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公开(公告)号：US08070043B1
公开(公告)日：2011-12-06
申请号：US12958473
申请日：2010-12-02
Applicant: David D. Fleming , Mike K. Gallagher , Kim Sang Ho , Xiang-Qian Liu , Mark R. Winkle
Inventor： David D. Fleming , Mike K. Gallagher , Kim Sang Ho , Xiang-Qian Liu , Mark R. Winkle
CPC classification number: B23K35/362 , B23K35/3613 , C08G59/184 , C08G59/5026 , C08K5/17 , C08L63/00 , H05K3/3489
Abstract: A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) hydrogen; and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.
Abstract translation: 提供了一种可固化助焊剂组合物，其包含作为初始组分的树脂组分：每分子具有至少两个环氧乙烷基团的树脂组分; 由式I表示的助熔剂：其中R1，R2，R3和R4独立地选自氢，取代的C1-80烷基，未取代的C1-80烷基，取代的C7-80芳烷基和未取代的C7 -80芳烷基; 并且其中R 1，R 2，R 3和R 4中的0至3个为氢; 和任选的固化剂。 还提供了使用可固化焊剂组合物焊接电接触的方法。
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公开(公告)号：US08434667B2
公开(公告)日：2013-05-07
申请号：US13250226
申请日：2011-09-30
Applicant: Mark R. Winkle , Avin V. Dhoble , Kim S. Ho , Michael K. Gallagher , Xiang-Qian Liu , David Fleming
Inventor： Mark R. Winkle , Avin V. Dhoble , Kim S. Ho , Michael K. Gallagher , Xiang-Qian Liu , David Fleming
CPC classification number: H05K3/3489 , B23K1/0016 , B23K1/008 , B23K1/203 , B23K35/3601 , B23K35/3618 , B23K35/362 , B23K2101/42
Abstract: A flux composition is provided, comprising, as initial components: a carboxylic acid; and, a polyamine fluxing agent represented by formula I: with the proviso that when the polyamine fluxing agent represented by formula I is according to formula Ia: then zero to three of R1, R2, R3 and R4 is(are) a hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.
Abstract translation: 提供助熔剂组合物，其包含作为初始组分的羧酸; 和由式I表示的多胺助熔剂：条件是当式I表示的多胺助熔剂根据式Ia时：然后R 1，R 2，R 3和R 4中的0至3个为氢。 还提供了使用助焊剂组合物焊接电接触的方法。
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公开(公告)号：US08434666B2
公开(公告)日：2013-05-07
申请号：US13250007
申请日：2011-09-30
Applicant: Kim S. Ho , Michael K. Gallagher , Avin V. Dhoble , Mark R. Winkle , Xiang-Qian Liu , David Fleming
Inventor： Kim S. Ho , Michael K. Gallagher , Avin V. Dhoble , Mark R. Winkle , Xiang-Qian Liu , David Fleming
CPC classification number: B23K1/203 , B23K1/0016 , B23K1/008 , B23K35/0244 , B23K35/26 , B23K35/34 , B23K35/3601 , B23K35/362 , B23K2101/42 , H05K3/3489
Abstract: A flux composition is provided, comprising, as an initial component: a carboxylic acid; and, a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) a hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.
Abstract translation: 提供助焊剂组合物，其包含作为初始组分的羧酸; 以及由式I表示的助熔剂：其中R1，R2，R3和R4独立地选自氢，取代的C1-80烷基，未取代的C1-80烷基，取代的C7-80芳烷基和 未取代的C7-80芳基烷基; 并且其中R 1，R 2，R 3和R 4中的0至3个为氢。 还提供了使用助焊剂组合物焊接电接触的方法。
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14.发明授权公开(公告)号：US08430293B2
公开(公告)日：2013-04-30
申请号：US13250125
申请日：2011-09-30
Applicant: Avin V. Dhoble , Mark R. Winkle , Michael K. Gallagher , Kim S. Ho , Xiang-Qian Liu , Asghar A. Peera , Glenn N. Robinson , Ian A. Tomlinson , David Fleming
Inventor： Avin V. Dhoble , Mark R. Winkle , Michael K. Gallagher , Kim S. Ho , Xiang-Qian Liu , Asghar A. Peera , Glenn N. Robinson , Ian A. Tomlinson , David Fleming
CPC classification number: B23K35/3618 , B23K1/0016 , B23K1/203 , B23K35/362 , B23K2101/42 , C08K5/09 , C08K5/17 , H01L21/563 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/11334 , H01L2224/131 , H01L2224/13111 , H01L2224/16225 , H01L2224/16227 , H01L2224/2732 , H01L2224/2741 , H01L2224/27418 , H01L2224/27422 , H01L2224/2929 , H01L2224/29294 , H01L2224/29311 , H01L2224/29387 , H01L2224/2939 , H01L2224/32225 , H01L2224/73204 , H01L2224/81011 , H01L2224/81024 , H01L2224/81143 , H01L2224/81191 , H01L2224/81192 , H01L2224/81815 , H01L2224/83192 , H01L2224/83862 , H01L2224/9211 , H05K3/3436 , H05K3/3489 , H05K2201/10674 , H05K2201/10977 , C08L63/00 , H01L2924/014 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/01083 , H01L2924/0103 , H01L2924/00014 , H01L2224/81 , H01L2224/83 , H01L2924/00012 , H01L2924/00
Abstract: A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; and, an amine fluxing agent represented by formula I: and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.
Abstract translation: 提供了一种可固化助焊剂组合物，其包含作为初始组分的树脂组分：每分子具有至少两个环氧乙烷基团的树脂组分; 羧酸; 和由式I表示的胺助熔剂和任选的固化剂。 还提供了使用可固化焊剂组合物焊接电接触的方法。
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公开(公告)号：US20130082094A1
公开(公告)日：2013-04-04
申请号：US13250226
申请日：2011-09-30
Applicant: Mark R. Winkle , Avin V. Dhoble , Kim S. Ho , Michael K. Gallagher , Xiang-Qian Liu , David Fleming
Inventor： Mark R. Winkle , Avin V. Dhoble , Kim S. Ho , Michael K. Gallagher , Xiang-Qian Liu , David Fleming
IPC: B23K1/20 , B23K35/363
CPC classification number: H05K3/3489 , B23K1/0016 , B23K1/008 , B23K1/203 , B23K35/3601 , B23K35/3618 , B23K35/362 , B23K2101/42
Abstract: A flux composition is provided, comprising, as initial components: a carboxylic acid; and, a polyamine fluxing agent represented by formula I: with the proviso that when the polyamine fluxing agent represented by formula I is according to formula Ia: then zero to three of R1, R2, R3 and R4 is(are) a hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.
Abstract translation: 提供助熔剂组合物，其包含作为初始组分的羧酸; 和由式I表示的多胺助熔剂：条件是当式I表示的多胺助熔剂根据式Ia时：然后R 1，R 2，R 3和R 4中的0至3个为氢。 还提供了使用助焊剂组合物焊接电接触的方法。
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Patent Agency Ranking
16.发明申请公开(公告)号：US20130082092A1
公开(公告)日：2013-04-04
申请号：US13250125
申请日：2011-09-30
Applicant: Avin V. Dhoble , Mark R. Winkle , Michael K. Gallagher , Kim S. Ho , Xiang-Qian Liu , Asghar A. Peera , Glenn N. Robinson , Ian A. Tomlinson , David Fleming
Inventor： Avin V. Dhoble , Mark R. Winkle , Michael K. Gallagher , Kim S. Ho , Xiang-Qian Liu , Asghar A. Peera , Glenn N. Robinson , Ian A. Tomlinson , David Fleming
IPC: B23K35/363 , B23K31/02
CPC classification number: B23K35/3618 , B23K1/0016 , B23K1/203 , B23K35/362 , B23K2101/42 , C08K5/09 , C08K5/17 , H01L21/563 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/11334 , H01L2224/131 , H01L2224/13111 , H01L2224/16225 , H01L2224/16227 , H01L2224/2732 , H01L2224/2741 , H01L2224/27418 , H01L2224/27422 , H01L2224/2929 , H01L2224/29294 , H01L2224/29311 , H01L2224/29387 , H01L2224/2939 , H01L2224/32225 , H01L2224/73204 , H01L2224/81011 , H01L2224/81024 , H01L2224/81143 , H01L2224/81191 , H01L2224/81192 , H01L2224/81815 , H01L2224/83192 , H01L2224/83862 , H01L2224/9211 , H05K3/3436 , H05K3/3489 , H05K2201/10674 , H05K2201/10977 , C08L63/00 , H01L2924/014 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/01083 , H01L2924/0103 , H01L2924/00014 , H01L2224/81 , H01L2224/83 , H01L2924/00012 , H01L2924/00
Abstract: A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; and, an amine fluxing agent represented by formula I: and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.
Abstract translation: 提供了一种可固化助焊剂组合物，其包含作为初始组分的树脂组分：每分子具有至少两个环氧乙烷基团的树脂组分; 羧酸; 和由式I表示的胺助熔剂和任选的固化剂。 还提供了使用可固化焊剂组合物焊接电接触的方法。
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公开(公告)号：US20110073800A1
公开(公告)日：2011-03-31
申请号：US12586642
申请日：2009-09-25
Applicant: Hongyu Wang , Scott A. Ibbitson , Tirthankar Ghosh , Mark R. Winkle
Inventor： Hongyu Wang , Scott A. Ibbitson , Tirthankar Ghosh , Mark R. Winkle
IPC: C09K13/00
CPC classification number: C09G1/04 , H01L21/3212
Abstract: The aqueous abrasive-free composition is useful for chemical mechanical polishing of a patterned semiconductor wafer containing a nonferrous metal. The composition includes an oxidizer, an inhibitor for the nonferrous metal, 0 to 15 weight percent water soluble modified cellulose, 0 to 15 weight percent phosphorus compound, 0.005 to 5 weight percent of an acidic polymer, and water. The acidic polymer has a methacrylic acid portion having a carbon number of 4 to 250. The methacrylic acid portion includes either methacrylic acid or an acrylic acid/methacrylic acid copolymer. The acidic polymer including a segment from a mercapto-carboxylic acid chain transfer agent.
Abstract translation: 含水无磨料组合物可用于含有有色金属的图案化半导体晶片的化学机械抛光。 该组合物包括氧化剂，有色金属抑制剂，0-15重量％水溶性改性纤维素，0-15重量％磷化合物，0.005-5重量％酸性聚合物和水。 酸性聚合物具有碳数为4至250的甲基丙烯酸部分。甲基丙烯酸部分包括甲基丙烯酸或丙烯酸/甲基丙烯酸共聚物。 酸性聚合物包括来自巯基羧酸链转移剂的链段。
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18.发明授权Elimination of film defects due to hydrogen evolution during cathodic electrodeposition 失效消除阴极电沉积过程中由于析氢导致的膜缺陷
公开(公告)号：US5066374A
公开(公告)日：1991-11-19
申请号：US585428
申请日：1990-09-20
Applicant: Mark R. Winkle
Inventor： Mark R. Winkle
CPC classification number: C09D5/4492 , H05K3/0076 , H05K3/0079
Abstract: This invention is directed to a method for eliminating or reducing pinhole defects in cataphoretically deposited films without interfering with the electrolysis of water needed for electrodeposition. This method comprises decreasing the evolution of hydrogen gas at the cathode by adding a compound to the emulsion. This compound is reduced by the hydrogen produced at the cathode during the electrodeposition. The hydrogen reacts with the this non-gaseous compound rather than becoming hydrogen gas and forming bubbles which lead to pinhole defects.
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公开(公告)号：US08455175B2
公开(公告)日：2013-06-04
申请号：US13094629
申请日：2011-04-26
Applicant: Mark R. Winkle , Jill E. Steeper , Xiang-Qian Liu , Janet Okada-Coakley , Scott A. Ibbitson
Inventor： Mark R. Winkle , Jill E. Steeper , Xiang-Qian Liu , Janet Okada-Coakley , Scott A. Ibbitson
CPC classification number: G03F7/033 , G03F7/161 , G03F7/162 , H01L24/11 , H01L2224/0345 , H01L2224/03464 , H01L2224/0401 , H01L2224/05647 , H01L2224/05655 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11849 , H01L2224/131 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/0106 , H01L2924/01067 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/00014 , H01L2924/01083 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
Abstract: Photoresist compositions and methods suitable for depositing a thick photoresist layer in a single coating application are provided. Such photoresist layers are particularly suitable for use in chip scale packaging, for example, in the formation of metal bumps.
Abstract translation: 提供了适用于在单一涂层应用中沉积厚光致抗蚀剂层的光刻胶组合物和方法。 这样的光致抗蚀剂层特别适用于芯片级封装，例如在金属凸块的形成中。
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公开(公告)号：US08430294B2
公开(公告)日：2013-04-30
申请号：US13250184
申请日：2011-09-30
Applicant: Kim S. Ho , Mark R. Winkle , Avin V. Dhoble , Michael K. Gallagher , Xiang-Qian Liu , Asghar A. Peera , Glenn N. Robinson , Ian A. Tomlinson , David Fleming
Inventor： Kim S. Ho , Mark R. Winkle , Avin V. Dhoble , Michael K. Gallagher , Xiang-Qian Liu , Asghar A. Peera , Glenn N. Robinson , Ian A. Tomlinson , David Fleming
CPC classification number: H05K3/3489 , B23K35/3618 , B23K35/362 , C07C215/10 , C07C215/28 , H05K2201/10674
Abstract: A flux composition is provided, comprising, as initial components: a carboxylic acid; and, an amine fluxing agent represented by formula I: Also provided is a method of soldering an electrical contact using the flux composition.
Abstract translation: 提供助熔剂组合物，其包含作为初始组分的羧酸; 和由式I表示的胺助熔剂：还提供了使用助熔剂组合物焊接电接触的方法。
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