Semiconductor device and method of forming directional RF coupler with IPD for additional RF signal processing
    152.
    发明授权
    Semiconductor device and method of forming directional RF coupler with IPD for additional RF signal processing 有权
    半导体器件和方法,用于形成具有IPD的定向RF耦合器以用于附加的RF信号处理

    公开(公告)号:US08358179B2

    公开(公告)日:2013-01-22

    申请号:US12557382

    申请日:2009-09-10

    Abstract: A semiconductor device has a substrate and RF coupler formed over the substrate. The RF coupler has a first conductive trace with a first end coupled to a first terminal of the semiconductor device, and a second conductive trace with a first end coupled to a second terminal of the semiconductor device. The first conductive trace is placed in proximity to a first portion of the second conductive trace. An integrated passive device is formed over the substrate. A second portion of the second conductive trace operates as a circuit component of the integrated passive device. The integrated passive device can be a balun or low-pass filter. The RF coupler also has a first capacitor coupled to the first terminal of the semiconductor device, and second capacitor coupled to a third terminal of the semiconductor device for higher directivity. The second conductive trace is wound to exhibit an inductive property.

    Abstract translation: 半导体器件具有在衬底上形成的衬底和RF耦合器。 RF耦合器具有第​​一导电迹线,其第一端耦合到半导体器件的第一端子,第二导电迹线具有耦合到半导体器件的第二端子的第一端。 第一导电迹线放置在第二导电迹线的第一部分附近。 在衬底上形成集成的无源器件。 第二导电迹线的第二部分用作集成无源器件的电路部件。 集成的无源器件可以是平衡 - 不平衡转换/低通滤波器。 RF耦合器还具有耦合到半导体器件的第一端子的第一电容器,并且耦合到半导体器件的第三端子的第二电容器用于更高的方向性。 第二导电迹线被卷绕以呈现感应特性。

    Circuit board and display device including the same
    154.
    发明授权
    Circuit board and display device including the same 有权
    电路板和显示装置包括它们

    公开(公告)号:US08253672B2

    公开(公告)日:2012-08-28

    申请号:US12186348

    申请日:2008-08-05

    Abstract: One or more embodiments of the present disclosure relate to a circuit board having a substrate and a plurality of differential signal lines formed on the substrate and transmitting differential signals. The differential signal lines include a first signal line and a second signal line. The first signal line and the second signal line extend along at least two paths that are parallel to each other. The paths of the first signal line and the second signal line switch at path change portions, and the path change portions of neighboring differential signal lines are positioned at different distances away from an edge of the circuit board along the length direction of the differential signal line.

    Abstract translation: 本公开的一个或多个实施例涉及具有衬底和形成在衬底上并传输差分信号的多个差分信号线的电路板。 差分信号线包括第一信号线和第二信号线。 第一信号线和第二信号线沿着彼此平行的至少两个路径延伸。 第一信号线和第二信号线开关在路径改变部分的路径,并且相邻差分信号线的路径变化部分位于与差分信号线的长度方向上离电路板边缘不同的距离处 。

    Semiconductor module, wiring board, and wiring method
    159.
    发明授权
    Semiconductor module, wiring board, and wiring method 失效
    半导体模块,接线板及接线方式

    公开(公告)号:US08054643B2

    公开(公告)日:2011-11-08

    申请号:US12320641

    申请日:2009-01-30

    Applicant: Wataru Tsukada

    Inventor: Wataru Tsukada

    Abstract: A semiconductor module includes a plurality of rectangular shaped semiconductor devices which are arranged in two rows such that each pair of adjacent semiconductor devices is in orientations differed by 90 degrees from each other. A plurality of wirings connect the semiconductor devices included in one of the two rows to the semiconductor devices included in the other row such that the semiconductor devices arranged in the same orientations are connected to each other.

    Abstract translation: 半导体模块包括多个矩形半导体器件,它们被布置成两行,使得每对相邻的半导体器件的取向彼此相差90度。 多个布线将包括在两行之一中的半导体器件连接到另一行中包括的半导体器件,使得以相同取向排列的半导体器件彼此连接。

    Multilayer wiring board and method of manufacturing the same
    160.
    发明授权
    Multilayer wiring board and method of manufacturing the same 有权
    多层布线板及其制造方法

    公开(公告)号:US08026448B2

    公开(公告)日:2011-09-27

    申请号:US12068169

    申请日:2008-02-04

    Applicant: Koichi Tanaka

    Inventor: Koichi Tanaka

    Abstract: A multilayer wiring board includes at least two wiring boards having wiring layers containing wiring patterns formed on both sides. A pair of fin-shaped bumps are formed at desired positions on wiring patterns on the surfaces facing each other, of the wiring boards, so that the bumps assume a slender shape as seen in plan view and that the bumps intersect each other. The pair of fin-shaped bumps are electrically connected to form an inter-board connection terminal. Further, an insulating layer is formed between the wiring boards, and protection films are formed to cover the entire surface except pad areas defined at predetermined positions on outer wiring layers of the wiring boards.

    Abstract translation: 多层布线基板包括至少两个布线板,布线层包含形成在两侧的布线图案。 在布线板的彼此相对的表面上的布线图案的期望位置处形成一对鳍状凸起,使得凸起呈现如平面图中看到的细长形状,并且凸块彼此相交。 一对鳍状凸块电连接以形成板间连接端子。 此外,在布线板之间形成绝缘层,并且形成保护膜以覆盖限定在布线板的外部布线层上的预定位置处的焊盘区域之外的整个表面。

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