第三晶片切割第三管芯 线条 以及使用相同的至少20个掩模来处理所述第一晶片和所述第三晶片; 其中第一骰子线与第三骰子线基本上不同，并且其中第二骰子包括用于将第一可配置系统连接到外部装置的可配置I / O。

公开(公告)号：US20140059411A1

公开(公告)日：2014-02-27

申请号：US13593895

申请日：2012-08-24

Applicant: Zvi Or-Bach ,  Ze'ev Wurman ,  Brian Cronquist

Inventor： Zvi Or-Bach ,  Ze'ev Wurman ,  Brian Cronquist

IPC: G06F17/21

CPC classification number: G06F17/211 ,  G06F16/5846 ,  G06F17/2235 ,  G06F17/2765

Abstract: A computing system including a processor, display, pointing device and memory; wherein the memory includes a text file, a graphics file corresponding to said text file and executable instructions to perform at least these actions (i) identify a selection of an alphanumeric identifier within a displayed text file, and then (ii) identify the appearance of the identifier in a corresponding graphics file, and then (iii) display a page of the graphics file comprising the appearance of the identifier.

Abstract translation: 一种包括处理器，显示器，指示装置和存储器的计算系统; 其中所述存储器包括文本文件，对应于所述文本文件的图形文件和至少执行这些动作的可执行指令（i）识别显示的文本文件内的字母数字标识符的选择，然后（ii）识别 相应图形文件中的标识符，然后（iii）显示包括标识符的外观的图形文件的页面。

公开(公告)号：US08574929B1

公开(公告)日：2013-11-05

申请号：US13678584

申请日：2012-11-16

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach ,  Deepak Sekar ,  Brian Cronquist

IPC: H01L21/477

CPC classification number: H01L27/0688 ,  H01L21/76254 ,  H01L27/088 ,  H01L27/092

Abstract: A method to form a monolithic 3D device including: processing a first layer including first mono-crystal transistors; transferring a second mono-crystal layer on top of the first layer including first mono-crystal transistors by using ion-cut layer transfer; and repairing the damage caused by the ion-cut by using optical annealing.

Abstract translation: 一种形成单片3D器件的方法，包括：处理包括第一单晶晶体管的第一层; 通过使用离子切割层转印在包括第一单晶体晶体管的第一层的顶部上转移第二单晶层; 并通过光学退火修复由离子切割引起的损伤。

公开(公告)号：US08476145B2

公开(公告)日：2013-07-02

申请号：US12904119

申请日：2010-10-13

Applicant: Zvi Or-Bach ,  Brian Cronquist ,  Isreal Beinglass ,  Jan Lodewijk de Jong ,  Deepak C. Sekar

Inventor： Zvi Or-Bach ,  Brian Cronquist ,  Isreal Beinglass ,  Jan Lodewijk de Jong ,  Deepak C. Sekar

IPC: H01L21/30

CPC classification number: H01L21/6835 ,  H01L21/823431 ,  H01L23/481 ,  H01L23/5283 ,  H01L23/544 ,  H01L27/0688 ,  H01L27/088 ,  H01L27/092 ,  H01L27/10802 ,  H01L27/10894 ,  H01L27/1108 ,  H01L27/1116 ,  H01L27/11529 ,  H01L27/11551 ,  H01L27/1157 ,  H01L27/11573 ,  H01L27/11578 ,  H01L27/2436 ,  H01L27/249 ,  H01L29/7841 ,  H01L29/785 ,  H01L29/7881 ,  H01L29/792 ,  H01L45/04 ,  H01L45/1226 ,  H01L45/146 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/10253 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/00

Abstract: A method to fabricate a semiconductor device, including the sequence of: implanting one or more regions on a semiconductor wafer forming a doped layer; performing a first transfer of the doped layer onto a carrier; and then performing a second transfer of the doped layer from the carrier to a target wafer; and then etching said one or more regions of the doped layer to form transistors on the doped layer.

Abstract translation: 一种制造半导体器件的方法，包括以下顺序：在形成掺杂层的半导体晶片上注入一个或多个区域; 执行掺杂层到载体上的第一次转移; 然后执行掺杂层从载体到目标晶片的第二次转移; 然后蚀刻掺杂层的一个或多个区域以在掺杂层上形成晶体管。

公开(公告)号：US20130119557A1

公开(公告)日：2013-05-16

申请号：US13683344

申请日：2012-11-21

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach

IPC: H01L23/48

CPC classification number: H01L21/8221 ,  H01L21/6835 ,  H01L21/76254 ,  H01L21/823828 ,  H01L21/84 ,  H01L23/3677 ,  H01L23/481 ,  H01L23/5252 ,  H01L24/05 ,  H01L24/13 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L27/0207 ,  H01L27/0688 ,  H01L27/092 ,  H01L27/10 ,  H01L27/105 ,  H01L27/10802 ,  H01L27/10873 ,  H01L27/10876 ,  H01L27/10894 ,  H01L27/10897 ,  H01L27/11 ,  H01L27/1108 ,  H01L27/1116 ,  H01L27/112 ,  H01L27/11206 ,  H01L27/11526 ,  H01L27/11529 ,  H01L27/11551 ,  H01L27/11573 ,  H01L27/11578 ,  H01L27/11807 ,  H01L27/11898 ,  H01L27/1203 ,  H01L27/1214 ,  H01L27/1266 ,  H01L29/4236 ,  H01L29/66272 ,  H01L29/66621 ,  H01L29/66825 ,  H01L29/66833 ,  H01L29/66901 ,  H01L29/78 ,  H01L29/7841 ,  H01L29/7881 ,  H01L29/792 ,  H01L2221/68368 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2224/0401 ,  H01L2224/16145 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83894 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01066 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00015 ,  H01L2924/01031 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/80001 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: Two systems including: a first system including a first die connected to a second die; and a second system including a third die connected to a fourth die; wherein the connected includes at least one through silicon via (TSV), and wherein the first die is substantially the same as the third die, and the second die is substantially different than the fourth die.

Abstract translation: 两个系统包括：第一系统，包括连接到第二管芯的第一管芯; 以及第二系统，包括连接到第四管芯的第三管芯; 其中所述连接件包括至少一个贯通硅通孔（TSV），并且其中所述第一管芯基本上与所述第三管芯相同，并且所述第二管芯基本上不同于所述第四管芯。

公开(公告)号：US20130083589A1

公开(公告)日：2013-04-04

申请号：US13624968

申请日：2012-09-23

Applicant: Zvi Or-Bach ,  Deepak Sekar ,  Brian Cronquist ,  Paul Lim

Inventor： Zvi Or-Bach ,  Deepak Sekar ,  Brian Cronquist ,  Paul Lim

IPC: G11C11/34 ,  G11C11/40 ,  G11C11/00 ,  G11C11/24

CPC classification number: H01L27/10873 ,  G11C5/025 ,  G11C5/063 ,  G11C11/406 ,  G11C2211/4016 ,  H01L24/16 ,  H01L24/94 ,  H01L27/0203 ,  H01L27/0688 ,  H01L27/10802 ,  H01L27/10894 ,  H01L27/10897 ,  H01L29/7841 ,  H01L29/785 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/12033 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2224/81 ,  H01L2924/00

Abstract: A semiconductor device, including: a first semiconductor layer including first transistors, wherein the first transistors are interconnected by at least one metal layer including aluminum or copper; and a second mono-crystallized semiconductor layer including second transistors and overlaying the at least one metal layer, wherein the at least one metal layer is in-between the first semiconductor layer and the second mono-crystallized semiconductor layer, wherein the second mono-crystallized semiconductor layer is less than 100 nm in thickness, and wherein the second transistors include horizontally oriented transistors.

Abstract translation: 一种半导体器件，包括：包括第一晶体管的第一半导体层，其中所述第一晶体管通过包括铝或铜的至少一个金属层互连; 以及包括第二晶体管并覆盖所述至少一个金属层的第二单结晶半导体层，其中所述至少一个金属层位于所述第一半导体层和所述第二单结晶半导体层之间，其中所述第二单结晶半导体层 半导体层的厚度小于100nm，其中第二晶体管包括水平取向的晶体管。

公开(公告)号：US08395191B2

公开(公告)日：2013-03-12

申请号：US12900379

申请日：2010-10-07

Applicant: Zvi Or-Bach ,  Brian Cronquist ,  Israel Beinglass ,  Jan Lodewijk de Jong ,  Deepak C. Sekar ,  Zeev Wurman

Inventor： Zvi Or-Bach ,  Brian Cronquist ,  Israel Beinglass ,  Jan Lodewijk de Jong ,  Deepak C. Sekar ,  Zeev Wurman

IPC: H01L21/336 ,  H01L21/8234 ,  H01L21/76 ,  H01L29/76 ,  H01L29/772 ,  H01L25/065

CPC classification number: H01L27/0688 ,  G03F9/7076 ,  G03F9/7084 ,  H01L21/268 ,  H01L21/76254 ,  H01L21/76898 ,  H01L21/8221 ,  H01L21/823871 ,  H01L21/84 ,  H01L23/367 ,  H01L23/481 ,  H01L23/5226 ,  H01L23/528 ,  H01L23/53214 ,  H01L23/53228 ,  H01L23/544 ,  H01L24/73 ,  H01L27/0207 ,  H01L27/088 ,  H01L27/092 ,  H01L27/105 ,  H01L27/10876 ,  H01L27/10894 ,  H01L27/10897 ,  H01L27/11 ,  H01L27/1108 ,  H01L27/112 ,  H01L27/11551 ,  H01L27/11578 ,  H01L27/11807 ,  H01L27/11898 ,  H01L27/1203 ,  H01L29/42392 ,  H01L29/458 ,  H01L29/66272 ,  H01L29/66545 ,  H01L29/66621 ,  H01L29/66848 ,  H01L29/66901 ,  H01L29/732 ,  H01L29/78639 ,  H01L29/78642 ,  H01L29/78645 ,  H01L29/808 ,  H01L29/812 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/80001 ,  H01L2924/00012 ,  H01L2924/01015

Abstract: A semiconductor device including a first single crystal layer with first transistors and a first alignment mark; at least one metal layer overlying the first single crystal layer, wherein the at least one metal layer includes copper or aluminum; and a second layer including activated dopant regions, the second layer overlying the at least one metal layer, wherein the second layer includes second transistors, wherein the second transistors are processed aligned to the first alignment mark with less than 100 nm alignment error, and the second transistors include mono-crystal, horizontally-oriented transistors.

Abstract translation: 一种半导体器件，包括具有第一晶体管的第一单晶层和第一对准标记; 覆盖所述第一单晶层的至少一个金属层，其中所述至少一个金属层包括铜或铝; 以及包括激活的掺杂剂区域的第二层，所述第二层覆盖所述至少一个金属层，其中所述第二层包括第二晶体管，其中所述第二晶体管被处理成与所述第一对准标记对齐，具有小于100nm的对准误差， 第二晶体管包括单晶，水平取向晶体管。

公开(公告)号：US07960242B2

公开(公告)日：2011-06-14

申请号：US12847911

申请日：2010-07-30

Applicant: Zvi Or-Bach ,  Brian Cronquist ,  Israel Beinglass ,  Jan Lodewijk de Jong ,  Deepak C. Sekar

Inventor： Zvi Or-Bach ,  Brian Cronquist ,  Israel Beinglass ,  Jan Lodewijk de Jong ,  Deepak C. Sekar

IPC: H01L21/336 ,  H01L21/8234 ,  H01L21/76

CPC classification number: G11C17/14 ,  H01L21/76254 ,  H01L21/8221 ,  H01L21/84 ,  H01L23/36 ,  H01L23/481 ,  H01L23/5252 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/18 ,  H01L27/0207 ,  H01L27/0688 ,  H01L27/0694 ,  H01L27/092 ,  H01L27/105 ,  H01L27/10873 ,  H01L27/10876 ,  H01L27/10897 ,  H01L27/11 ,  H01L27/1104 ,  H01L27/1108 ,  H01L27/112 ,  H01L27/11206 ,  H01L27/11803 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01066 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03K17/687 ,  H03K19/0948 ,  H03K19/17704 ,  H03K19/17756 ,  H03K19/17764 ,  H03K19/17796 ,  H01L2924/00 ,  H01L2224/80001 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A method of manufacturing a semiconductor wafer, the method comprising: providing a base wafer comprising a semiconductor substrate, metal layers and first alignment marks; transferring a monocrystalline layer on top of said metal layers, wherein said monocrystalline layer comprises second alignment marks; and performing a lithography using an alignment based on a misalignment between said first alignment marks and said second alignment marks.

Abstract translation: 一种制造半导体晶片的方法，所述方法包括：提供包括半导体衬底，金属层和第一对准标记的基底晶片; 在所述金属层的顶部上转移单晶层，其中所述单晶层包括第二对准标记; 以及使用基于所述第一对准标记和所述第二对准标记之间的未对准的对准来执行光刻。

公开(公告)号：US20250140598A1

公开(公告)日：2025-05-01

申请号：US19004133

申请日：2024-12-27

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach ,  Brian Cronquist ,  Deepak Sekar

IPC: H01L21/74

Abstract: A 3D device includes a first level including a first single crystal layer with control circuitry which includes first single crystal transistors; a first metal layer atop first single crystal layer; a second, third, and fourth metal layer providing connections between the first transistors; at least one second level (includes a plurality of second transistors including metal gates, and a plurality of memory cells) atop the first level; a fourth metal layer above the second level; a fifth metal layer atop the fourth metal layer, where the second level includes at least one first oxide layer overlaid by a transistor layer and then overlaid by a second oxide layer; a global power distribution grid; a local power distribution grid, where the first level includes first Electrostatic Discharge (ESD) circuits, and the second level includes second ESD circuits.