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    HIGH-YIELD METHOD OF EXPOSING AND CONTACTING THROUGH-SILICON VIAS
    11.
    发明申请
    HIGH-YIELD METHOD OF EXPOSING AND CONTACTING THROUGH-SILICON VIAS 有权
    高渗硅的渗透和接触方法

    公开(公告)号：US20100178766A1

    公开(公告)日：2010-07-15

    申请号：US12352718

    申请日：2009-01-13

    申请人： Paul S. Andry ,  John M. Cotte ,  Michael F. Lofaro ,  Edmund J. Sprogis ,  James A. Tornello ,  Cornelia K. Tsang

    发明人： Paul S. Andry ,  John M. Cotte ,  Michael F. Lofaro ,  Edmund J. Sprogis ,  James A. Tornello ,  Cornelia K. Tsang

    IPC分类号： H01L21/461

    CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/014 ,  H01L2224/05552 ,  H01L2924/00

    摘要： An assembly including a main wafer having a body with a front side and a back side, and a handler wafer, is obtained. The main wafer has a plurality of blind electrical vias terminating above the back side. The blind electrical vias have conductive cores with surrounding insulator adjacent side and end regions of the cores. The handler wafer is secured to the front side of the body of the main wafer. An additional step includes exposing the blind electrical vias on the back side. The blind electrical vias are exposed to various heights across the back side. Another step involves applying a first chemical mechanical polish process to the back side, to open any of the surrounding insulator adjacent the end regions of the cores remaining after the exposing step, and to co-planarize the via conductive cores, the surrounding insulator adjacent the side regions of the cores, and the body of the main wafer. Further steps include etching the back side to produce a uniform standoff height of each of the vias across the back side; depositing a dielectric across the back side; and applying a second chemical mechanical polish process to the back side, to open the dielectric only adjacent the conductive cores of the vias.

    摘要翻译： 获得包括具有前侧和后侧的主体的主晶片和处理器晶片的组件。 主晶片具有在背面上方终止的多个盲电通路。 盲电通孔具有导电芯，其周围绝缘体邻近芯的侧面和端部区域。 处理器晶片固定到主晶片的主体的前侧。 另外的步骤包括在背面暴露盲电通孔。 盲孔通过背面暴露于各种高度。 另一个步骤涉及将第一化学机械抛光工艺应用于背面，以便打开暴露步骤之后残留的芯的端部附近的任何周围的绝缘体，并且将通孔导电芯，邻近的绝缘体 芯的侧面区域和主晶片的主体。 进一步的步骤包括蚀刻背面以产生穿过背面的每个通路的均匀间隔高度; 在背面沉积电介质; 以及向后侧施加第二化学机械抛光工艺，以仅在通孔的导电芯附近打开电介质。

    Wafer carrier assembly
    15.
    发明授权
    Wafer carrier assembly 失效
    晶圆架总成

    公开(公告)号：US6030487A

    公开(公告)日：2000-02-29

    申请号：US878567

    申请日：1997-06-19

    申请人： Thomas R. Fisher, Jr. ,  Carol E. Gustafson ,  Michael F. Lofaro

    发明人： Thomas R. Fisher, Jr. ,  Carol E. Gustafson ,  Michael F. Lofaro

    IPC分类号： B24B37/30 ,  B24B53/007 ,  B24B53/017 ,  B24B57/02 ,  H01L21/304 ,  B24B1/00

    CPC分类号： B24B37/30 ,  B24B53/017 ,  B24B57/02

    摘要： A wafer carrier assembly including a subassembly for in-situ nondestructive pad conditioning, characterized by continuously cleansing the pad surface with an energized fluid. The fluid may be abrasive in nature, such as a slurry, or non-abrasive, such as DeIonized (DI) water. In addition, the fluid may be of a type known to assist in removing slurry and/or residual materials from a pad surface and followed by a DI water rinse. The chemical may be either liquid or gas.

    摘要翻译： 一种晶片载体组件，其包括用于原位非破坏性衬垫调节的子组件，其特征在于，连续地用赋能的流体清洁衬垫表面。 流体在本质上可以是磨料，例如浆料或非研磨剂，例如DeInized（DI）水。 此外，流体可以是已知的类型，以帮助从衬垫表面去除浆料和/或残留材料，然后进行去离子水冲洗。 化学品可以是液体或气体。

    Glass mold polishing method and structure
    18.
    发明授权
    Glass mold polishing method and structure 有权
    玻璃模具抛光方法和结构

    公开(公告)号：US07955160B2

    公开(公告)日：2011-06-07

    申请号：US12135315

    申请日：2008-06-09

    申请人： Michael A. Cobb ,  Dinesh R. Koli ,  Michael F. Lofaro ,  Dennis G. Manzer ,  Paraneetha Poloju ,  James A. Tornello

    发明人： Michael A. Cobb ,  Dinesh R. Koli ,  Michael F. Lofaro ,  Dennis G. Manzer ,  Paraneetha Poloju ,  James A. Tornello

    IPC分类号： B24B1/00

    CPC分类号： B24B37/042 ,  B24B37/11

    摘要： A glass mold polishing structure and method. The method includes providing a polishing tool comprising mounting plate, a chuck plate over and mechanically attached to the mounting plate, and a pad structure over and mechanically attached to the chuck plate. A retaining structure is attached the chuck plate. A glass mold comprising a plurality of cavities is placed on the pad structure and within a perimeter formed by the retaining structure. A vacuum device is attached to the chuck plate. The vacuum device is activated such that a vacuum is formed and mechanically attaches the glass mold to the pad structure. The polishing tool comprising the glass mold mechanically attached to the pad structure is placed over and in contact with the polishing pad. The polishing tool comprising the glass mold is rotated. The glass mold is polished as a result of the rotation.

    摘要翻译： 玻璃模具抛光结构及方法。 该方法包括提供一种抛光工具，该抛光工具包括安装板，卡盘板，并且机械地连接到安装板上，以及衬垫结构，并且在机械上附接到卡盘板上。 保持结构安装在卡盘板上。 包括多个空腔的玻璃模具被放置在垫结构上并且在由保持结构形成的周边内。 真空装置安装在卡板上。 激活真空装置，使得形成真空并将玻璃模具机械地附接到衬垫结构。 包括机械地附接到垫结构的玻璃模具的抛光工具放置在抛光垫上并与抛光垫接触。 包括玻璃模具的抛光工具旋转。 玻璃模具由于旋转而被抛光。