公开(公告)号：US20100218986A1

公开(公告)日：2010-09-02

申请号：US12685716

申请日：2010-01-12

申请人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

发明人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

IPC分类号： H05K1/11 ,  B23K31/02

CPC分类号： H05K1/111 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/108 ,  H05K3/3484 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2203/0369 ,  H05K2203/043 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2224/0401

摘要： A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the resists, and forming a wiring having a pad and a conductive circuit thinner than the pad by removing the metal film exposed through the removing of the plating resist, a solder-resist layer on the surface of the board and wiring, in the layer an opening exposing the pad and a portion of the circuit contiguous to the pad, a solder film on the pad and portion of the circuit exposed through the opening, and a solder bump on the pad by solder reflow.

摘要翻译： 一种制造印刷电路板的方法，包括在绝缘板的表面上形成金属膜，在金属膜上形成电镀抗蚀剂，以及在电镀抗蚀剂暴露的金属膜上的镀金属膜，覆盖一部分 具有抗蚀剂的镀金属膜，蚀刻以减少从抗蚀剂暴露的镀金属膜的厚度，去除抗蚀剂，以及通过除去暴露的金属膜，形成具有焊盘和比焊盘更薄的导电电路的布线 通过去除电镀抗蚀剂，在基板和布线的表面上形成阻焊层，在该层中，露出焊盘的开口和与焊盘相邻的电路的一部分，焊盘上的焊料膜和 通过开口暴露的电路，以及通过焊料回流焊盘上的焊料凸块。

公开(公告)号：US20090174081A1

公开(公告)日：2009-07-09

申请号：US12174212

申请日：2008-07-16

申请人： Toru FURUTA

发明人： Toru FURUTA

IPC分类号： H01L23/52

CPC分类号： H05K1/186 ,  H01L23/49838 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3511 ,  H05K1/113 ,  H05K3/4614 ,  H05K3/462 ,  H05K2201/0394 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A combination substrate includes a first substrate having multiple wiring board mounting pads for installing a printed wiring board and multiple connection pads on the opposite side of the wiring board mounting pads, a second substrate having multiple package substrate mounting pads for loading one or more package substrates and multiple connection pads on the opposite side of the package substrate mounting pads, a resin component filling a space between the first substrate and the second substrate, and multiple component loading pads positioned to load an electronic component between the first substrate and the second substrate and formed on one of the first substrate and the second substrate. The connection pads of the second substrate are electrically connected to the connection pads of the first substrate.

摘要翻译： 组合基板包括具有用于安装印刷线路板的多个布线板安装焊盘和在布线板安装焊盘的相对侧上的多个连接焊盘的第一基板，具有用于装载一个或多个封装基板的多个封装基板安装焊盘的第二基板 以及在所述封装衬底安装衬垫的相对侧上的多个连接焊盘，填充所述第一衬底和所述第二衬底之间的空间的树脂部件以及被定位成在所述第一衬底和所述第二衬底之间加载电子部件的多个部件装载垫，以及 形成在第一基板和第二基板中的一个上。 第二基板的连接焊盘电连接到第一基板的连接焊盘。

公开(公告)号：US20090063853A1

公开(公告)日：2009-03-05

申请号：US12198335

申请日：2008-08-26

申请人： Kunihiko KASSAI ,  Toru Furuta

发明人： Kunihiko KASSAI ,  Toru Furuta

IPC分类号： H04L9/00 ,  H04L9/06

CPC分类号： H04L9/0844

摘要： A client PC 10 adapted to be connected to a server apparatus 20 has a first information transmission section that transmits an ID required for authentication by the server apparatus 20 to the server apparatus 20, a second information acquiring section that acquires a master key to be obtained as a result of being authenticated by the server apparatus 20 from the server apparatus 20, a cryptographic key generation section that generates a cryptographic key according to the first information and the second information, an encryption section that encrypts data by means of the cryptographic key and an encrypted data transmission section that transmits the encrypted data encrypted by the encryption section to the server apparatus 20.

摘要翻译： 适于连接到服务器装置20的客户端PC10具有将由服务器装置20进行认证所需的ID发送到服务器装置20的第一信息发送部，获取要获取的主密钥的第二信息获取部 作为由服务器装置20从服务器装置20认证的结果，根据第一信息和第二信息生成密码密钥的加密密钥生成部，通过加密密钥对数据进行加密的加密部，以及 将由加密部加密的加密数据发送到服务器装置20的加密数据发送部。

公开(公告)号：US08592691B2

公开(公告)日：2013-11-26

申请号：US12685731

申请日：2010-01-12

申请人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Akihiro Miyata ,  Fumitaka Takagi

发明人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Akihiro Miyata ,  Fumitaka Takagi

IPC分类号： H05K1/11

CPC分类号： C23F1/02 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K3/108 ,  H05K3/243 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2203/0369 ,  H05K2203/049 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the etching and plating resists, and forming a wiring having a pad for wire-bonding an electrode of an electronic component and a conductive circuit thinner than the pad by removing the metal film exposed after the plating resist is removed, a solder-resist layer on the surface of the board and wiring, an opening in the layer exposing the pad and a portion of the circuit contiguous to the pad, and a metal coating on the pad and portion of the circuit exposed through the opening.

摘要翻译： 一种制造印刷电路板的方法，包括在绝缘板的表面上形成金属膜，在金属膜上形成电镀抗蚀剂，以及在电镀抗蚀剂暴露的金属膜上的镀金属膜，覆盖一部分 具有抗蚀剂的电镀金属膜，蚀刻以减少从抗蚀剂暴露的电镀金属膜的厚度，去除蚀刻和电镀抗蚀剂，以及形成具有用于将电子部件的电极引线接合的焊盘的布线，以及 通过去除在电镀抗蚀剂之后暴露的金属膜而比焊盘更薄的导电电路被去除，在该板和布线的表面上的阻焊层，暴露该焊盘的该层中的一个开口和该电路的一部分与 焊盘和焊盘上的金属涂层以及通过开口露出的电路部分。

公开(公告)号：US20120151764A1

公开(公告)日：2012-06-21

申请号：US13406915

申请日：2012-02-28

申请人： Toru FURUTA ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

发明人： Toru FURUTA ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

IPC分类号： H05K3/02

CPC分类号： H05K1/111 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/108 ,  H05K3/3484 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2203/0369 ,  H05K2203/043 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2224/0401

摘要： A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the resists, and forming a wiring having a pad and a conductive circuit thinner than the pad by removing the metal film exposed through the removing of the plating resist, a solder-resist layer on the surface of the board and wiring, in the layer an opening exposing the pad and a portion of the circuit contiguous to the pad, a solder film on the pad and portion of the circuit exposed through the opening, and a solder bump on the pad by solder reflow.

摘要翻译： 一种制造印刷电路板的方法，包括在绝缘板的表面上形成金属膜，在金属膜上形成电镀抗蚀剂，以及在电镀抗蚀剂暴露的金属膜上的镀金属膜，覆盖一部分 具有抗蚀剂的镀金属膜，蚀刻以减少从抗蚀剂暴露的镀金属膜的厚度，去除抗蚀剂，以及通过除去暴露的金属膜，形成具有焊盘和比焊盘更薄的导电电路的布线 通过去除电镀抗蚀剂，在基板和布线的表面上形成阻焊层，在该层中，露出焊盘的开口和与焊盘相邻的电路的一部分，焊盘上的焊料膜和 通过开口暴露的电路，以及通过焊料回流焊盘上的焊料凸块。

公开(公告)号：US20110095310A1

公开(公告)日：2011-04-28

申请号：US12934533

申请日：2009-03-19

申请人： Satoshi Komatsubara ,  Kenichi Fukuda ,  Shinobu Otao ,  Toru Furuta

发明人： Satoshi Komatsubara ,  Kenichi Fukuda ,  Shinobu Otao ,  Toru Furuta

IPC分类号： H01L33/46

CPC分类号： H01L33/644 ,  F21K9/00 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2105/16 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/483 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/181 ,  H05K1/021 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0323 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Provided are a semiconductor light emitting module and a method of manufacturing the same, which allow achieving high luminance light emission as well as lightweight and compact features. In a semiconductor light emitting module (101), a projecting portion (202) serving as a reflecting member is formed on a metal thin plate (102) to surround a semiconductor light emitting element (104). The semiconductor light emitting element (104) is connected to a printed board (103) by using a wire (201), for example. The projecting portion (202) is formed by pressing and bending the metal thin plate (102) from a back surface, for example, to surround the element and to be higher than the semiconductor light emitting element (104).

摘要翻译： 提供了一种半导体发光模块及其制造方法，其可实现高亮度发光以及轻量且紧凑的特征。 在半导体发光模块（101）中，在金属薄板（102）上形成用作反射部件的突出部（202），以围绕半导体发光元件（104）。 半导体发光元件（104）例如通过使用导线（201）与印刷电路板（103）连接。 突出部（202）通过例如从后表面压入和弯曲金属薄板（102）而形成，以围绕元件并且高于半导体发光元件（104）。

公开(公告)号：US20100306555A1

公开(公告)日：2010-12-02

申请号：US12662585

申请日：2010-04-23

申请人： Tatsuya Sasahara ,  Hideaki Takahashi ,  Toru Furuta ,  Kinya Saito ,  Shinobu Sasaki ,  Daisuke Tomii

发明人： Tatsuya Sasahara ,  Hideaki Takahashi ,  Toru Furuta ,  Kinya Saito ,  Shinobu Sasaki ,  Daisuke Tomii

IPC分类号： G06F12/14 ,  H04L9/30 ,  H04L9/08

CPC分类号： H04L9/321 ,  H04L9/083 ,  H04L2209/38

摘要： A storage apparatus includes a key control part to judge a validity of a data access from a request source based on authorization information received therefrom and authorization information created from an enciphering key included in enciphering key information received from a key management apparatus, and a control part to make the data access to the recording medium using the enciphering key in response to an access request from the request source, if the validity of the data access is confirmed. The authorization information from the request source includes a unique code created from the enciphering key if an authentication is successful in the key management apparatus in response to an authentication request from the request source.

摘要翻译： 存储装置包括：密钥控制部分，用于根据从其接收的授权信息来判断来自请求源的数据访问的有效性，以及从密钥管理装置接收的加密密钥信息中包含的加密密钥创建的授权信息，以及控制部分 如果确认了数据访问的有效性，则使用加密密钥响应于来自请求源的访问请求使数据访问记录介质。 如果在密钥管理装置中响应来自请求源的认证请求成功验证，则来自请求源的授权信息包括从加密密钥创建的唯一代码。

公开(公告)号：US20090140415A1

公开(公告)日：2009-06-04

申请号：US12163150

申请日：2008-06-27

申请人： Toru FURUTA

发明人： Toru FURUTA

IPC分类号： H01L23/485

CPC分类号： H05K3/4614 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K1/113 ,  H05K1/185 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A combination substrate includes a first substrate having wiring board mounting pads for installing a printed wiring board and connection pads on an opposite side of the wiring board mounting pads, a second substrate having package substrate mounting pads for mounting one or more package substrates and having connection pads on an opposite side of the package substrate mounting pads, a middle substrate positioned between the first substrate and the second substrate and including conductive members electrically connecting the connection pads on the first substrate and the connection pads on the second substrate, and a die positioned between the first substrate and the second substrate and mounted on one of the first substrate and the second substrate.

摘要翻译： 组合基板包括具有用于安装印刷线路板的布线板安装焊盘和布线板安装焊盘相对侧上的连接焊盘的第一基板，具有用于安装一个或多个封装基板并具有连接的封装基板安装焊盘的第二基板 位于所述封装衬底安装焊盘的相对侧上的焊盘，位于所述第一衬底和所述第二衬底之间的中间衬底，并且包括电连接所述第一衬底上的连接焊盘和所述第二衬底上的所述连接焊盘的导电构件， 在第一基板和第二基板之间并且安装在第一基板和第二基板中的一个上。

公开(公告)号：US09480156B2

公开(公告)日：2016-10-25

申请号：US13406915

申请日：2012-02-28

申请人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

发明人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

IPC分类号： H05K3/20 ,  H05K1/11 ,  H01L21/48 ,  H01L23/498 ,  H05K3/10 ,  H05K3/34 ,  H05K3/46

CPC分类号： H05K1/111 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/108 ,  H05K3/3484 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2203/0369 ,  H05K2203/043 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2224/0401

摘要： A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the resists, and forming a wiring having a pad and a conductive circuit thinner than the pad by removing the metal film exposed through the removing of the plating resist, a solder-resist layer on the surface of the board and wiring, in the layer an opening exposing the pad and a portion of the circuit contiguous to the pad, a solder film on the pad and portion of the circuit exposed through the opening, and a solder bump on the pad by solder reflow.

摘要翻译： 一种制造印刷电路板的方法，包括在绝缘板的表面上形成金属膜，在金属膜上形成电镀抗蚀剂，以及在电镀抗蚀剂暴露的金属膜上的镀金属膜，覆盖一部分 具有抗蚀剂的镀金属膜，蚀刻以减少从抗蚀剂暴露的镀金属膜的厚度，去除抗蚀剂，以及通过除去暴露的金属膜，形成具有焊盘和比焊盘更薄的导电电路的布线 通过去除电镀抗蚀剂，在基板和布线的表面上形成阻焊层，在该层中，露出焊盘的开口和与焊盘相邻的电路的一部分，焊盘上的焊料膜和 通过开口暴露的电路，以及通过焊料回流焊盘上的焊料凸块。

公开(公告)号：US08589690B2

公开(公告)日：2013-11-19

申请号：US12198335

申请日：2008-08-26

申请人： Kunihiko Kassai ,  Toru Furuta

发明人： Kunihiko Kassai ,  Toru Furuta

IPC分类号： H04L9/00 ,  H04L9/06

CPC分类号： H04L9/0844

摘要： A client PC 10 adapted to be connected to a server apparatus 20 has a first information transmission section that transmits an ID required for authentication by the server apparatus 20 to the server apparatus 20, a second information acquiring section that acquires a master key to be obtained as a result of being authenticated by the server apparatus 20 from the server apparatus 20, a cryptographic key generation section that generates a cryptographic key according to the first information and the second information, an encryption section that encrypts data by means of the cryptographic key and an encrypted data transmission section that transmits the encrypted data encrypted by the encryption section to the server apparatus 20.

摘要翻译： 适于连接到服务器装置20的客户端PC10具有将由服务器装置20进行认证所需的ID发送到服务器装置20的第一信息发送部，获取要获取的主密钥的第二信息获取部 作为由服务器装置20从服务器装置20认证的结果，根据第一信息和第二信息生成密码密钥的加密密钥生成部，通过加密密钥对数据进行加密的加密部，以及 将由加密部加密的加密数据发送到服务器装置20的加密数据发送部。