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    Electrophoretically depositable photosensitive polymer composition
    2.
    发明授权
    Electrophoretically depositable photosensitive polymer composition 失效
    电泳沉积的光敏聚合物组合物

    公开(公告)号：US4877818A

    公开(公告)日：1989-10-31

    申请号：US142110

    申请日：1988-01-11

    Applicant: William D. Emmons ,  Mark R. Winkle

    Inventor： William D. Emmons ,  Mark R. Winkle

    IPC: G03F7/027 ,  G03F7/16

    CPC classification number: G03F7/164 ,  G03F7/027 ,  Y10S522/904

    Abstract: The invention is directed to a photosensitive polymer composition capable of being electrophoretically depositable as an adherent, uniform photosensitive film on a conductive surface. The photosensitive polymer composition useful for electrodeposition is formed from an aqueous solution or emulsion of at least one polymer having charged carrier groups, a photoinitiator and a source of unsaturation for crosslinking the resulting film upon exposure to actinic radiation. The photosensitive film formed from the photosensitive polymer composition is aqueous developable and resistant to strong inorganic acids and strong bases. The photosensitive polymer composition is useful in the preparation of printed circuit boards, lithographic printing plates, cathode ray tubes, as well as in chemical milling, solder resist and planarizing layer applications.

    Abstract translation: 本发明涉及能够在导电表面上作为粘附的均匀感光膜电泳沉积的光敏聚合物组合物。 可用于电沉积的光敏聚合物组合物由具有带电荷的载体基团的至少一种聚合物的水溶液或乳液形成，光引发剂和不饱和源用于在曝光于光化辐射下使得到的膜交联。 由感光性聚合物组合物形成的感光性膜为水性显影性，耐强的无机酸和强碱。 感光性聚合物组合物可用于制备印刷电路板，平版印刷版，阴极射线管，以及化学研磨，阻焊剂和平坦化层应用。

    Electrophoretic deposition process
    3.
    发明授权
    Electrophoretic deposition process 失效
    电泳沉积工艺

    公开(公告)号：US4592816A

    公开(公告)日：1986-06-03

    申请号：US654821

    申请日：1984-09-26

    Applicant: William D. Emmons ,  Mark R. Winkle

    Inventor： William D. Emmons ,  Mark R. Winkle

    IPC: C08F2/00 ,  C08F2/48 ,  C08F2/50 ,  C08F290/00 ,  C08F299/00 ,  C23F1/02 ,  C25D13/04 ,  C25D13/06 ,  G03C1/74 ,  G03F7/004 ,  G03F7/027 ,  G03F7/028 ,  G03F7/038 ,  G03F7/16 ,  H05K3/06 ,  C25D13/12 ,  C25D13/20

    CPC classification number: G03F7/027 ,  G03F7/164 ,  Y10S430/138

    Abstract: The invention is directed to a photosensitive polymer composition capable of being electrophoretically depositable as an adherent, uniform photosensitive film on a conductive surface. The photosensitive polymer composition useful for electrodeposition is formed from an aqueous solution or emulsion of at least one polymer having charged carrier groups, a photoinitiator and a source of unsaturation for crosslinking the resulting film upon exposure to actinic radiation. The photosensitive film formed from the photosensitive polymer composition is aqueous developable and resistant to strong inorganic acids and strong bases. The photosensitive polymer composition is useful in the preparation of printed circuit boards, lithographic printing plates, cathode ray tubes, as well as in chemical milling, solder resist and planarizing layer applications.

    Abstract translation: 本发明涉及能够在导电表面上作为粘附的均匀感光膜电泳沉积的光敏聚合物组合物。 可用于电沉积的光敏聚合物组合物由具有带电荷的载体基团的至少一种聚合物的水溶液或乳液形成，光引发剂和不饱和源用于在曝光于光化辐射下使得到的膜交联。 由感光性聚合物组合物形成的感光性膜为水性显影性，耐强的无机酸和强碱。 感光性聚合物组合物可用于制备印刷电路板，平版印刷版，阴极射线管，以及化学研磨，阻焊剂和平坦化层应用。

    Polyamine flux composition and method of soldering
    5.
    发明授权
    Polyamine flux composition and method of soldering 有权
    多胺助焊剂组成及焊接方法

    公开(公告)号：US08070044B1

    公开(公告)日：2011-12-06

    申请号：US12958480

    申请日：2010-12-02

    Applicant: David D. Fleming ,  Mike K. Gallagher ,  Kim Sang Ho ,  Xiang-Qian Liu ,  Mark R. Winkle

    Inventor： David D. Fleming ,  Mike K. Gallagher ,  Kim Sang Ho ,  Xiang-Qian Liu ,  Mark R. Winkle

    IPC: B23K31/02 ,  B23K35/34

    CPC classification number: B23K35/36 ,  B22F2998/00 ,  B23K35/025 ,  B23K35/262 ,  B23K35/3612 ,  B23K35/362 ,  C22C12/00 ,  C22C13/00 ,  C22C1/0483

    Abstract: A polyamine flux composition is provided, comprising, as an initial component: a polyamine fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; wherein R7 comprises at least two tertiary carbons and is selected from an unsubstituted C5-80 alkyl group, a substituted C5-80 alkyl group, an unsubstituted C12-80 arylalkyl group and a substituted C12-80 arylalkyl group; and, wherein the two nitrogens shown in formula I are each separately bound to one of the at least two tertiary carbons of R7; with the proviso that when the polyamine fluxing agent of formula I is represented by formula Ia: then zero to three of R1, R2, R3 and R4 is(are) hydrogen. Also provided is a method of soldering an electrical contact using the polyamine flux composition.

    Abstract translation: 提供多胺助剂组合物，其包含作为初始组分的由式I表示的多胺助熔剂：其中R1，R2，R3和R4独立地选自氢，取代的C1-80烷基，未取代的C1- 80烷基，取代的C7-80芳烷基和未取代的C7-80芳烷基; 其中R7包含至少两个叔碳，并且选自未取代的C 5-80烷基，取代的C 5-80烷基，未取代的C 12〜80芳烷基和取代的C 12〜80芳烷基; 并且其中式I中所示的两个氮各自独立地与R7的至少两个叔碳中的一个结合; 条件是当式I的多胺助熔剂由式Ia表示时：然后R 1，R 2，R 3和R 4中的0至3个为氢。 还提供了使用多胺通量组合物焊接电接触的方法。

    Curable flux composition and method of soldering
    6.
    发明授权
    Curable flux composition and method of soldering 有权
    焊剂助焊剂组成及焊接方法

    公开(公告)号：US08070043B1

    公开(公告)日：2011-12-06

    申请号：US12958473

    申请日：2010-12-02

    Applicant: David D. Fleming ,  Mike K. Gallagher ,  Kim Sang Ho ,  Xiang-Qian Liu ,  Mark R. Winkle

    Inventor： David D. Fleming ,  Mike K. Gallagher ,  Kim Sang Ho ,  Xiang-Qian Liu ,  Mark R. Winkle

    IPC: B23K31/02 ,  B23K35/34

    CPC classification number: B23K35/362 ,  B23K35/3613 ,  C08G59/184 ,  C08G59/5026 ,  C08K5/17 ,  C08L63/00 ,  H05K3/3489

    Abstract: A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) hydrogen; and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.

    Abstract translation: 提供了一种可固化助焊剂组合物，其包含作为初始组分的树脂组分：每分子具有至少两个环氧乙烷基团的树脂组分; 由式I表示的助熔剂：其中R1，R2，R3和R4独立地选自氢，取代的C1-80烷基，未取代的C1-80烷基，取代的C7-80芳烷基和未取代的C7 -80芳烷基; 并且其中R 1，R 2，R 3和R 4中的0至3个为氢; 和任选的固化剂。 还提供了使用可固化焊剂组合物焊接电接触的方法。

    Curable amine flux composition and method of soldering
    10.
    发明授权
    Curable amine flux composition and method of soldering 有权
    可固化胺助焊剂组成及焊接方法

    公开(公告)号：US08070045B1

    公开(公告)日：2011-12-06

    申请号：US12958487

    申请日：2010-12-02

    Applicant: David D. Fleming ,  Mike K. Gallagher ,  Kim Sang Ho ,  Xiang-Qian Liu ,  Mark R. Winkle ,  Asghar Akber Peera ,  Glenn N. Robinson ,  Ian Tomlinson

    Inventor： David D. Fleming ,  Mike K. Gallagher ,  Kim Sang Ho ,  Xiang-Qian Liu ,  Mark R. Winkle ,  Asghar Akber Peera ,  Glenn N. Robinson ,  Ian Tomlinson

    IPC: B23K31/02 ,  B23K35/34

    CPC classification number: B23K35/3615 ,  B23K1/0016 ,  B23K1/203 ,  B23K35/362 ,  B23K2101/38 ,  B23K2101/42

    Abstract: A curable amine flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; an amine fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; wherein R7 and R8 are independently selected from a C1-20 alkyl group, a substituted C1-20 alkyl group, a C6-20 aryl group and a substituted C6-20 aryl group or wherein R7 and R8, together with the carbon to which they are attached, form a C3-20 cycloalkyl ring optionally substituted with a C1-6 alkyl group; wherein R10 and R11 are independently selected from a C1-20 alkyl group, a substituted C1-20 alkyl group, a C6-20 aryl group and a substituted C6-20 aryl group or wherein R10 and R11, together with the carbon to which they are attached, form a C3-20 cycloalkyl ring optionally substituted with a C1-6 alkyl group; and, wherein R9 is selected from a hydrogen, a C1-30 alkyl group, a substituted C1-30 alkyl group, a C6-30 aryl group and a substituted C6-30 aryl group; and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable amine flux composition.

    Abstract translation: 提供了一种可固化胺助剂组合物，其包含作为初始组分的树脂组分：每分子具有至少两个环氧乙烷基团的树脂组分; 由式I表示的胺助熔剂：其中R 1，R 2，R 3和R 4独立地选自氢，取代的C 1-8烷基，未取代的C 1-80烷基，取代的C 7〜80芳烷基和未取代的 C7-80芳基烷基; 其中R 7和R 8独立地选自C 1-20烷基，取代的C 1-20烷基，C 6-20芳基和取代的C 6-20芳基，或者其中R 7和R 8与它们 连接，形成任选被C 1-6烷基取代的C 3-20环烷基环; 其中R 10和R 11独立地选自C 1-20烷基，取代的C 1-20烷基，C 6-20芳基和取代的C 6-20芳基，或其中R 10和R 11与它们 连接，形成任选被C 1-6烷基取代的C 3-20环烷基环; 并且其中R 9选自氢，C 1-30烷基，取代的C 1-30烷基，C 6-30芳基和取代的C 6-30芳基; 和任选的固化剂。 还提供了使用可固化胺助剂组合物焊接电接触的方法。

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