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公开(公告)号:US20130093087A1
公开(公告)日:2013-04-18
申请号:US13404408
申请日:2012-02-24
申请人: Ellis Chau , Reynaldo Co , Roseann Alatorre , Philip Damberg , Wei-Shun Wang , Se Young Yang
发明人: Ellis Chau , Reynaldo Co , Roseann Alatorre , Philip Damberg , Wei-Shun Wang , Se Young Yang
IPC分类号: H01L23/498
CPC分类号: H01L24/85 , H01L21/4853 , H01L21/56 , H01L21/565 , H01L23/3114 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L23/49517 , H01L23/49811 , H01L23/49816 , H01L24/06 , H01L24/16 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/05599 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/45565 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/48245 , H01L2224/48247 , H01L2224/48997 , H01L2224/49171 , H01L2224/73204 , H01L2224/73207 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/78301 , H01L2224/851 , H01L2224/8518 , H01L2224/85399 , H01L2224/85951 , H01L2224/85986 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06558 , H01L2225/06562 , H01L2225/06565 , H01L2225/06568 , H01L2225/1023 , H01L2225/1029 , H01L2225/1052 , H01L2225/1058 , H01L2225/1088 , H01L2225/1094 , H01L2924/00011 , H01L2924/00012 , H01L2924/00014 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/12042 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/15331 , H01L2924/1715 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/3511 , H05K3/3436 , H05K2201/10515 , H05K2201/1053 , Y10T29/49149 , Y10T29/49151 , H01L2224/45664 , H01L2924/00 , H01L2924/014 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076
摘要: A microelectronic package can include wire bonds having bases bonded to respective ones of conductive elements exposed at a surface of a substrate. The wire bonds may have exterior edge surfaces disposed at an angle between 25° and 90° relative to the bases, and ends remote, e.g., opposite, from the bases, and remote from the ends which are connected to the bases. A dielectric encapsulation layer extends from the substrate and covers portions of the wire bonds such that covered portions of the wire bonds are separated from one another by the encapsulation layer, wherein unencapsulated portions of the wire bonds are defined by portions of the wire bonds that are uncovered by the encapsulation layer, the unencapsulated portions including the ends of the wire bonds.
摘要翻译: 微电子封装可以包括引线键合,其具有接合到在衬底的表面处暴露的导电元件的相应导电元件的基底。 线接合可以具有相对于基部以25°和90°之间的角度设置的外部边缘表面,并且远离基部远离,例如相反,并且远离连接到基部的端部。 电介质封装层从衬底延伸并覆盖引线接合的部分,使得引线键合的被覆部分通过封装层彼此分开,其中引线键合的未封装部分由引线键的部分限定, 被封装层覆盖的未包封部分包括引线的端部。