公开(公告)号：US20070085201A1

公开(公告)日：2007-04-19

申请号：US11581678

申请日：2006-10-16

Applicant: Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

Inventor： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC: H01L23/34

CPC classification number: H01L23/49562 ,  H01L23/49524 ,  H01L24/36 ,  H01L24/40 ,  H01L24/48 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12043 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: One aspect of the invention relates to a power semiconductor device in lead frame technology and a method for producing the same. The power semiconductor device has a vertical current path through a power semiconductor chip. The power semiconductor chip has at least one large-area electrode on its top side and a large-area electrode on its rear side. The rear side electrode is surface-mounted on a lead frame chip island of a lead frame and the top side electrode is electrically connected to an internal lead of the lead frame via a connecting element. The connecting element has an electrically conductive film on a surface facing the top side electrode, the electrically conductive film extending from the top side electrode to the internal lead.

Abstract translation: 本发明的一个方面涉及引线框技术中的功率半导体器件及其制造方法。 功率半导体器件具有穿过功率半导体芯片的垂直电流路径。 功率半导体芯片在其顶侧具有至少一个大面积电极，在其后侧具有大面积电极。 背面电极被表面安装在引线框架的引线框架芯片岛上，并且顶侧电极经由连接元件电连接到引线框架的内部引线。 连接元件在面向顶侧电极的表面上具有导电膜，导电膜从顶侧电极延伸到内部引线。

公开(公告)号：US08507080B2

公开(公告)日：2013-08-13

申请号：US11915037

申请日：2006-04-26

Applicant: Joachim Mahler ,  Alfred Haimerl ,  Wolfgang Schober ,  Michael Bauer ,  Angela Kessler

Inventor： Joachim Mahler ,  Alfred Haimerl ,  Wolfgang Schober ,  Michael Bauer ,  Angela Kessler

IPC: B23B5/14

CPC classification number: B32B27/08 ,  B29C65/48 ,  B29C66/028 ,  B29C66/30321 ,  B29C66/30325 ,  B29C66/30341 ,  B29C66/721 ,  B29C66/7392 ,  B29C66/7394 ,  B32B7/12 ,  B32B25/08 ,  B32B25/14 ,  B32B25/20 ,  B32B27/18 ,  B32B27/36 ,  B32B2250/03 ,  B32B2250/24 ,  B32B2264/105 ,  B32B2307/202 ,  B32B2457/00 ,  B32B2605/00 ,  H01L23/3135 ,  H01L23/3142 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01021 ,  H01L2924/01037 ,  H01L2924/01078 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/4554

Abstract: Composite with a first part composed of a thermoset material and with a second part composed of a thermoplastic material, and with an adhesion-promoter layer located between these, where the first part has been bonded by way of the adhesion-promoter layer to the second part, and where the adhesion-promoter layer comprises pyrolytically deposited semiconductor oxides and/or pyrolytically deposited metal oxides.

Abstract translation: 具有由热固性材料构成的第一部分和由热塑性材料构成的第二部分的复合材料，以及位于它们之间的粘合促进剂层，其中第一部分已经通过粘合促进剂层粘合到第二部分 部分，并且其中粘附促进剂层包含热解沉积的半导体氧化物和/或热解沉积的金属氧化物。

公开(公告)号：US20120223424A1

公开(公告)日：2012-09-06

申请号：US13461202

申请日：2012-05-01

Applicant: Joachim Mahler ,  Alfred Haimerl ,  Michael Bauer ,  Angela Kessler ,  Wolfgang Schober

Inventor： Joachim Mahler ,  Alfred Haimerl ,  Michael Bauer ,  Angela Kessler ,  Wolfgang Schober

IPC: H01L23/48

CPC classification number: H01L23/49894 ,  H01L21/56 ,  H01L23/293 ,  H01L23/3142 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Semiconductor component and method for production of a semiconductor component. The invention relates to a semiconductor component having a semiconductor chip, which is arranged on a substrate, in one embodiment on a chip carrier, and an encapsulation material, which at least partially surrounds the semiconductor chip. The chip carrier is at least partly provided with a layer of polymer foam.

Abstract translation: 半导体元件的制造方法及半导体元件的制造方法。 本发明涉及一种具有半导体芯片的半导体元件，该半导体元件布置在基板上，在一个实施例中在芯片载体上，以及至少部分地围绕半导体芯片的封装材料。 芯片载体至少部分地设置有聚合物泡沫层。

公开(公告)号：US07911039B2

公开(公告)日：2011-03-22

申请号：US11860556

申请日：2007-09-25

Applicant: Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

Inventor： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC: H01L23/495

CPC classification number: H05K3/284 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49531 ,  H01L24/48 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K1/142 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/1034 ,  H05K2201/10977 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A component arrangement comprising a carrier, a component in a housing with electrical contacts and a moulding compound that encloses the carrier, the semiconductor component in the housing and the electrical contacts, wherein the component is applied on the carrier, and wherein the carrier is provided with holes, and a method for producing a component arrangement, wherein the carrier is provided with holes, the component is positioned on the carrier, the component is connected to the carrier, the component with the carrier is positioned in the leadframe, and this arrangement is enclosed by a moulding compound.

Abstract translation: 一种部件装置，包括载体，具有电触头的壳体中的部件和封装载体的模制化合物，壳体中的半导体部件和电触点，其中将部件施加在载体上，并且其中提供载体 具有孔，以及用于制造部件布置的方法，其中，所述载体设置有孔，所述部件位于所述载体上，所述部件连接到所述载体，所述部件与所述载体位于所述引线框架中，并且所述布置 被模塑料包围。

公开(公告)号：US07714422B2

公开(公告)日：2010-05-11

申请号：US11751755

申请日：2007-05-22

Applicant: Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

Inventor： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC: H01L23/02

CPC classification number: H05K5/062 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/552 ,  H01L23/60 ,  H01L25/16 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K5/0247 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: An electronic module includes a component housing and at least one semiconductor chip. The semiconductor chip is arranged on a circuit carrier in the component housing. The semiconductor chip is connected to an upper face of the circuit carrier via connection elements. In this case, the semiconductor chip, the connection elements and, partially, the circuit carrier are embedded in a plastic housing compound. A metal plate which is structured into lead interconnects and contact connecting pads is provided on the upper face of the component housing.

Abstract translation: 电子模块包括部件壳体和至少一个半导体芯片。 半导体芯片布置在部件壳体中的电路载体上。 半导体芯片通过连接元件连接到电路载体的上表面。 在这种情况下，半导体芯片，连接元件和部分地，电路载体被嵌入在塑料外壳中。 构成引线互连和接触连接焊盘的金属板设置在部件壳体的上表面上。

公开(公告)号：US07705436B2

公开(公告)日：2010-04-27

申请号：US11834262

申请日：2007-08-06

Applicant: Joachim Mahler ,  Alfred Haimerl ,  Angela Kessler ,  Michael Bauer ,  Wolfgang Schober

Inventor： Joachim Mahler ,  Alfred Haimerl ,  Angela Kessler ,  Michael Bauer ,  Wolfgang Schober

IPC: H01L23/495

CPC classification number: H01L23/49562 ,  H01L23/49524 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/50 ,  H01L24/83 ,  H01L24/84 ,  H01L24/86 ,  H01L2224/06181 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29298 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/37647 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/45124 ,  H01L2224/83801 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/8384 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/0105 ,  H01L2924/01049 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/48 ,  H01L2924/00012

Abstract: A semiconductor chip has at least one first contact and one second contact on its top side and has connecting elements which are arranged jointly on a structure element and which connect the first contact and the second contact of the top side of the semiconductor chip to the external contacts.

Abstract translation: 半导体芯片在其顶侧具有至少一个第一接触和一个第二触点，并具有连接在结构元件上的连接元件，并且将半导体芯片的顶侧的第一触点和第二触点连接到外部 联系人

公开(公告)号：US20090280314A1

公开(公告)日：2009-11-12

申请号：US11915037

申请日：2006-04-26

Applicant: Joachim Mahler ,  Alfred Haimerl ,  Wolfgang Schober ,  Michael Bauer ,  Angela Kessler

Inventor： Joachim Mahler ,  Alfred Haimerl ,  Wolfgang Schober ,  Michael Bauer ,  Angela Kessler

IPC: C08J5/12 ,  B32B7/12 ,  B32B27/06 ,  B32B37/12

CPC classification number: B32B27/08 ,  B29C65/48 ,  B29C66/028 ,  B29C66/30321 ,  B29C66/30325 ,  B29C66/30341 ,  B29C66/721 ,  B29C66/7392 ,  B29C66/7394 ,  B32B7/12 ,  B32B25/08 ,  B32B25/14 ,  B32B25/20 ,  B32B27/18 ,  B32B27/36 ,  B32B2250/03 ,  B32B2250/24 ,  B32B2264/105 ,  B32B2307/202 ,  B32B2457/00 ,  B32B2605/00 ,  H01L23/3135 ,  H01L23/3142 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01021 ,  H01L2924/01037 ,  H01L2924/01078 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/4554

Abstract: Composite with a first part composed of a thermoset material and with a second part composed of a thermoplastic material, and with an adhesion-promoter layer located between these, where the first part has been bonded by way of the adhesion-promoter layer to the second part, and where the adhesion-promoter layer comprises pyrolytically deposited semiconductor oxides and/or pyrolytically deposited metal oxides.

Abstract translation: 具有由热固性材料构成的第一部分和由热塑性材料构成的第二部分的复合材料，以及位于它们之间的粘合促进剂层，其中第一部分已经通过粘合促进剂层粘合到第二部分 部分，并且其中粘附促进剂层包含热解沉积的半导体氧化物和/或热解沉积的金属氧化物。

公开(公告)号：US07589403B2

公开(公告)日：2009-09-15

申请号：US11927239

申请日：2007-10-29

Applicant: Michael Bauer ,  Angela Kessler ,  Wolfgang Schober ,  Alfred Haimerl ,  Joachim Mahler

Inventor： Michael Bauer ,  Angela Kessler ,  Wolfgang Schober ,  Alfred Haimerl ,  Joachim Mahler

IPC: H01L23/495

CPC classification number: H01L23/49513 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49586 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  Y10S977/938 ,  H01L2924/00012 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A lead structure for a semiconductor component includes: external leads for external connections outside a plastic housing composition, internal leads for electrical connections within the plastic housing composition, and a chip mounting island composed of the lead material. While leaving free contact pads of the internal leads, the top sides of the chip mounting island and the internal leads are equipped with nanotubes as an anchoring layer. The plastic housing composition is arranged in the interspaces between the nanotubes arranged on the internal leads, while an adhesive composition for the semiconductor chip is arranged in the interspaces between the nanotubes arranged on the chip mounting island. The adhesive composition and the plastic housing composition fill the interspaces in a manner free of voids.

Abstract translation: 用于半导体部件的引线结构包括：用于在塑料外壳组合物外部的外部连接的外部引线，用于塑料外壳组合物内的电连接的内部引线以及由引线材料构成的芯片安装岛。 在离开内部引线的自由接触垫的同时，芯片安装岛的顶侧和内部引线配备有作为锚定层的纳米管。 塑料外壳组合物布置在布置在内部引线上的纳米管之间的间隙中，而用于半导体芯片的粘合剂组合物布置在布置在芯片安装岛上的纳米管之间的间隙中。 粘合剂组合物和塑料外壳组合物以无空隙的方式填充空隙。

公开(公告)号：US20070278637A1

公开(公告)日：2007-12-06

申请号：US11757446

申请日：2007-06-04

Applicant: Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler

Inventor： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler

IPC: H01L23/02 ,  H01L21/00

CPC classification number: H01L24/83 ,  H01L24/27 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/8301 ,  H01L2224/83192 ,  H01L2224/83447 ,  H01L2224/83855 ,  H01L2224/83894 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028

Abstract: A circuit arrangement includes a component or an integrated circuit firmly attached on a wiring carrier via an adhesive layer. Furthermore, a pyrolytically deposited adhesion promoter layer with high surface energy and/or high porosity in the nanometer range is selectively provided on a metallic adherend location of the wiring carrier.

Abstract translation: 电路装置包括通过粘合剂层牢固地附接在布线载体上的部件或集成电路。 此外，在布线载体的金属被粘物位置上选择性地提供在纳米范围内具有高表面能和/或高孔隙率的热解沉积的粘合促进剂层。

公开(公告)号：US20070235865A1

公开(公告)日：2007-10-11

申请号：US11697191

申请日：2007-04-05

Applicant: Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler

Inventor： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler

IPC: H01L23/34

CPC classification number: H01L25/16 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/92127 ,  H01L2224/92163 ,  H01L2224/92247 ,  H01L2924/01068 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19104 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/141 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The invention relates to a semiconductor module comprising stacked discrete components and a method for producing the same. In one embodiment, the semiconductor module has a semiconductor chip arranged on a wiring substrate. The discrete components are arranged and wired on an intermediate carrier, which is electrically connected to the wiring substrate and/or the semiconductor chip. The wiring substrate carries the semiconductor chip, the semiconductor chip carries the intermediate carrier and the intermediate carrier carries the discrete components.

Abstract translation: 本发明涉及一种包括堆叠分立元件的半导体模块及其制造方法。 在一个实施例中，半导体模块具有布置在布线基板上的半导体芯片。 分立元件被布置和布线在与布线基板和/或半导体芯片电连接的中间载体上。 布线基板承载半导体芯片，半导体芯片承载中间载体，中间载体承载分立元件。