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    MULTI-PRESSURE MEMS PACKAGE
    131.
    发明申请
    MULTI-PRESSURE MEMS PACKAGE 审中-公开

    公开(公告)号：US20170283250A1

    公开(公告)日：2017-10-05

    申请号：US15626764

    申请日：2017-06-19

    申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

    发明人： Yu-Chia Liu ,  Chia-Hua Chu ,  Chun-Wen Cheng ,  Kuei-Sung Chang ,  Jung-Huei Peng

    IPC分类号： B81B7/04 ,  B81C1/00

    CPC分类号： B81B3/0051 ,  B81B7/02 ,  B81C2203/0118

    摘要： The present disclosure relates to a microelectromechanical systems (MEMS) package having two MEMS devices with different pressures, and an associated method of formation. In some embodiments, the (MEMS) package includes a device substrate and a cap substrate bonded together. The device substrate includes a first trench and a second trench. A first MEMS device is disposed over the first trench and a second MEMS device is disposed over the second trench. A first stopper is raised from a first trench bottom surface of the first trench but below a top surface of the device substrate and a second stopper is raised from a second trench bottom surface of the second trench but below the top surface of the device substrate. A first depth of the first trench is greater than a second depth of the second trench.

    Multicast optical switch
    136.
    发明授权
    Multicast optical switch 有权
    组播光交换机

    公开(公告)号：US09069139B2

    公开(公告)日：2015-06-30

    申请号：US13558802

    申请日：2012-07-26

    申请人： Sheldon McLaughlin ,  Peter David Roorda ,  Paul Colbourne ,  Barrie Keyworth

    发明人： Sheldon McLaughlin ,  Peter David Roorda ,  Paul Colbourne ,  Barrie Keyworth

    IPC分类号： G02B6/35 ,  B81B7/04 ,  G02B27/42 ,  G02B27/10

    CPC分类号： G02B6/3534 ,  B81B7/04 ,  G02B6/3512 ,  G02B6/3518 ,  G02B6/3546 ,  G02B6/3556 ,  G02B26/0833 ,  G02B27/106 ,  G02B27/1086 ,  G02B27/1093 ,  G02B27/42

    摘要： A multicast optical switch uses a diffractive bulk optical element, which splits at least one input optical beam into sub-beams, which freely propagate in a medium towards an array of directors, such as MEMS switches, for directing the sub-beams to output ports. Freely propagating optical beams can cross each other without introducing mutual optical loss. The amount of crosstalk is limited by scattering in the optical medium, which can be made virtually non-existent. Therefore, the number of the crossover connections, and consequently the number of inputs and outputs of a multicast optical switch, can be increased substantially without a loss or a crosstalk penalty.

    摘要翻译： 组播光学交换机使用衍射体光学元件，其将至少一个输入光束分成子光束，所述子光束在介质中自由地传播到诸如MEMS开关的导向器阵列，用于将子光束引导到输出端口 。 自由传播的光束可以彼此交叉而不引入相互的光学损耗。 串扰的量受光介质中的散射的限制，实际上可能不存在。 因此，可以基本上增加交叉连接的数量以及因此多播光交换机的输入和输出的数量，而不会造成丢失或串扰损失。

    Microphone component
    137.
    发明授权
    Microphone component 有权
    麦克风组件

    公开(公告)号：US09035307B2

    公开(公告)日：2015-05-19

    申请号：US14142360

    申请日：2013-12-27

    申请人： Bernhard Gehl ,  Thomas Buck ,  Florian Schoen

    发明人： Bernhard Gehl ,  Thomas Buck ,  Florian Schoen

    IPC分类号： B81B7/04 ,  B81B7/02 ,  H01L21/66 ,  H04R1/24 ,  H04R19/00 ,  H04R19/04

    CPC分类号： B81B7/02 ,  H01L22/30 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/15151 ,  H01L2924/16152 ,  H04R1/245 ,  H04R19/005 ,  H04R19/04 ,  H01L2924/00014

    摘要： A 2-chip MEMS microphone component includes: at least one first MEMS microphone structural component having at least one first microphone structure formed in the front side of the structural component; an ASIC structural component having evaluation electronics for the microphone signal of the MEMS microphone structural component; and a housing having a sound opening. The MEMS microphone structural component is mounted within the housing and above the sound opening in such a way that the rear side of the microphone structure is acted on by the sound pressure. The ASIC structural component also includes a second MEMS microphone structure whose microphone signal is fed to the evaluation electronics.

    摘要翻译： 2芯片MEMS麦克风组件包括：至少一个第一MEMS麦克风结构部件，其具有形成在结构部件的前侧的至少一个第一麦克风结构; 具有用于MEMS麦克风结构部件的麦克风信号的评估电路的ASIC结构部件; 以及具有声音开口的壳体。 MEMS麦克风结构部件安装在壳体内并且在声音开口之上，使得麦克风结构的后侧被声压作用。 ASIC结构组件还包括第二MEMS麦克风结构，其麦克风信号被馈送到评估电子器件。

    Wafer level method of sealing different pressure levels for MEMS sensors
    138.
    发明授权
    Wafer level method of sealing different pressure levels for MEMS sensors 有权
    用于MEMS传感器密封不同压力水平的晶圆级方法

    公开(公告)号：US09029961B2

    公开(公告)日：2015-05-12

    申请号：US14013155

    申请日：2013-08-29

    申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

    发明人： Kuei-Sung Chang ,  Chia-Hua Chu ,  Yu-Chia Liu

    IPC分类号： B81B7/02 ,  B81B7/04 ,  B81B7/00 ,  B81C1/00

    CPC分类号： B81B7/04 ,  B81B7/0041 ,  B81B7/02 ,  B81B2201/0235 ,  B81C1/00214 ,  B81C1/00269 ,  B81C1/00293 ,  B81C2203/0109 ,  B81C2203/0145

    摘要： The present disclosure relates to a method of forming a plurality of MEMs device having a plurality of chambers with different pressures on a substrate, and an associated apparatus. In some embodiments, the method is performed by providing a device wafer having a plurality of microelectromechanical system (MEMs) devices. A cap wafer is bonded onto the device wafer in a first ambient environment having a first pressure. The bonding forms a plurality of chambers abutting the plurality of MEMs devices, which are held at the first pressure. One or more openings are formed in one or more of the plurality of chambers. The one or more openings in the one or more of the plurality of chambers are then sealed in a different ambient environment having a different pressure, thereby causing the one or more of the plurality of chambers to be held at the different pressure.

    摘要翻译： 本公开涉及一种在基板上形成具有多个具有不同压力的室的多个MEM装置的方法，以及相关联的装置。 在一些实施例中，该方法通过提供具有多个微机电系统（MEM）装置的装置晶片来执行。 帽盖晶片在具有第一压力的第一环境环境中结合到器件晶片上。 接合形成与多个保持在第一压力下的多个MEM装置邻接的多个室。 一个或多个开口形成在多个室中的一个或多个室中。 然后将多个腔室中的一个或多个室中的一个或多个开口密封在具有不同压力的不同环境环境中，从而使多个室中的一个或多个保持在不同的压力。

    MICROELECTRODE ARRAY ARCHITECTURE
    139.
    发明申请
    MICROELECTRODE ARRAY ARCHITECTURE 有权
    微电网阵列架构

    公开(公告)号：US20110247934A1

    公开(公告)日：2011-10-13

    申请号：US13029140

    申请日：2011-02-17

    申请人： Gary Chorng-Jyh Wang ,  Ching Yen Ho ,  Wen Jang Hwang ,  Wilson Wen-Fu Wang

    发明人： Gary Chorng-Jyh Wang ,  Ching Yen Ho ,  Wen Jang Hwang ,  Wilson Wen-Fu Wang

    IPC分类号： B81B7/04 ,  G06F17/50 ,  C25B15/00

    CPC分类号： B01L3/502792 ,  B01L2300/0816 ,  B01L2300/089 ,  B01L2300/161 ,  B01L2400/0427

    摘要： Disclosed herein is a device A device of the microelectrode array architecture, comprising: (a) a bottom plate comprising an array of multiple microelectrodes disposed on a top surface of a substrate covered by a dielectric layer; wherein each of the microelectrode is coupled to at least one grounding elements of a grounding mechanism, wherein a hydrophobic layer is disposed on the top of the dielectric layer and the grounding elements to make hydrophobic surfaces with the droplets; (b) a field programmability mechanism for programming a group of configured-electrodes to generate microfluidic components and layouts with selected shapes and sizes; and, (c) a system management unit, comprising: (i) a droplet manipulation unit; and (ii) a system control unit.

    摘要翻译： 本文公开了一种微电极阵列结构的器件A器件，包括：（a）底板，包括设置在由电介质层覆盖的衬底的顶表面上的多个微电极阵列; 其中所述微电极中的每一个耦合到接地机构的至少一个接地元件，其中疏水层设置在所述电介质层的顶部和所述接地元件上以与所述液滴一起形成疏水表面; （b）用于编程一组配置电极以产生具有选定形状和尺寸的微流体组件和布局的现场可编程机构; 和（c）系统管理单元，包括：（i）液滴操纵单元; 和（ii）系统控制单元。