公开(公告)号：US06492593B2

公开(公告)日：2002-12-10

申请号：US09872651

申请日：2001-05-31

申请人： Hiroshi Murai ,  Shuichi Mitoma ,  Takeshi Tokuyama ,  Mitutomo Motomura

发明人： Hiroshi Murai ,  Shuichi Mitoma ,  Takeshi Tokuyama ,  Mitutomo Motomura

IPC分类号： H01R400

CPC分类号： H01L24/85 ,  B23K20/007 ,  C22C5/02 ,  H01L24/11 ,  H01L24/13 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/45694 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01064 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01105 ,  H01L2924/01204 ,  H01L2924/01205 ,  H01L2924/14 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/01046 ,  H01L2924/01082 ,  H01L2924/0102 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/01004 ,  H01L2924/01071 ,  H01L2924/01006 ,  H01L2924/00012

摘要： A gold wire, for semiconductor element connection, having 5-100 ppm by weight of Ca, 5-100 ppm by weight of Gd, and 1-100 ppm by weight of Y. The gold wire further preferably has 1-100 ppm by weight of at least one of Eu, La, Ce and Lu, as well as 1-100 ppm by weight of at least one of Mg and Ti. The total amount of the added elements being no greater than 200 ppm by weight. The balance being gold and unavoidable impurities. A semiconductor element connection method by ball bonding or bump connection using the gold wire.

摘要翻译： 用于半导体元件连接的金线，具有5-100重量ppm的Ca，5-100重量ppm的Gd和1-100重量ppm的Y。金丝还优选具有1-100重量ppm 的Eu，La，Ce和Lu中的至少一种，以及1-100重量ppm的Mg和Ti中的至少一种。 添加元素的总量不大于200重量ppm。 余量为金和不可避免的杂质。 一种半导体元件连接方法，通过使用金线的球接或凸块连接。

公开(公告)号：US20140118934A1

公开(公告)日：2014-05-01

申请号：US14126955

申请日：2012-06-15

申请人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Toshiya Satoh ,  Tokihito Suwa

发明人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Toshiya Satoh ,  Tokihito Suwa

IPC分类号： H05K7/20

CPC分类号： H05K7/2089 ,  H01L23/367 ,  H01L23/4334 ,  H01L23/473 ,  H01L24/33 ,  H01L25/115 ,  H01L25/18 ,  H01L2224/32245 ,  H01L2924/07802 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H02M7/003 ,  H05K7/1432 ,  H05K7/209 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power semiconductor module includes a first package having an upper arm circuit section, a second package having a lower arm circuit section, a metal case having a storage space to store the first package and the second package and an opening connecting with the storage space, and an intermediate connecting conductor to couple the upper arm circuit section with the lower arm circuit section; the case includes a first radiating section and a second radiating section facing the first radiating section through the storage space; the first package is arranged so that the arrangement direction of the first and second packages may be parallel to the respective surfaces facing the first and second radiating sections; and the intermediate connecting conductor couples an emitter side terminal extending from the first package with a collector side terminal extending from the second package in the storage space.

摘要翻译： 功率半导体模块包括具有上臂电路部分的第一封装，具有下臂电路部分的第二封装，具有存储第一封装和第二封装的存储空间的金属外壳以及与存储空间连接的开口， 以及将上臂电路部分与下臂电路部分连接的中间连接导体; 壳体包括通过存储空间面向第一辐射部分的第一辐射部分和第二辐射部分; 第一包装被布置成使得第一和第二包装件的布置方向可以平行于面向第一和第二辐射部分的相应表面; 并且中间连接导体将从第一封装延伸的发射极侧端子与从存储空间中的第二封装延伸的集电极侧端子耦合。

公开(公告)号：US20120087095A1

公开(公告)日：2012-04-12

申请号：US13266675

申请日：2010-04-16

申请人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Toshiya Satoh ,  Hideaki Ishikawa

发明人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Toshiya Satoh ,  Hideaki Ishikawa

IPC分类号： H05K7/20 ,  H05K5/04

CPC分类号： H01L23/467 ,  B60K1/02 ,  B60K6/365 ,  B60K6/445 ,  B60L3/003 ,  B60L11/123 ,  B60L11/14 ,  B60L2200/10 ,  B60L2200/26 ,  B60L2200/32 ,  B60L2200/36 ,  B60L2220/12 ,  B60L2220/14 ,  B60L2240/36 ,  B60L2240/525 ,  C25D11/08 ,  C25D11/10 ,  C25D11/12 ,  H01L23/367 ,  H01L23/433 ,  H01L23/473 ,  H01L24/33 ,  H01L25/072 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/8384 ,  H01L2924/01327 ,  H01L2924/07802 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H02M7/003 ,  Y02T10/6217 ,  Y02T10/6239 ,  Y02T10/7077 ,  H01L2924/00

摘要： A power module according to the present invention includes: a semiconductor element for converting DC current to AC current by switching operation; an electrical wiring board to which the semiconductor element is electrically connected, with the semiconductor element being disposed upon one of its principal surfaces; an insulating resin layer provided on the other principal surface of the electrical wiring board; a first insulation layer that is disposed opposite from the electrical wiring board, separated by the insulating resin layer, and that is joined to the insulating resin layer; a second insulation layer that is disposed opposite from the insulating resin layer, separated by the first insulation layer, and that ensures electrical insulation of the semiconductor element; and a metallic heat dissipation member that is disposed opposite from the first insulation layer, separated by the second insulation layer, and that radiates heat generated by the semiconductor element via the electrical wiring board, the insulating resin layer, the first insulation layer, and the second insulation layer.

摘要翻译： 根据本发明的电源模块包括：用于通过切换操作将DC电流转换成AC电流的半导体元件; 半导体元件电连接的电气布线板，半导体元件设置在其主表面之一上; 绝缘树脂层，设置在所述电气布线板的另一个主表面上; 第一绝缘层，与所述电布线板相对设置，由所述绝缘树脂层隔开，并且与所述绝缘树脂层接合; 第二绝缘层，与绝缘树脂层相对设置，由第一绝缘层隔开，并且确保半导体元件的电绝缘; 以及金属散热构件，其与所述第一绝缘层相对设置，由所述第二绝缘层隔开，并且经由所述电布线板，所述绝缘树脂层，所述第一绝缘层和所述第二绝缘层辐射由所述半导体元件产生的热量 第二绝缘层。

公开(公告)号：US20120008280A1

公开(公告)日：2012-01-12

申请号：US13241600

申请日：2011-09-23

申请人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Atushi Kawabata

发明人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Atushi Kawabata

IPC分类号： H05K7/20

CPC分类号： H05K7/02 ,  H01G2/08 ,  H01G4/224 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H02M7/003 ,  Y02T10/7022 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance. The above object can be attained by constructing multiple plate-like conductors so that each of these conductors electrically connected to multiple semiconductor chips is also thermally connected to both chip surfaces of each such semiconductor chip to release heat from the chip surfaces of each semiconductor chip, and so that among the above conductors, a DC positive-polarity plate-like conductor and a DC negative-polarity plate-like conductor are opposed to each other at the respective conductor surfaces.

摘要翻译： 本发明提供一种电路装置，其中可以同时实现冷却性能的提高和由于线路电感引起的工作损耗的降低。 上述目的可以通过构造多个板状导体来实现，使得电连接到多个半导体芯片的这些导体中的每一个也热连接到每个这样的半导体芯片的两个芯片表面，以从每个半导体芯片的芯片表面释放热量， 并且使得在上述导体中，DC正极板状导体和DC负极板状导体在各导体表面处彼此相对。

公开(公告)号：US07978471B2

公开(公告)日：2011-07-12

申请号：US12388910

申请日：2009-02-19

申请人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Keisuke Horiuchi ,  Toshiya Satoh ,  Hideki Miyazaki

发明人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Keisuke Horiuchi ,  Toshiya Satoh ,  Hideki Miyazaki

IPC分类号： H05K7/20

CPC分类号： H05K7/20927 ,  B60K6/26 ,  B60K6/28 ,  B60K6/46 ,  B60K17/16 ,  B60L11/1803 ,  B60L15/007 ,  B60L2210/40 ,  B60L2220/14 ,  B60L2240/429 ,  B60Y2200/92 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/473 ,  H01L23/492 ,  H01L23/49517 ,  H01L24/45 ,  H01L25/072 ,  H01L2224/40137 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/1203 ,  H01L2924/13055 ,  H02M7/003 ,  H02M7/537 ,  H02P27/06 ,  H05K1/0262 ,  H05K7/2089 ,  Y10S903/906 ,  Y10S903/907 ,  Y10S903/909 ,  H01L2924/00 ,  H01L2224/45099

摘要： An electric power conversion apparatus includes: a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that comprises an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module comprises a first and a second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further comprises a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

摘要翻译： 电力转换装置包括：形成冷却水通道的通道壳体; 包括逆变器电路的上臂和下臂串联电路的双面冷却半导体模块; 电容器模块; 直流连接器; 和备用电流连接器。 半导体模块包括第一和第二散热金属，其外表面是散热表面，上下臂串联电路紧密地设置在第一散热金属和第二散热金属之间，并且半导体模块还包括 直流正极端子，直流负极端子和突出到外部的交流电流端子。 通道壳体设置有从冷却水入口延伸到冷却水出口的冷却水通道以及通向冷却水通道的第一开口。

公开(公告)号：US07961472B2

公开(公告)日：2011-06-14

申请号：US11740622

申请日：2007-04-26

申请人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Atsushi Kawabata

发明人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Atsushi Kawabata

IPC分类号： H05K7/20 ,  H05K7/00 ,  H01L23/10 ,  H01L23/34

CPC分类号： H05K7/02 ,  H01G2/08 ,  H01G4/224 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H02M7/003 ,  Y02T10/7022 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance.The above object can be attained by constructing multiple plate-like conductors so that each of these conductors electrically connected to multiple semiconductor chips is also thermally connected to both chip surfaces of each such semiconductor chip to release heat from the chip surfaces of each semiconductor chip, and so that among the above conductors, a DC positive-polarity plate-like conductor and a DC negative-polarity plate-like conductor are opposed to each other at the respective conductor surfaces.

摘要翻译： 本发明提供一种电路装置，其中可以同时实现冷却性能的提高和由于线路电感引起的工作损耗的降低。 上述目的可以通过构造多个板状导体来实现，使得电连接到多个半导体芯片的这些导体中的每一个也热连接到每个这样的半导体芯片的两个芯片表面，以从每个半导体芯片的芯片表面释放热量， 并且使得在上述导体中，DC正极板状导体和DC负极板状导体在各导体表面处彼此相对。

公开(公告)号：US08675364B2

公开(公告)日：2014-03-18

申请号：US13266675

申请日：2010-04-16

申请人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Toshiya Satoh ,  Hideaki Ishikawa

发明人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Toshiya Satoh ,  Hideaki Ishikawa

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  B60K1/02 ,  B60K6/365 ,  B60K6/445 ,  B60L3/003 ,  B60L11/123 ,  B60L11/14 ,  B60L2200/10 ,  B60L2200/26 ,  B60L2200/32 ,  B60L2200/36 ,  B60L2220/12 ,  B60L2220/14 ,  B60L2240/36 ,  B60L2240/525 ,  C25D11/08 ,  C25D11/10 ,  C25D11/12 ,  H01L23/367 ,  H01L23/433 ,  H01L23/473 ,  H01L24/33 ,  H01L25/072 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/8384 ,  H01L2924/01327 ,  H01L2924/07802 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H02M7/003 ,  Y02T10/6217 ,  Y02T10/6239 ,  Y02T10/7077 ,  H01L2924/00

摘要： A power module according to the present invention includes: a semiconductor element for converting DC current to AC current by switching operation; an electrical wiring board to which the semiconductor element is electrically connected, with the semiconductor element being disposed upon one of its principal surfaces; an insulating resin layer provided on the other principal surface of the electrical wiring board; a first insulation layer that is disposed opposite from the electrical wiring board, separated by the insulating resin layer, and that is joined to the insulating resin layer; a second insulation layer that is disposed opposite from the insulating resin layer, separated by the first insulation layer, and that ensures electrical insulation of the semiconductor element; and a metallic heat dissipation member that is disposed opposite from the first insulation layer, separated by the second insulation layer, and that radiates heat generated by the semiconductor element via the electrical wiring board, the insulating resin layer, the first insulation layer, and the second insulation layer.

摘要翻译： 根据本发明的电源模块包括：用于通过切换操作将DC电流转换成AC电流的半导体元件; 半导体元件电连接的电气布线板，半导体元件设置在其主表面之一上; 绝缘树脂层，设置在所述电气布线板的另一个主表面上; 第一绝缘层，与所述电布线板相对设置，由所述绝缘树脂层隔开，并且与所述绝缘树脂层接合; 第二绝缘层，与绝缘树脂层相对设置，由第一绝缘层隔开，并且确保半导体元件的电绝缘; 以及金属散热构件，其与所述第一绝缘层相对设置，由所述第二绝缘层隔开，并且经由所述电布线板，所述绝缘树脂层，所述第一绝缘层和所述第二绝缘层辐射由所述半导体元件产生的热量 第二绝缘层。

公开(公告)号：US20130175678A1

公开(公告)日：2013-07-11

申请号：US13818490

申请日：2011-09-05

申请人： Eiichi Ide ,  Shinji Hiramitsu ,  Hiroshi Hozoji ,  Nobutake Tsuyuno ,  Kinya Nakatsu ,  Takeshi Tokuyama ,  Akira Matsushita ,  Yusuke Takagi

发明人： Eiichi Ide ,  Shinji Hiramitsu ,  Hiroshi Hozoji ,  Nobutake Tsuyuno ,  Kinya Nakatsu ,  Takeshi Tokuyama ,  Akira Matsushita ,  Yusuke Takagi

IPC分类号： H01L23/34 ,  H01L21/48

CPC分类号： H01L23/34 ,  H01L21/4825 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/473 ,  H01L23/492 ,  H01L23/49524 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/83 ,  H01L24/84 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/32503 ,  H01L2224/33 ,  H01L2224/33181 ,  H01L2224/3521 ,  H01L2224/37013 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37639 ,  H01L2224/37644 ,  H01L2224/37655 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/4847 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/1306 ,  H01L2924/1305 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/01047 ,  H01L2924/01029

摘要： A power semiconductor module includes a power semiconductor element formed with a plurality of control electrodes on one main surface, a first conductor plate bonded by way of a first solder material to one of the main surfaces of the power semiconductor element, and a second conductor plate bonded by way of a second solder material on the other main surface of the power semiconductor element. A first protrusion section protruding from the base section of the applicable first conductor plate and including a first protrusion surface formed over the upper side, is formed over the first conductor plate. A second protrusion section including a second protrusion surface formed facing opposite one of the main surfaces of the power semiconductor element. The first solder material is interposed between the power semiconductor element and the first conductor plate while avoiding the plural control electrodes. If there is an projection from a perpendicular direction by one of the main surfaces of the power semiconductor element, the second protrusion section is formed so that the projecting section on a specified side of the second protrusion surface overlaps the projecting section of the step section formed between the base section of the first conductor plate and the first protrusion section. The plural control electrodes on the power semiconductor element are formed along the specified side of the second protrusion surface.

摘要翻译： 功率半导体模块包括在一个主表面上形成有多个控制电极的功率半导体元件，通过第一焊料材料连接到功率半导体元件的主表面之一的第一导体板和第二导体板 通过第二焊料材料在功率半导体元件的另一个主表面上接合。 在第一导体板上形成有从可应用的第一导体板的基部突出并且包括形成在上侧的第一突起表面的第一突出部。 第二突起部分，包括形成在与功率半导体元件的主表面相对的一个表面上的第二突起表面。 第一焊料材料插入在功率半导体元件和第一导体板之间，同时避免多个控制电极。 如果通过功率半导体元件的一个主面从垂直方向突出，则第二突起部形成为使得第二突起表面的特定侧的突出部与形成的台阶部的突出部重叠 在第一导体板的基部与第一突起部之间。 功率半导体元件上的多个控制电极沿第二突出面的规定侧形成。

公开(公告)号：US20120300522A1

公开(公告)日：2012-11-29

申请号：US13499520

申请日：2010-08-24

申请人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Toshiya Satoh ,  Hideaki Ishikawa ,  Nobutake Tsuyuno ,  Shigeo Amagi

发明人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Toshiya Satoh ,  Hideaki Ishikawa ,  Nobutake Tsuyuno ,  Shigeo Amagi

IPC分类号： H01L23/52 ,  H02M7/48

CPC分类号： H02M7/003 ,  H01L23/473 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/34 ,  H01L25/072 ,  H01L2224/33 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2224/8484 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K7/1432 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099

摘要： A semiconductor device includes: a case with an opening formed thereat; a semiconductor element housed inside the case; a first conductor plate housed inside the case and positioned at one surface side of the semiconductor element; a second conductor plate housed inside the case and positioned at another surface side of the semiconductor element; a positive bus bar electrically connected to the first conductor plate, through which DC power is supplied; a negative bus bar electrically connected to the second conductor plate, through which DC power is supplied; a first resin member that closes off the opening at the case; and a second resin member that seals the semiconductor element, the first conductor plate and the second conductor plate and is constituted of a material other than a material constituting the first resin member.

摘要翻译： 一种半导体器件包括：形成有开口的壳体; 容纳在壳体内的半导体元件; 容纳在壳体内并位于半导体元件的一个表面侧的第一导体板; 第二导体板，容纳在所述壳体内并且位于所述半导体元件的另一表面侧; 电连接到第一导体板的正母线，通过其提供直流电力; 电连接到第二导体板的负母线，通过其提供直流电力; 封闭壳体上的开口的第一树脂构件; 以及第二树脂构件，其密封半导体元件，第一导体板和第二导体板，并且由构成第一树脂构件的材料以外的材料构成。

公开(公告)号：US20110228479A1

公开(公告)日：2011-09-22

申请号：US13152505

申请日：2011-06-03

申请人： Takeshi TOKUYAMA ,  Kinya NAKATSU ,  Ryuichi SAITO ,  Keisuke HORIUCHI ,  Toshiya SATOH ,  Hideki MIYAZAKI

发明人： Takeshi TOKUYAMA ,  Kinya NAKATSU ,  Ryuichi SAITO ,  Keisuke HORIUCHI ,  Toshiya SATOH ,  Hideki MIYAZAKI

IPC分类号： H05K7/20

CPC分类号： H05K7/20927 ,  B60K6/26 ,  B60K6/28 ,  B60K6/46 ,  B60K17/16 ,  B60L11/1803 ,  B60L15/007 ,  B60L2210/40 ,  B60L2220/14 ,  B60L2240/429 ,  B60Y2200/92 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/473 ,  H01L23/492 ,  H01L23/49517 ,  H01L24/45 ,  H01L25/072 ,  H01L2224/40137 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/1203 ,  H01L2924/13055 ,  H02M7/003 ,  H02M7/537 ,  H02P27/06 ,  H05K1/0262 ,  H05K7/2089 ,  Y10S903/906 ,  Y10S903/907 ,  Y10S903/909 ,  H01L2924/00 ,  H01L2224/45099

摘要： An electric power conversion apparatus includes: a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that comprises an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module comprises a first and a second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further comprises a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

摘要翻译： 电力转换装置包括：形成冷却水通道的通道壳体; 包括逆变器电路的上臂和下臂串联电路的双面冷却半导体模块; 电容器模块; 直流连接器; 和备用电流连接器。 半导体模块包括第一和第二散热金属，其外表面是散热表面，上下臂串联电路紧密地设置在第一散热金属和第二散热金属之间，并且半导体模块还包括 直流正极端子，直流负极端子和突出到外部的交流电流端子。 通道壳体设置有从冷却水入口延伸到冷却水出口的冷却水通道以及通向冷却水通道的第一开口。