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    Component Mounting Structure With Flexible Jumper
    11.
    发明申请
    Component Mounting Structure With Flexible Jumper 有权
    组件安装结构，柔性跳线

    公开(公告)号：US20140140021A1

    公开(公告)日：2014-05-22

    申请号：US13679939

    申请日：2012-11-16

    Applicant: APPLE INC.

    Inventor： Shayan Malek ,  Gregory N. Stephens ,  Michael B. Wittenberg

    IPC: H05K1/02

    CPC classification number: H05K1/118 ,  G06F1/1658 ,  H04M1/026 ,  H04R11/02 ,  H04R2499/11 ,  H05K1/0281 ,  H05K1/147 ,  H05K1/189 ,  H05K3/325 ,  H05K3/361 ,  H05K2201/10083 ,  H05K2201/10409 ,  H05K2201/2009

    Abstract: An electronic device contains electrical components. An electrical component is mounted to an electronic device housing using mounting structures. The mounting structures include a flexible printed circuit jumper having opposing ends with metal contact pads. Metal traces in the flexible printed circuit jumper form contact traces within openings in a solder mask layer. Solder in the openings may be used to connect the metal contact pads to the contact traces. A metal bracket may be screwed into the electronic device housing to mount the electrical component to the electronic device housing. The metal bracket may press the metal contact pads on one end of the jumper against mating contact terminals on the electrical component and may press the metal contacts on the other end of the jumper against mating contact pads on an additional printed circuit.

    Abstract translation: 电子设备包含电气元件。 使用安装结构将电气部件安装到电子设备外壳。 安装结构包括具有金属接触垫的相对端的柔性印刷电路跳线。 柔性印刷电路跳线中的金属迹线在焊接掩模层的开口内形成接触迹线。 开口中的焊料可用于将金属接触焊盘连接到接触迹线。 金属支架可以拧入电子装置壳体中，以将电气部件安装到电子装置壳体上。 金属支架可以将跳线一端的金属接触垫压靠在电气部件上的匹配接触端子上，并且可以将跳线另一端上的金属触头压靠在附加印刷电路上的匹配接触垫上。

    Component shielding structures with magnetic shielding
    13.
    发明授权
    Component shielding structures with magnetic shielding 有权

    公开(公告)号：US10225964B2

    公开(公告)日：2019-03-05

    申请号：US15250066

    申请日：2016-08-29

    Applicant: Apple Inc.

    Inventor： James B. Smith ,  Daniel W. Jarvis ,  David A. Pakula ,  Gregory N. Stephens ,  Nicholas G. L. Merz ,  Shayan Malek ,  Sina Bigdeli

    IPC: H05K9/00 ,  H05K1/18 ,  H01L23/552

    Abstract: Electrical components may be shielded using a shielding can or other shielding structure that covers the electrical components. The electrical components and the shielding structure may be mounted on a substrate such as a printed circuit board using solder or other conductive material. The shielding structure may have one or more shielding layers. The shielding layers may include high conductivity material for providing shielding for radio-frequency electromagnetic interference and magnetic material for blocking magnetic flux. Shielding structures may be formed from materials such as ferritic stainless steel, coatings that enhance solderability, corrosion resistance, and conductivity, magnetic materials printed or otherwise formed on metal layers, and other shielding structures.

    Modules for increasing useable space on circuit boards
    15.
    发明授权
    Modules for increasing useable space on circuit boards 有权
    用于增加电路板上可用空间的模块

    公开(公告)号：US09549464B2

    公开(公告)日：2017-01-17

    申请号：US14015938

    申请日：2013-08-30

    Applicant: Apple Inc.

    Inventor： Shayan Malek ,  John B. Ardisana, II ,  Dhaval N. Shah

    IPC: H05K1/02 ,  H05K1/14 ,  H05K3/36 ,  H05K1/11

    CPC classification number: H05K1/0284 ,  H05K1/115 ,  H05K1/141 ,  H05K3/36 ,  H05K2201/09145 ,  H05K2201/10598 ,  H05K2203/061

    Abstract: The described embodiments relate generally to electronic devices and to three dimensional modules for increasing useable space on a circuit board associated therewith. In some embodiments, the modules can have a cuboid geometry, and can include a number of surfaces having embedded circuit traces configured to interconnect electronic components arranged on various surfaces of the module. One of the surfaces of module can include at least one communication interface configured to interconnect the circuit traces on the module to associated circuit paths on a circuit board to which the module is coupled. In some embodiments the module can be operative as a standoff between the circuit board and another component of the electronic device.

    Abstract translation: 所描述的实施例通常涉及电子设备和用于增加与其相关联的电路板上的可用空间的三维模块。 在一些实施例中，模块可以具有长方体几何形状，并且可以包括多个表面，其具有被配置为互连布置在模块的各个表面上的电子部件的嵌入式电路迹线。 模块的一个表面可以包括至少一个通信接口，其被配置为将模块上的电路迹线互连到与模块耦合到的电路板上的相关联的电路路径。 在一些实施例中，该模块可以作为电路板和电子设备的另一个组件之间的间隔来操作。

    Component Protection Structures for Electronic Devices
    17.
    发明申请
    Component Protection Structures for Electronic Devices 有权
    电子元器件保护结构

    公开(公告)号：US20160066438A1

    公开(公告)日：2016-03-03

    申请号：US14801686

    申请日：2015-07-16

    Applicant: Apple Inc.

    Inventor： Shayan Malek ,  David A. Pakula ,  Gregory N. Stephens ,  Sawyer I. Cohen ,  Scott A. Myers ,  Tyler B. Cater ,  Eric W. Bates

    IPC: H05K5/00 ,  H05K1/18 ,  H05K1/11

    CPC classification number: H05K1/181 ,  G06F1/1658 ,  H05K2201/10151 ,  H05K2201/10219 ,  H05K2201/10598 ,  Y02P70/611

    Abstract: An electronic device may have a printed circuit to which electrical components are mounted. The electrical components may include a thermal sensor and a pressure sensor. A through hole in the printed circuit may receive the shaft of a standoff The standoff may be soldered to plated metal on the sides of the through hole. A screw or other fastener may secure the printed circuit to a housing for the electronic device. A ring-shaped metal member may be soldered to the printed circuit. The ring-shaped metal member may form a bumper that surrounds the screw or other fastener and the thermal sensor. The pressure sensor may have a port through which ambient pressure measurements are made. A dust protection cover such as a fabric or other porous layer may cover the port.

    Abstract translation: 电子设备可以具有安装电气部件的印刷电路。 电气部件可以包括热传感器和压力传感器。 印刷电路中的通孔可以接收支架的轴。支座可以焊接到通孔侧面的电镀金属。 螺钉或其他紧固件可将印刷电路固定到电子设备的外壳。 可以将环形金属构件焊接到印刷电路。 环形金属构件可以形成围绕螺钉或其他紧固件和热传感器的保险杠。 压力传感器可以具有通过其进行环境压力测量的端口。 诸如织物或其它多孔层的防尘罩可以覆盖端口。

    INTERNAL COMPONENT ARRANGEMENT WITHIN A HOUSING
    18.
    发明申请
    INTERNAL COMPONENT ARRANGEMENT WITHIN A HOUSING 有权
    内部组件在房屋中的安排

    公开(公告)号：US20160044816A1

    公开(公告)日：2016-02-11

    申请号：US14456943

    申请日：2014-08-11

    Applicant: Apple Inc.

    Inventor： Daniel W. Jarvis ,  Benjamin J. Pope ,  Jason S. Sloey ,  Jonathan C. Denby ,  Ian A. Spraggs ,  Shayan Malek

    IPC: H05K7/02 ,  H01R43/20 ,  H05K7/06

    CPC classification number: H05K7/14 ,  H01H23/04 ,  H01H23/148 ,  H01R43/205 ,  H04M1/026 ,  H04M1/0274 ,  H04M1/0277 ,  H05K7/026 ,  H05K7/06

    Abstract: This application relates to securing and positioning internal components within a housing of a portable computing device. In one embodiment a cowling is utilized to retain a number of board-to-board connectors within communication slots on a printed circuit board (PCB). In another embodiment a number of insert molded retaining members are utilized to prevent outward deformation of sidewalls of the portable computing device during a drop event. In another embodiment, a C-shaped washer having diametrically opposed protrusions is utilized to adjust an alignment of an internal component.

    Abstract translation: 本申请涉及在便携式计算设备的壳体内固定和定位内部部件。 在一个实施例中，使用整流罩将多个板对板连接器保持在印刷电路板（PCB）上的通信槽内。 在另一个实施例中，使用许多插入模制的保持构件来防止在丢弃事件期间便携式计算设备的侧壁向外变形。 在另一个实施例中，使用具有直径相对的突起的C形垫圈来调节内部部件的对准。

    Adjustable antenna structures for adjusting antenna performance in electronic devices
    19.
    发明授权
    Adjustable antenna structures for adjusting antenna performance in electronic devices 有权
    可调节天线结构，用于调整电子设备中的天线性能

    公开(公告)号：US09252481B2

    公开(公告)日：2016-02-02

    申请号：US13706758

    申请日：2012-12-06

    Applicant: Apple Inc.

    Inventor： Shayan Malek ,  John B. Ardisana, II ,  Michael B. Wittenberg

    IPC: H01Q1/24 ,  H01Q7/00 ,  H01Q9/04 ,  H01Q13/10

    CPC classification number: H01Q1/243 ,  H01Q7/00 ,  H01Q9/0421 ,  H01Q9/0442 ,  H01Q13/10 ,  Y10T29/49018

    Abstract: Adjustable antenna structures may be used to compensate for manufacturing variations in electronic device antennas. An electronic device antenna may have an antenna feed and conductive structures such as portions of a peripheral conductive electronic device housing member and other conductive antenna structures. The adjustable antenna structures may have a movable dielectric support. Multiple conductive paths may be formed on the dielectric support. The movable dielectric support may be installed within an electronic device housing so that a selected one of the multiple conductive paths is coupled into use to convey antenna signals. Coupling the selected path into use adjusts the position of an antenna feed terminal for the antenna feed and compensates for manufacturing variations in the conductive antenna structures that could potentially lead to undesired variations in antenna performance.

    Abstract translation: 可调节天线结构可用于补偿电子设备天线的制造变化。 电子设备天线可以具有天线馈电和导电结构，例如外围导电电子器件壳体部件和其它导电天线结构的部分。 可调天线结构可以具有可移动的电介质支撑。 可以在介电支撑件上形成多个导电路径。 可移动介电支撑件可以安装在电子设备壳体内，使得多个导电路径中的所选择的一个被耦合到用于传送天线信号。 将所选择的路径耦合到使用中调整用于天线馈电的天线馈电端子的位置，并且补偿导电天线结构中可能导致天线性能的不期望变化的制造变化。

    FLOATING SWITCH ASSEMBLIES AND METHODS FOR MAKING THE SAME
    20.
    发明申请
    FLOATING SWITCH ASSEMBLIES AND METHODS FOR MAKING THE SAME 审中-公开
    浮动开关组件及其制造方法

    公开(公告)号：US20150255231A1

    公开(公告)日：2015-09-10

    申请号：US14717005

    申请日：2015-05-20

    Applicant: Apple Inc.

    Inventor： Shayan Malek ,  Miguel C. Christophy ,  Andriy Pletenetskyy

    IPC: H01H13/10 ,  H01H13/06 ,  H01H13/14

    CPC classification number: H01H13/10 ,  H01H13/06 ,  H01H13/14 ,  H01H13/20 ,  H01H2001/5816 ,  H01H2207/004 ,  H01H2215/004 ,  H01H2215/006 ,  H01H2223/002 ,  H01H2223/004 ,  H01H2223/03 ,  H01H2223/06 ,  Y10T29/49105

    Abstract: Switch assemblies that mitigate stack up variations and methods of making the same are provided. The stack up variations are mitigated by embodiments that use a floating switch design. The floating switch design may eliminate height variations in the stack up by directly mounting an activation assembly to a support bracket. This ensures that the stack up height of the activation assembly and support bracket remain fixed, independent of a flexible printed circuit board (PCB) that may also be secured to the activation assembly. This way, regardless of the thickness of the flexible PCB and any height variations in solder used to secure the flexible PCB to the activation assembly, the stack up height of the activation assembly and support bracket remains fixed.

    Abstract translation: 提供了减轻堆叠变化的开关组件及其制造方法。 堆叠变化由使用浮动开关设计的实施例减轻。 浮动开关设计可以通过将启动组件直接安装到支撑架上来消除堆叠中的高度变化。 这确保了激活组件和支撑支架的堆叠高度保持固定，而与可以固定到激活组件的柔性印刷电路板（PCB）无关。 这样，无论柔性PCB的厚度和用于将柔性PCB固定到激活组件的焊料的任何高度变化，激活组件和支撑支架的堆叠高度保持固定。

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