摘要:
A circuit includes: a first word line; a second word line; and a memory cell. The memory cell includes: a first pass gate, between a transistor and a first data line (RBL), having a gate coupled to the first word line; the transistor having a drain coupled to the first pass gate, a source coupled to a reference node, and a gate coupled to a data node of the memory cell; and a second pass gate, between the data node and a second data line, having a gate coupled to the second word line. The first word line is configured to turn on the first pass gate. The second word line is configured to turn on the second pass gate after an elapse of a first delay.
摘要:
A computer readable memory includes a circuit layer, a multilayer memory stacked over the circuit layer to form a memory box, the memory box comprising a bottom surface interfacing with the circuit layer and four side surfaces, and a first switching crossbar array disposed on a first side of the memory box. A plurality of vias connects the circuit layer to the first switching crossbar layer. The first switching crossbar array accepts signals from the plurality of vias and selectively connects a crossbar in the multilayer memory to the circuit layer. A method for addressing multilayer memory is also provided.
摘要:
Various embodiments include at least one resistance change memory (RCM) cell, In one embodiment, three or more pairs of electrical contacts are coupled to the at least one RCM cell. A first portion of the pairs are arranged laterally to one another in a first grouping and a second opposing portion of the pairs are arranged laterally to one another in a second grouping. A memory cell material is disposed between opposing sides of the pairs of the three or more electrical contacts. The memory cell material is configured to form a conductive pathway between one or more of the pairs, with each of the three or more pairs being configured to be accessed individually for at least one operation including program, erase, and read operations. Additional apparatuses and methods are described.
摘要:
A nonvolatile semiconductor memory device includes: a memory cell (MC0) including a cell transistor (TC0) and a variable resistance element (RR0); a memory cell (MC1) including a cell transistor (TC1) and a variable resistance element (RR1); a word line (WL0) connected to the cell transistor (TC0); a word line (WL1) connected to the cell transistor (TC1); a data line (SL0) connecting the cell transistor (TC0) and the variable resistance element (RR1) to each other; and a data line (BL0) connecting the variable resistance element (RR0) and the cell transistor (TC1) to each other.
摘要:
A memory circuit includes a plurality of memory cells arranged into columns and one or more pairs of adjacent rows and one or more first word lines. Each memory cell of the plurality of memory cells includes a data node, a first access node, and a first pass gate coupled to the first access node and configured to selectively alter a voltage level at the first access node according to a voltage level at the data node if the first pass gate is turned on. A word line of the one or more first word lines is coupled with the first pass gates of a pair of the one or more pairs of adjacent rows, and the first pass gates of the pair of the one or more pairs of adjacent rows are configured to be selectively turned on responsive to a voltage level at the word line.
摘要:
According to one embodiment, a non-volatile memory device includes first electrodes, at least one first semiconductor layer, a first memory film, second electrodes, at least one second semiconductor layer, and a second memory film. The first electrodes are stacked in a first direction. The one first semiconductor layer extends in the first direction through the first electrodes. The first memory film is provided between each of the first electrodes and the one first semiconductor layer. The second electrodes are stacked in the first direction and provided together with the first electrodes in a second direction orthogonal to the first direction. The one second semiconductor layer extends in the first direction through the second electrodes. The second memory film is provided between each of the second electrodes and the one second semiconductor layer. An outer diameter of the first memory film is larger than that of the second memory film.
摘要:
The present disclosure provides a static random access memory (SRAM) cell comprising a first inverter including a first pull-up (PU) device, a first pull-down (PD) device, and a second PD device; a second inverter cross-coupled to the first inverter, the second inverter including a second PU device, a third PD device, and a fourth PD device; first and second pass gate (PG) devices coupled to the first inverter to form a first port; and third and fourth PG devices coupled to the second inverter to form a second port. The first and second PG devices, the first PD device of the first inverter, and the third PD device of the second inverter are configured on a first active region. The third and fourth PG devices, the second PD device of the first inverter, and the fourth PD device of the second inverter are configured on a second active region.
摘要:
A memory device includes wordline decoder circuits that share components between adjacent memory blocks. The wordline decoder circuits include multiple levels, where at least one level is split, driving half of the wordlines in one adjacent memory block and driving half of the wordlines in another adjacent memory block. Memory blocks have every other wordline coupled to one adjacent decoder circuit, and the remaining wordlines coupled to another adjacent decoder circuit.
摘要:
The present invention discloses a discrete three-dimensional vertical memory (3D-MV). It comprises at least a 3D-array die and at least an A/D-translator die. The 3D-array die comprises a plurality of vertical memory strings. At least an address/data (A/D)-translator for the 3D-array die is located on the A/D-translator die instead of the 3D-array die. The 3D-array die and the A/D-translator die have substantially different back-end-of-line (BEOL) structures.
摘要:
Apparatuses and methods of providing word line voltages include an example apparatus including a voltage driver and a word line driver. The voltage driver is configured to provide a word line voltage, wherein the word line voltage is a pumped supply voltage responsive to an active mode and the word line voltage is a non-zero voltage less than the pumped supply voltage during a standby mode. The word line driver is coupled to the voltage driver and is configured to drive a respective word line to the word line voltage during the active and standby modes.