公开(公告)号：US20070263411A1

公开(公告)日：2007-11-15

申请号：US11748058

申请日：2007-05-14

申请人： Franz Schellhorn ,  Gunter Kirchberger ,  Gunter Waitl ,  Herbert Brunner ,  Bernhard Bachl

发明人： Franz Schellhorn ,  Gunter Kirchberger ,  Gunter Waitl ,  Herbert Brunner ,  Bernhard Bachl

IPC分类号： F21V8/00 ,  G02B5/02

CPC分类号： G02B6/0018 ,  G02B6/00 ,  G02B6/0001 ,  G02B6/0043 ,  G02B6/0068 ,  G02B6/4298 ,  G02F1/133615 ,  G09F9/35

摘要： A light source element is employed back-lighting of liquid crystal displays and that comprises an obliquely placed light exit face and/or light entry face. At its surfaces, the light waveguide is surrounded by reflectors into which suitable aperture regions are potentially formed. A plurality of light sources and/or a more direct view is provided and, thus, a corresponding increase of the luminance results. A method is also provided for the manufacture of a light source element with an integrated reflector.

摘要翻译： 光源元件采用液晶显示器的背光，并且包括倾斜放置的光出射面和/或光入射面。 在其表面处，光波导被反射器包围，其中可能形成适当的孔径区域。 提供了多个光源和/或更直观的视图，并因此提供亮度结果的相应增加。 还提供了一种用于制造具有集成反射器的光源元件的方法。

公开(公告)号：US20050242355A1

公开(公告)日：2005-11-03

申请号：US11119403

申请日：2005-04-29

申请人： Ewald Karl Guenther ,  Gunter Waitl ,  Herbert Brunner ,  Jorg Strauss

发明人： Ewald Karl Guenther ,  Gunter Waitl ,  Herbert Brunner ,  Jorg Strauss

IPC分类号： H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  H01L21/00 ,  H01L27/15 ,  H01L29/26 ,  H01L31/12 ,  H01L33/00 ,  H01L29/16

CPC分类号： H01L33/56 ,  H01L25/0753 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention concerns an LED arrangement with at least one LED chip (11) comprising a radiation decoupling surface (12) through which the bulk of the electromagnetic radiation generated in the LED chip (11) is decoupled. Arranged on the radiation decoupling surface (12) is at least one phosphor layer (13) for converting the electromagnetic radiation generated in the LED chip. A housing (17) envelops portions of the LED chip (11) and the phosphor layer (13).

摘要翻译： 本发明涉及一种具有至少一个LED芯片（11）的LED装置，该LED芯片（11）包括辐射去耦表面（12），在LED芯片（11）中产生的大部分电磁辐射通过该去耦合表面被去耦合。 布置在辐射去耦表面（12）上的是用于转换在LED芯片中产生的电磁辐射的至少一个磷光体层（13）。 壳体（17）包围LED芯片（11）的部分和荧光体层（13）。

公开(公告)号：US20070166853A1

公开(公告)日：2007-07-19

申请号：US11686525

申请日：2007-03-15

申请人： Ewald Guenther ,  Gunter Waitl ,  Herbert Brunner ,  Jorg Strauss

发明人： Ewald Guenther ,  Gunter Waitl ,  Herbert Brunner ,  Jorg Strauss

IPC分类号： H01L21/52

CPC分类号： H01L33/56 ,  H01L25/0753 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention concerns an LED arrangement with at least one LED chip comprising a radiation decoupling surface through which the bulk of the electromagnetic radiation generated in the LED chip is decoupled. Arranged on the radiation decoupling surface is at least one phosphor layer for converting the electromagnetic radiation generated in the LED chip. A housing envelops portions of the LED chip and the phosphor layer.

摘要翻译： 本发明涉及一种具有至少一个LED芯片的LED装置，其包括辐射去耦表面，通过该辐射去耦表面在LED芯片中产生的大部分电磁辐射被去耦合。 布置在辐射去耦表面上的是用于转换在LED芯片中产生的电磁辐射的至少一个磷光体层。 壳体包围LED芯片和荧光体层的部分。

公开(公告)号：US20060022212A1

公开(公告)日：2006-02-02

申请号：US11202424

申请日：2005-08-11

申请人： Gunter Waitl ,  Robert Lutz ,  Herbert Brunner

发明人： Gunter Waitl ,  Robert Lutz ,  Herbert Brunner

IPC分类号： H01L33/00 ,  H01L31/0232

CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A method for producing a surface mounting optoelectronic component comprises the following steps: readying a base body with the optoelectronic transmitter and/or receiver arranged in a recess of the base body, filling the recess of the base body with a transparent, curable casting compound, and placing the optical device onto the base body, whereby the optical device comes into contact with the casting compound.

摘要翻译： 一种用于制造表面安装光电子部件的方法包括以下步骤：利用布置在基体的凹部中的光电发射器和/或接收器准备基体，用透明的可固化铸塑料填充基体的凹部， 并将光学装置放置在基体上，由此光学装置与铸塑料接触。

公开(公告)号：US5999552A

公开(公告)日：1999-12-07

申请号：US9606

申请日：1998-01-20

申请人： Georg Bogner ,  Herbert Brunner ,  Heinz Haas ,  Johann Luft ,  Ernst Nirschl ,  Werner Spaeth ,  Norbert Stath ,  Wolfgang Teich

发明人： Georg Bogner ,  Herbert Brunner ,  Heinz Haas ,  Johann Luft ,  Ernst Nirschl ,  Werner Spaeth ,  Norbert Stath ,  Wolfgang Teich

IPC分类号： H01L33/56 ,  H01S3/00 ,  H01S5/00 ,  H01S5/022 ,  H01S3/18 ,  H01L33/00

CPC分类号： H01S5/02244 ,  H01S5/02228 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L33/56

摘要： A radiation emitter component, in particular an infrared emitter component with a conventional light-emitting diode housing, includes two electrode connections, one of which has a well-shaped reflector. The housing has an optically transparent, electrically non-conducting encapsulation material. A semiconductor laser chip is fastened in a well-shaped reflector of the light-emitting diode housing. The semiconductor laser chip has a quantum well structure, in particular with a strained layer structure, for example MOVPE epitaxial layers with a layer sequence GaAlAs-InGaAs-GaAlAs. A diffusor material can be inserted into the optically transparent, electrically non-conducting material of the light-emitting diode housing. The diffusor material is constructed or inserted with regard to type and concentration in such a way that in connection with the semiconductor laser chip encapsulated in the light-emitting diode housing, a radiation characteristic curve or an increase of an effective emission surface is produced that is comparable to that of a conventional infrared light-emitting diode.

摘要翻译： 辐射发射器部件，特别是具有传统发光二极管外壳的红外发射器部件包括两个电极连接件，其中之一具有良好形状的反射器。 壳体具有光学透明的非导电封装材料。 将半导体激光芯片紧固在发光二极管壳体的形状好的反射器中。 半导体激光芯片具有量子阱结构，特别是具有应变层结构，例如具有层序列GaAlAs-InGaAs-GaAlAs的MOVPE外延层。 漫射材料可以插入到发光二极管外壳的光学透明的非导电材料中。 关于类型和浓度来构造或插入扩散材料，使得与封装在发光二极管外壳中的半导体激光器芯片有关，产生辐射特性曲线或有效发射表面的增加，即， 与传统的红外发光二极管相当。

公开(公告)号：USRE37554E1

公开(公告)日：2002-02-19

申请号：US09776462

申请日：2000-10-25

申请人： Herbert Brunner ,  Heinz Haas ,  Günter Waitl

发明人： Herbert Brunner ,  Heinz Haas ,  Günter Waitl

IPC分类号： H01L2144

CPC分类号： H01L33/483 ,  H01L31/0203 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/48091 ,  H01L2924/00014

摘要： The optoelectronic semiconductor component has an optoelectronic semiconductor chip disposed on a chip carrier with an approximately planar chip carrier surface. The semiconductor chip is fastened with predetermined alignment of its optical axis. A plastic base part supports the chip carrier. The semiconductor chip is electrically conductively connected to at least two electrode terminals routed through the base part, and a lens is disposed above the semiconductor chip on top of the base part. The lens is formed with an independently configured cap produced from plastic material. The cap is mechanically form-locked to a support of the base part. When the cap is placed onto the base part, a holder of the cap and the support engage with one another. The holder and the support are configured such that when the cap is placed onto the base part, the two parts are automatically positioned with respect to one another in such a way that the optical axes of the lens and of the semiconductor chip coincide.

摘要翻译： 光电子半导体部件具有设置在具有大致平坦的芯片载体表面的芯片载体上的光电子半导体芯片。 半导体芯片以其光轴的预定对准被紧固。 塑料底座部分支撑芯片载体。 半导体芯片导电地连接到穿过基底部分的至少两个电极端子，并且在半导体芯片的上方设置透镜，在基部的顶部。 透镜形成有由塑料材料制成的独立构造的盖。 盖被机械地锁定到基部的支撑件上。 当盖子放置在基座部分上时，帽子和支架的支架彼此接合。 保持器和支撑件被构造成使得当帽被放置在基部上时，两个部分相对于彼此自动定位，使得透镜和半导体芯片的光轴重合。

公开(公告)号：US20140034983A1

公开(公告)日：2014-02-06

申请号：US13982225

申请日：2011-12-21

申请人： Tobias Gebuhr ,  Hans-Christoph Gallmeier ,  Herbert Brunner ,  Kirstin Petersen

发明人： Tobias Gebuhr ,  Hans-Christoph Gallmeier ,  Herbert Brunner ,  Kirstin Petersen

IPC分类号： H01L33/60 ,  H01L33/50

CPC分类号： H01L33/60 ,  H01L33/50 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/24 ,  H01L2933/005 ,  H01L2933/0066

摘要： A method for manufacturing at least one optoelectronic semiconductor device includes providing a substrate and applying a number of optoelectronic semiconductor chips, which are arranged spaced apart from one another in a lateral direction, on an upper face of the substrate. At least one reflective coating is applied to the exposed areas of the substrate and the lateral surfaces of the optoelectronic semiconductor chips. Openings are introduced into the reflective coating, which completely penetrate the reflective coating. Electrically conductive material is arranged on the reflective coating and at least on some parts of the openings. Radiation penetration surfaces of the optoelectronic semiconductor chips are free of the reflective coating and the reflective coating does not laterally extend beyond the optoelectronic semiconductor chips.

摘要翻译： 一种用于制造至少一个光电子半导体器件的方法包括：在衬底的上表面上提供衬底和施加多个在横向彼此间隔开的光电子半导体芯片。 至少一个反射涂层施加到基板的暴露区域和光电子半导体芯片的侧表面。 开口被引入到完全穿透反射涂层的反射涂层中。 导电材料布置在反射涂层上并且至少在开口的某些部分上。 光电子半导体芯片的辐射穿透表面没有反射涂层，反射涂层不横向延伸超过光电子半导体芯片。

公开(公告)号：US08435806B2

公开(公告)日：2013-05-07

申请号：US12595887

申请日：2008-04-14

申请人： Harald Jaeger ,  Herbert Brunner ,  Albert Schneider ,  Thomas Zeiler

发明人： Harald Jaeger ,  Herbert Brunner ,  Albert Schneider ,  Thomas Zeiler

IPC分类号： H01L21/00

CPC分类号： B29C45/14655 ,  B29C33/0038 ,  B29C33/10 ,  B29C43/18 ,  B29C2045/14098 ,  B29C2045/14663 ,  B29C2045/14934 ,  B29K2083/00 ,  H01L21/565 ,  H01L24/97 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method is disclosed for the manufacture of an optoelectronic component. A substrate has a first primary face and a second primary face that lies opposite the first primary face. A semiconductor body that is capable of emitting electromagnetic radiation from a front side is attached to the first primary face of the substrate. A covering that is transparent to the radiation from the optoelectronic semiconductor body is applied to at least the front side of the semiconductor body. The covering is given the form of an optical element by using a closed cavity that is shaped with the contour of the optical element.

摘要翻译： 公开了用于制造光电子部件的方法。 基板具有与第一主面相对的第一主面和第二主面。 能够从前侧发射电磁辐射的半导体本体被安装在基板的第一主面上。 至少对半导体本体的前侧施加对来自光电半导体本体的辐射透明的覆盖物。 通过使用与光学元件的轮廓成形的封闭空腔，将覆盖物赋予光学元件的形式。

公开(公告)号：US20120248492A1

公开(公告)日：2012-10-04

申请号：US13499622

申请日：2010-08-31

申请人： Klaus Müller ,  Günter Spath ,  Siegfried Herrmann ,  Ewald Karl Michael Günther ,  Herbert Brunner

发明人： Klaus Müller ,  Günter Spath ,  Siegfried Herrmann ,  Ewald Karl Michael Günther ,  Herbert Brunner

IPC分类号： H01L33/62 ,  H01L33/52 ,  H01L31/18 ,  H01L31/0203

CPC分类号： H01L31/0224 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/0079 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/4554

摘要： The invention relates to an optoelectronic component, having —a carrier (1) comprising a first main surface (Ia), —at least one optoelectronic semiconductor chip (2) having no substrate, and —a contact metallization (3a, 3b), wherein —the carrier (1) is electrically insulating, —the at least one optoelectronic semiconductor chip (2) is fastened to the first main surface (Ia) of the carrier (1) by means of a bonding material (4), particularly a solder material, —the contact metallization (3a, 3b) covers at least one area of the first main surface (Ia) free of the optoelectronic semiconductor chip (2), and —the contact metallization (3a, 3b) is electrically conductively connected to the optoelectronic semiconductor chip (2).

摘要翻译： 本发明涉及一种具有载体（1）的光电子部件，载体（1）包括第一主表面（Ia）， - 至少一个不具有基板的光电子半导体芯片（2）和 - 接触金属化（3a，3b），其中 - 载体（1）是电绝缘的， - 至少一个光电子半导体芯片（2）通过接合材料（4）紧固到载体（1）的第一主表面（1a），特别是焊料 材料， - 接触金属化（3a，3b）覆盖不含光电子半导体芯片（2）的第一主表面（1a）的至少一个区域，并且接触金属化层（3a，3b）导电地连接到 光电半导体芯片（2）。

公开(公告)号：US20110266571A1

公开(公告)日：2011-11-03

申请号：US12995181

申请日：2009-04-20

申请人： Thomas Zeiler ,  Reiner Windisch ,  Stefan Gruber ,  Markus Kirsch ,  Julius Muschaweck ,  Torsten Baade ,  Herbert Brunner ,  Steffen Köhler

发明人： Thomas Zeiler ,  Reiner Windisch ,  Stefan Gruber ,  Markus Kirsch ,  Julius Muschaweck ,  Torsten Baade ,  Herbert Brunner ,  Steffen Köhler

IPC分类号： H01L33/58 ,  H01L31/0232

CPC分类号： H01L33/54 ,  H01L25/042 ,  H01L25/0753 ,  H01L33/38 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00

摘要： According to at least one embodiment of the semiconductor arrangement, the latter comprises a mounting side, at least one optoelectronic semiconductor chip with mutually opposing chip top and bottom, and at least one at least partially radiation-transmissive body with a body bottom, on which the semiconductor chip is mounted such that the chip top faces the body bottom. Moreover, the semiconductor arrangement comprises at least two electrical connection points for electrical contacting of the optoelectronic semiconductor chip, wherein the connection points do not project laterally beyond the body and with their side remote from the semiconductor chip delimit the semiconductor arrangement on the mounting side thereof.

摘要翻译： 根据半导体布置的至少一个实施例，后者包括安装侧，至少一个具有相对的芯片顶部和底部的光电子半导体芯片以及至少一个具有主体底部的至少部分辐射透射主体， 安装半导体芯片使得芯片顶部面向主体底部。 此外，半导体装置包括用于光电子半导体芯片的电接触的至少两个电连接点，其中连接点不侧向突出超过本体并且其远离半导体芯片的一侧限定其安装侧上的半导体布置 。